Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2003
07/10/2003US20030127712 Semiconductor device
07/10/2003US20030127711 Lead frame, method for manufacturing the same, resin-encapsulated semiconductor device and method for manufacturing the same
07/10/2003US20030127709 Semiconductor device and production process
07/10/2003US20030127708 Memory device with composite contact plug and method for manufacturing the same
07/10/2003US20030127707 Bipolar transistor and method of manufacturing the same
07/10/2003US20030127705 Semiconductor memory device having resistor and method of fabricating the same
07/10/2003US20030127703 Semiconductor device and method of manufacturing the same
07/10/2003US20030127702 Semiconductor containing channel barriers; prevent surface leakage
07/10/2003US20030127701 Semiconductor electronic device and method of manufacturing thereof
07/10/2003US20030127697 Semiconductor device
07/10/2003US20030127696 Semiconductor device having contact of Si-Ge combined with cobalt silicide
07/10/2003US20030127694 Higher voltage transistors for sub micron CMOS processes
07/10/2003US20030127693 Edge termination for silicon power devices
07/10/2003US20030127692 Strongly textured atomic ridge and dot MOSFETs, sensors and filters
07/10/2003US20030127690 Fin-based double poly dynamic threshold CMOS FET with spacer gate and method of fabrication
07/10/2003US20030127689 High voltage MOS transistor with up-retro well
07/10/2003US20030127688 Field effect transistor and method of its manufacture
07/10/2003US20030127687 Semiconductor device
07/10/2003US20030127686 Symmetric inducting device for an integrated circuit having a ground shield
07/10/2003US20030127685 Semiconductor device and manufacturing method thereof
07/10/2003US20030127684 Split-gate type nonvolatile memory devices and methods for fabricating the same
07/10/2003US20030127683 Nonvolatile memory devices and methods for fabricating the same
07/10/2003US20030127682 Non-volatile memory device having improved coupling ratio uniformity
07/10/2003US20030127681 Nonvolatile semiconductor memory device
07/10/2003US20030127680 Uniform electrical potentials; transferring charges; control electrodes, dielectrics
07/10/2003US20030127679 Semiconductor storage device and method of manufacturing the same
07/10/2003US20030127678 Semiconductor device
07/10/2003US20030127677 Semiconductor device having a self-aligned contact structure and methods of forming the same
07/10/2003US20030127674 Conductively doped strontium titanate barrier intermediate a silicon underlayer and an epitaxial metal oxide film
07/10/2003US20030127671 Semiconductor device having align key for defining active region and method for manufacturing the same
07/10/2003US20030127665 Poly-silicon thin film transistor and method for fabricating thereof
07/10/2003US20030127664 Method for forming conductors in semiconductor devices
07/10/2003US20030127663 Semiconductor integrated circuit device and a method of manufacturing the same
07/10/2003US20030127654 Semiconductor component which emits radiation, and method for producing the same
07/10/2003US20030127653 Thin film transistors
07/10/2003US20030127652 Active matrix organic electroluminescent display device and fabricating method thereof
07/10/2003US20030127651 Light emitting device and method of manufacturing the same
07/10/2003US20030127650 Active matrix organic electroluminescent display device and fabricating method thereof
07/10/2003US20030127649 Array substrate for a liquid crystal display device having an improved contact property and fabricating method thereof
07/10/2003US20030127648 Semiconductor device and method for producing it
07/10/2003US20030127646 Method for fabrication of relaxed SiGe buffer layers on silicon-on-insulators and structures containing the same
07/10/2003US20030127645 Semiconductor devices and their manufacture
07/10/2003US20030127644 III-nitride light emitting diode
07/10/2003US20030127641 Method for fabricating a metal-oxide electron tunneling device for solar energy conversion
07/10/2003US20030127640 Multilayer semiconductors; substrate overcoated by dielectric and silicide
07/10/2003US20030127607 Lithographic apparatus, device manufacturing method, device manufactured thereby, and computer program
07/10/2003US20030127606 Ion implanting apparatus and ion implanting method
07/10/2003US20030127605 Substrate holding unit, exposure apparatus, and device manufacturing method
07/10/2003US20030127601 Method and apparatus for determining two dimensional doping profiles with SIMS
07/10/2003US20030127593 Apparatus and method for wafer pattern inspection
07/10/2003US20030127589 Self contained sensing apparatus and system
07/10/2003US20030127501 Apparatus and method of placing solder balls onto a substrate
