Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2003
07/24/2003US20030137875 Non-volatile semiconductor memory device
07/24/2003US20030137872 Semiconductor memory device and storage method thereof
07/24/2003US20030137870 Magnetic memory
07/24/2003US20030137868 Magneto-resistive device having soft reference layer
07/24/2003US20030137867 Junction-isolated depletion mode ferroelectric memory devices
07/24/2003US20030137866 Ferroelectric nonvolatile semi-conductor memory, and its driving method
07/24/2003US20030137865 Non-volatile passive matrix device and method for readout of the same
07/24/2003US20030137789 Low voltage breakdown element for ESD trigger device
07/24/2003US20030137745 Projection optical system
07/24/2003US20030137733 Objective with lenses made of a crystalline material
07/24/2003US20030137665 Pattern test device
07/24/2003US20030137643 Lithographic apparatus and device manufacturing method
07/24/2003US20030137631 Liquid crystal display device
07/24/2003US20030137613 Electrooptic device, liquid crystal device, and projection display device
07/24/2003US20030137482 Shift register circuit, driving circuit of display device and display device using the driving circuit
07/24/2003US20030137340 Semiconductor integrated circuit and a burn-in method thereof
07/24/2003US20030137337 Semiconductor integrated circuit and a burn-in method thereof
07/24/2003US20030137321 Logic circuit whose power switch is quickly turned on and off
07/24/2003US20030137316 Microcontactor probe and electric probe unit
07/24/2003US20030137314 Annular illumination method for charged particle projection optics
07/24/2003US20030137250 Segmented electrode apparatus and method for plasma processing
07/24/2003US20030137151 Wafer carrier door and latching mechanism with c-shaped cam follower
07/24/2003US20030137080 Flip chip underfill system and method
07/24/2003US20030137063 Scalable two transistor memory device
07/24/2003US20030137062 Use of nitrides for flip-chip encapsulation
07/24/2003US20030137060 Two-stage transfer molding method to encapsulate MMC module
07/24/2003US20030137058 High density area array solder microjoining interconnect structure and fabrication method
07/24/2003US20030137057 Multilayer thin film wirings formed on front and back surfaces of metal/alloy, then cut to expose inner electrode pads on which chips are mounted
07/24/2003US20030137055 Semiconductor processing methods, and semiconductor constructions
07/24/2003US20030137054 Semiconductor device and method of fabricating the same
07/24/2003US20030137053 Wiring structure and manufacturing method therefor, semiconductor device including wiring structure and wiring board
07/24/2003US20030137052 Chemical mechanical polishing for flattening dielectric surfaces of films, followed by cleaning and rinsing; corrosion resistance
07/24/2003US20030137051 Semiconductor device and a method of producing the same
07/24/2003US20030137050 Enhancement of an interconnect
07/24/2003US20030137049 Semiconductor device
07/24/2003US20030137046 Semiconductor device, method of fabricating the same, and printing mask
07/24/2003US20030137045 Circuit component built-in module and method of manufacturing the same
07/24/2003US20030137044 Semiconductor device and packaging system therefore
07/24/2003US20030137043 Polybenzoxazine based wafer-level underfill material
07/24/2003US20030137038 Grounding of package substrates
07/24/2003US20030137036 Semiconductor package device and method
07/24/2003US20030137035 For ball grid arrays; cleanliness is determined by color variation; improved adhesion of bonding wires and encapsulants
07/24/2003US20030137034 Semiconductor device and method of manufacturing the same
07/24/2003US20030137033 Semiconductor packages and methods for manufacturing such semiconductor packages
07/24/2003US20030137028 Semiconductor integrated circuit device and method of manufacturing the same
07/24/2003US20030137025 Multi-layered gate for a CMOS imager
07/24/2003US20030137024 Mask and production method therefor and production method for semiconductor device
07/24/2003US20030137019 Lanthanum Oxide-Based Dielectrics for Integrated Circuit Capacitors
07/24/2003US20030137018 Article comprising an oxide layer on a GaAs-based semiconductor structure and method of forming same
07/24/2003US20030137017 Semiconductor integrated circuit device and method of manufacturing thereof
07/24/2003US20030137014 Semiconductor integrated circuit device and method of manufacturing the same
07/24/2003US20030137013 Isolation structure and method for semiconductor device
07/24/2003US20030137012 Semiconductor devices and their fabrication methods
07/24/2003US20030137011 Semiconductor memory device with miniaturization improvement
07/24/2003US20030137010 Semiconductor construction with buried island region and contact region
07/24/2003US20030137009 Protection structure against electrostatic discharges (ESD) for an electronic device integrated on a SOI substrate, and corresponding integration process
