Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2003
07/31/2003US20030141505 Semiconductor device and method of manufacturing the same
07/31/2003US20030141504 Semiconductor device and manufacturing method thereof
07/31/2003US20030141503 Polycrystalline silicon thin film for a thin film transistor and display device using the same
07/31/2003US20030141502 Method of epitaxial-like wafer bonding at low temperature and bonded structure
07/31/2003US20030141501 Semiconductor integrated circuit device
07/31/2003US20030141499 Having variable dielectric constant through the thickness of the material
07/31/2003US20030141498 Electronic devices containing organic semiconductor materials
07/31/2003US20030141465 Semiconductor wafer carrier mapping sensor
07/31/2003US20030141461 Simplified reticle stage removal system for an electron beam system
07/31/2003US20030141342 Minute copper balls and a method for their manufacture
07/31/2003US20030141314 Chemical treating apparatus
07/31/2003US20030141291 Device for homogeneous heating of an object
07/31/2003US20030141287 For unidirectionally homogenizing an energy density of laser light emitted from the laser
07/31/2003US20030141285 Inductively coupled plasma apparatus
07/31/2003US20030141278 Method of fabricating a semiconductor memory device
07/31/2003US20030141276 Nano-size imprinting stamp using spacer technique
07/31/2003US20030141275 Apparatus for etching or depositing a desired profile onto a surface
07/31/2003US20030141246 Regenerating apparatus and method for resist stripping waste liquids
07/31/2003US20030141217 Workpiece container assembly and apparatus for opening/closing the same
07/31/2003US20030141201 Electrochemical edge and bevel cleaning process and system
07/31/2003US20030141194 Apparatus and method for electrolytically depositing copper on a semiconductor workpiece
07/31/2003US20030141186 Method and apparatus for ionized plasma deposition
07/31/2003US20030141185 Contact assemblies, methods for making contact assemblies, and machines with contact assemblies for electrochemical processing of microelectronic workpieces
07/31/2003US20030141105 Circuit component built-in module, radio device having the same, and method for producing the same
07/31/2003US20030141018 spreaders comprising frames for joining trowel blades and pivot points comprised of two juxtaposed side panels, for use in the laying of flooring and roofing surfaces
07/31/2003US20030141017 Plasma processing apparatus
07/31/2003US20030141016 Exhaust system for processing apparatus
07/31/2003US20030141014 Mixture of electroconductive particles and polymer
07/31/2003US20030141006 Green sheet and manufacturing method thereof, manufacturing method of multi-layer wiring board, and manufacturing method of double-sided wiring board
07/31/2003US20030140988 Process control; controlling time and temperature; aftertreatment annealing
07/31/2003US20030140949 Substrate treating method and substrate treating apparatus
07/31/2003US20030140948 Clean equipment for removing polymer residues on sidewalls of metal lines and method thereof
07/31/2003US20030140945 Substrate processing apparatus
07/31/2003US20030140941 CVD apparatus
07/31/2003US20030140853 Substrate processing apparatus
07/31/2003US20030140852 Method and device for regulating the differential pressure in epitaxy reactors
07/31/2003US20030140851 Gas distribution showerhead
07/31/2003US20030140850 Gridded susceptor
07/31/2003US20030140846 Selective growth method, and semiconductor light emitting device and fabrication method thereof
07/31/2003US20030140844 Method to form thick relaxed SiGe Layer with trench structure
07/31/2003US20030140806 Multi-beam pattern generator
07/31/2003US20030140716 Method and arrangement for transporting and inspecting semiconductor substrates
07/31/2003US20030140691 Apparatus for rotating a sample
07/31/2003US20030140678 System and method for aligning an integrated circuit die on an integrated circuit substrate
07/31/2003US20030140663 Door-in-door front opening unified pod
07/31/2003US20030140492 Apparatus and method for processing electronic components
07/31/2003US20030140490 Multi-layer circuit assembly and process for preparing the same
07/31/2003US20030140489 Semiconductor module and producing method therefor
07/31/2003US20030140486 Method of separating and handling a thin semiconductor die on a wafer