07/10/2003US20030127499 Low or no-force bump flattening structure and method
07/10/2003US20030127435 Laser annealing apparatus to control the amount of oxygen incorporated into polycrystalline silicon films
07/10/2003US20030127434 Apparatus and method for laser welding of ribbons
07/10/2003US20030127428 Method for separating chips from diamond wafer
07/10/2003US20030127427 Method of increasing the etch selectivity of a contact sidewall to a preclean etchant
07/10/2003US20030127426 Method for pitch reduction
07/10/2003US20030127425 System and method for etching resin with an ozone wet etching process
07/10/2003US20030127423 Method for reconstructing an integrated circuit package using lapping
07/10/2003US20030127422 Method of high selectivity sac etching
07/10/2003US20030127337 Apparatus and methods for electrochemical processing of microelectronic workpieces
07/10/2003US20030127336 Methods of and apparatus for making high aspect ratio microelectromechanical structures
07/10/2003US20030127322 Sputtering apparatus and magnetron unit
07/10/2003US20030127320 Apparatus for electrochemically depositing a material onto a workpiece surface
07/10/2003US20030127246 Contactor for testing miniaturized devices and components
07/10/2003US20030127188 Semiconductor device manufacturing system for etching a semiconductor by plasma discharge
07/10/2003US20030127182 Apparatus and methods for coverlay removal and adhesive application
07/10/2003US20030127118 Cleaning gas
07/10/2003US20030127117 Prevent the wafers from being contaminated due to the reaction of treatment liquids
07/10/2003US20030127116 Resist stripping method and apparatus
07/10/2003US20030127114 Cleaning quartz thermocouple sleeves in low pressure (lp) furnaces
07/10/2003US20030127107 Apparatus and method for removing coating layers from alignment marks
07/10/2003US20030127052 Liquid delivery system having safe unit and operating method thereof
07/10/2003US20030127050 Partition wall with apertures for dividing a chamber into a first space for the substrate and a second space for a source gas
07/10/2003US20030127043 Reacting pulses of a tungsten-containing precursor and a reducing gas
07/10/2003US20030127041 Lapping, mechanical polishing, and reducing internal stress of a gallium, aluminum and indium nitride wafer by thermal annealing or chemical etching; crystallographic plane surfaces
07/10/2003US20030127007 Nano-imprinting method, magnetic printing method and recording medium
07/10/2003US20030127002 Multilayer architechture for microcontact printing stamps
07/10/2003US20030126872 Etching apparatus
07/10/2003US20030126742 Method of fabrication of ZnO nanowires
07/10/2003US20030126741 Method for deconstructing an integrated ciruit package using lapping
07/10/2003DE10213879C1 Electronic component has semiconductor chips fitted into respective recesses in surface of electronic circuit board
07/10/2003DE10156465C1 Bonded assembly of two wafers is formed using wafer recessed to make penetrations, and results in highly temperature-stable, detachable connection
07/10/2003DE10153187C1 Herstellungsverfahren zum Herstellen einer räumlichen Struktur in einem Halbleitersubstrat und Halbleitersubstrat mit einer Einrichtung zum Ätzen einer räumlichen Struktur in dem Halbleitersubstrat Manufacturing method for manufacturing a three-dimensional structure in a semiconductor substrate and the semiconductor substrate with a device for etching a three-dimensional structure in the semiconductor substrate
07/09/2003EP1326344A2 Universal logic module and ASIC using the same
07/09/2003EP1326289A2 Semiconductor integrated circuit and its manufacturing method
07/09/2003EP1326288A2 Semiconductor integrated circuit and its manufacturing method
07/09/2003EP1326283A2 Schottky gate field effect transistor
07/09/2003EP1326282A2 Thin film transistor with multiple gates
07/09/2003EP1326281A1 Transistor and display comprising it
07/09/2003EP1326280A1 Channel gate type field effect transistor and its manufacturing method
07/09/2003EP1326279A2 Thin-film transistor used as heating element for microreaction chamber
07/09/2003EP1326277A2 Semiconductor device and method of manufacturing the same
07/09/2003EP1326276A2 Interconnection structure in semiconductor device
07/09/2003EP1326274A2 System for improving thermal stability of copper damascene structure
07/09/2003EP1326273A2 Semiconductor device and semiconductor device producing system
07/09/2003EP1326272A1 Process for manufacturing SOI structures
07/09/2003EP1326271A1 Method for film formation of gate insulator, apparatus for film formation of gate insulator, and cluster tool
07/09/2003EP1326270A1 Silicon wafer and silicon epitaxial wafer and production methods therefor
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