07/24/2003US20030137008 Solid state imaging device having a photodiode and a MOSFET and method of manufacturing the same
07/24/2003US20030137007 Flash memory device and fabrication process thereof, method of forming a dielectric film
07/24/2003US20030137006 Low voltage programmable and erasable Flash EEPROM
07/24/2003US20030137004 Floating gate transistors and methods of forming floating gate transistors
07/24/2003US20030137003 Floating gate transistor
07/24/2003US20030137002 Split gate flash memory cell structure and method of manufacturing the same
07/24/2003US20030137001 Low voltage programmable and erasable Flash EEPROM
07/24/2003US20030137000 Flash memory with virtual ground scheme
07/24/2003US20030136999 Drive transistor with dielectric gate electrode, isolated by silicon dioxide barrier; print heads/cartridges
07/24/2003US20030136998 Capacitor and method for fabricating the same
07/24/2003US20030136997 Thin film capacitor and method of manufacturing the same
07/24/2003US20030136996 Stacked capacitor for a semiconductor device and a method of fabricating the same
07/24/2003US20030136995 Forming trench capacitor in semiconductor substrate, forming self-structured mask on interior surface of trench, etching to form an array of silicon pillars
07/24/2003US20030136994 Method for producing a cavity in a monocrystalline silicon substrate and a semiconductor component having a cavity in a monocrystalline silicon substrate with an epitaxial covering layer
07/24/2003US20030136993 Grinding back-side of semiconductor substrate, milling trench in back-side of substrate, exposing vertical trench fill, depositing conductive material, wherein conductive material shorts vertical trench fill to a buried plate
07/24/2003US20030136992 Multi-terminal MOS varactor
07/24/2003US20030136990 Integrated circuit configuration having a structure for reducing a minority charge carrier current
07/24/2003US20030136989 Integrated capacitive device with hydrogen degradable dielectric layer protected by getter layer
07/24/2003US20030136988 Reduction of damage in semiconductor container capacitors
07/24/2003US20030136987 Non-volatile semiconductor storage device having conductive layer surrounding floating gate
07/24/2003US20030136986 Transition metal doped ferromagnetic III-V nitride material films and methods of fabricating the same
07/24/2003US20030136985 Field effect transistor structure with partially isolated source/drain junctions and methods of making same
07/24/2003US20030136984 Semiconductor device
07/24/2003US20030136979 Bonding pad structure of a semiconductor device and method for manufacturing the same
07/24/2003US20030136978 Semiconductor memory device using vertical-channel transistors
07/24/2003US20030136977 Semiconductor integrated circuit
07/24/2003US20030136975 Ion-implanting carbon, into one of the following regions of the device: the collector region, the sub-collector region, the extrinsic base regions, and the collector-base junction region
07/24/2003US20030136974 Thick buffer region design to improve IGBT self-clamped inductive switching (SCIS) energy density and device manufacturability
07/24/2003US20030136971 Thin film transistor array panel for display and manufacturing method thereof
07/24/2003US20030136968 Semiconductor package having light sensitive chips
07/24/2003US20030136964 Thin film transistors using solution processed pentacene precursor as organic semiconductor
07/24/2003US20030136963 Self-aligned triple gate silicon-on-insulator (SOI) device
07/24/2003US20030136961 Ideal oxygen precipitating silicon wafers with nitrogen/carbon stabilized oxygen precipitate nucleation centers and process for making the same
07/24/2003US20030136956 Heterojunction bipolar transistor and semiconductor integrated circuit device using the same
07/24/2003US20030136923 Method and apparatus for cooling power supply wires used to drive stages in electron beam lithography machines
07/24/2003US20030136922 Projection-exposure methods and apparatus exhibiting increased throughput
07/24/2003US20030136814 High density raised stud microjoining system and methods of fabricating the same
07/24/2003US20030136813 Temporary device attach structure for test and burn in of microjoint interconnects and method for fabricating the same
07/24/2003US20030136776 Ceramic heater
07/24/2003US20030136772 Laser apparatus, laser irradiation method, manufacturing method for semiconductor device, semiconductor device, production system for semiconductor device using the laser apparatus, and electronic equipment
07/24/2003US20030136766 MERIE plasma reactor with overhead RF electrode tuned to the plasma with arcing suppression
07/24/2003US20030136763 Processing solution preparation and supply method and apparatus
07/24/2003US20030136762 Method for in-line monitoring of via/contact holes etch process based on test structures in semiconductor wafer manufacturing
07/24/2003US20030136761 Via hole defining process performed in one chamber
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