07/31/2003US20030140485 Semiconductor chip carrying adhesive tape/sheet, semiconductor chip carrier, semiconductor chip mounting method and semiconductor chip packaging body
07/31/2003US20030140484 Device for pressure bonding an integrated circuit to a printed circuit board
07/31/2003US20030140476 Substrate alignment method and apparatus
07/31/2003US20030140470 Porous ceramic work stations for wire and die bonders
07/31/2003DE19549647C2 High-density packaging multi-chip semiconductor module
07/31/2003DE10162900C1 Verfahren zur Herstellung niederohmiger Elektroden in Grabenkondensatoren A process for producing low-impedance electrodes in grave capacitors
07/31/2003CA2474054A1 Apparatus incorporating small-feature-size and large-feature-size components and method for making same
07/31/2003CA2473956A1 Management system, method and apparatus for licensed delivery and accounting of electronic circuits
07/31/2003CA2473746A1 Compositions and methods for the detection, diagnosis and therapy of hematological malignancies
07/31/2003CA2468806A1 Method for improving the adhesion of a coating
07/31/2003CA2439812A1 Dielectric films for narrow gap-fill applications
07/30/2003EP1331840A2 Method of locating and placing eye point features of a semiconductor die on a substrate
07/30/2003EP1331707A1 Ball grid array connection device
07/30/2003EP1331673A2 Light emitting element and manufacturing method for the same
07/30/2003EP1331669A2 Antifuse structure and method of making
07/30/2003EP1331668A1 Capacitor element and production method therefor
07/30/2003EP1331664A1 Semiconductor device and its manufacturing method
07/30/2003EP1331663A1 Method for cleaving layers of a wafer material
07/30/2003EP1331662A2 SOI semiconductor device and method for producing the same
07/30/2003EP1331661A2 Device, ferroelectric memory cell and methods for manufacture thereof
07/30/2003EP1331660A2 Polycrystalline silicon thin film for a thin film transistor and display device using the same
07/30/2003EP1331659A2 Centering mechanism, centering unit, semiconductor manufacturing apparatus, and centering method
07/30/2003EP1331646A2 X-ray-reflective mirrors exhibiting reduced thermal stress, and X-ray optical systems comprising same
07/30/2003EP1331519A2 Exposure control
07/30/2003EP1331517A1 Positive photosensitive resin composition, process for its preparation, and semiconductor devices
07/30/2003EP1331516A2 Method and mask for fabricating features in a polymer layer
07/30/2003EP1331454A1 Pulling room
07/30/2003EP1331202A2 Electronic device having an electrode made of metal on which carbon nanotubes are deposited
07/30/2003EP1330875A1 Digitally controlled impedance for i/o of an integrated circuit device
07/30/2003EP1330864A2 Xyz-axes table
07/30/2003EP1330843A1 An optoelectronic device
07/30/2003EP1330842A2 Low temperature hillock suppression method in integrated circuit interconnects
07/30/2003EP1330841A1 Method for assembling planar workpieces
07/30/2003EP1330840A1 Non-volatile memory with source side boron implantation
07/30/2003EP1330839A2 Etching of high aspect ratio features in a substrate
07/30/2003EP1330838A1 Control trimming of hard mask for transistor gate
07/30/2003EP1330837A1 Integration of high voltage self-aligned mos components
07/30/2003EP1330836A1 Method for producing a schottky diode in silicon carbide
07/30/2003EP1330835A1 Arrangement for transporting a semiconductor wafer carrier
07/30/2003EP1330832A2 Bi mode ion implantation with non-parallel ion beams
07/30/2003EP1330743A1 Method and apparatus for physical budgeting during rtl floorplanning
07/30/2003EP1330684A2 Method and apparatus for embedded process control framework in tool systems
07/30/2003EP1330680A1 Vacuum ultraviolet transmitting direct deposit vitrified silicon oxyfluoride lithography glass photomask blanks
07/30/2003EP1330679A1 Photolithography methods and systems
07/30/2003EP1330665A1 Optical lithography and a method of inducing transmission in optical lithography preforms
07/30/2003EP1330561A2 Integrated phase separator for ultra high vacuum system
07/30/2003EP1330557A2 Sputter targets
07/30/2003EP1330333A1 Method of retrofitting a probe station
07/30/2003EP1287185A4 Anode assembly for plating and planarizing a conductive layer
07/30/2003EP1194949A4 Surface finishing of soi substrates using an epi process
07/30/2003EP1188062B1 System for wireless testing of integrated circuits