Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2003
07/10/2003US20030129797 Method of fabricating a semiconductor device
07/10/2003US20030129796 Method for fabricating a semiconductor memory device
07/10/2003US20030129795 Novel metal-gate electrode for CMOS transistor applications
07/10/2003US20030129794 Nitride ready only memory cell with two top oxide layers and the method for manufacturing the same
07/10/2003US20030129793 Novel metal-gate electrode for CMOS transistor applications
07/10/2003US20030129792 Method of manufacturing a semiconductor integrated circuit and semiconductor integrated circuit
07/10/2003US20030129791 Semiconductor device and manufacturing method thereof
07/10/2003US20030129789 Method of assembling a semiconductor chip package
07/10/2003US20030129788 Compound semiconductor device
07/10/2003US20030129787 Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages
07/10/2003US20030129781 Photodiode detector and fabrication method thereof
07/10/2003US20030129780 Method of fabricating substrates and substrates obtained by this method
07/10/2003US20030129779 Optical semiconductor device and method for fabricating the same
07/10/2003US20030129778 Method of forming a semiconductor component
07/10/2003US20030129776 Method of monitoring contact hole of integrated circuit using corona charges
07/10/2003US20030129775 Matched set of integrated circuit chips selected from a multi wafer interposer
07/10/2003US20030129774 Advanced process control (APC) of copper thickness for chemical mechanical planarization (CMP) optimization
07/10/2003US20030129773 Method of forming capacitor constructions
07/10/2003US20030129772 Method of fabricating and repairing ceramic components for semiconductor fabrication using plasma spray process
07/10/2003US20030129771 Method of forming an FeRAM capacitor having a bottom electrode diffusion barrier
07/10/2003US20030129547 Process for producing an image using a first minimum bottom antireflective coating composition
07/10/2003US20030129542 Contact planarization materials that generate no volatile byproducts or residue during curing
07/10/2003US20030129541 Redistribution process
07/10/2003US20030129540 Method of forming a self-aligned twin well structrue with a single mask
07/10/2003US20030129537 Method of treating photoresists using electrodeless UV lamps
07/10/2003US20030129534 Overcoating substrate with photoresist , acid generator and antireflective coating
07/10/2003US20030129527 Negative deep ultraviolet photoresist
07/10/2003US20030129509 Forming photoresist on semiconductor; exposure, development pattern
07/10/2003US20030129446 Multilayer structure used especially as a material of high relative permittivity
07/10/2003US20030129438 Dual cure B-stageable adhesive for die attach
07/10/2003US20030129436 Fullerene polymers; solar cells, light emitting diodes
07/10/2003US20030129424 Etching process for making electrodes
07/10/2003US20030129370 High strength; porosity; bonding strength; channels in matrix; multilayer wire structure
07/10/2003US20030129347 Curing a silicone polymer while the polymer lies between backing materials and the backing material has a surface containing oxygen and/or sulfur atoms in contact with silicon, separating the cured product from backing material
07/10/2003US20030129310 Methods of electroless deposition of nickel, and methods of forming under bump metallurgy, and constructions comprising solder bumps
07/10/2003US20030129309 Chemical vapor deposition of metal oxynitride, phosphonitride and boronitride; thin film has high barrier and low resistance
07/10/2003US20030129308 Atomic layer deposition of copper using a reducing gas and non-fluorinated copper precursors
07/10/2003US20030129306 Chemical vapor deposition of ruthenium films for metal electrode applications
07/10/2003US20030129272 Mold for an integrated circuit package
07/10/2003US20030129271 Package stack via bottom-leaded plastic (BLP) packaging
07/10/2003US20030129051 Method and apparatus for transferring and loading a reticle with a robotic reticle end-effector
07/10/2003US20030129047 Calibration cassette pod for robot teaching and method of using
07/10/2003US20030129045 Universal modular wafer transport system
07/10/2003US20030129001 Method of manufacturing semiconductor memory device and semiconductor memory device
07/10/2003US20030128919 Device integrated antenna for use in resonant and non-resonant modes and method
07/10/2003US20030128870 System and method for aerial image sensing
07/10/2003US20030128809 Method for evaluating an SOI substrate, evaluation processor, and method for manufacturing a semiconductor device
07/10/2003US20030128802 Resist material and exposure method
07/10/2003US20030128618 Flash EEprom system
07/10/2003US20030128616 Semiconductor memory device
07/10/2003US20030128608 Sense amplifier driver circuits configured to track changes in memory cell pass transistor characteristics
07/10/2003US20030128605 Method of making identification code of ROM and structure thereof
07/10/2003US20030128588 Fast program to program verify method
07/10/2003US20030128586 Operating techniques for reducing effects of coupling between storage elements of a non-volatile memory operated in multiple data states
07/10/2003US20030128584 Non-volatile semiconductor memory device
07/10/2003US20030128582 Non-volatile memory and semiconductor device
07/10/2003US20030128580 High-density magnetic random access memory device and method of operating the same
07/10/2003US20030128579 Non-volatile magnetic memory
07/10/2003US20030128571 Negative voltage generating circuit
07/10/2003US20030128570 Digital to analog converter including a ferroelectric non-volatile semiconductor memory, and method for converting digital data to analog data
07/10/2003US20030128565 Semiconductor storage device and method of fabricating the same
07/10/2003US20030128528 Universal memory module/pcb storage, transport, automation handling tray
07/10/2003US20030128520 Packaging structure with heat slug
07/10/2003US20030128497 Dielectric structure
07/10/2003US20030128483 Exchange coupling film, magneto-resistance effect device, magnetic head, and magnetic random access memory
07/10/2003US20030128369 Compensating for effects of non-isotropic gas mixtures in interferometers
07/10/2003US20030128367 Alignment sensor
07/10/2003US20030128361 Light modulation apparatus and optical switch, movement detecting device and distance measuring device, alignment device and semiconductor aligner, and processes thereof
07/10/2003US20030128350 Stage device and exposure apparatus
07/10/2003US20030128348 Stage apparatus, scanning type exposure apparatus, and device produced with the same
07/10/2003US20030128346 Projection exposure apparatus
07/10/2003US20030128345 Scanning type exposure apparatus and a device manufacturing method using the same
07/10/2003US20030128328 Fixing device, method of fixing substrate and apparatus and method for manufacturing a liquid crystal display panel using the same
07/10/2003US20030128323 Active-matrix addressing liquid-crystal display device using lateral electric field
07/10/2003US20030128322 Liquid crystal display device
07/10/2003US20030128277 Camera system, control method thereof, device manufacturing apparatus, exposure apparatus, and device manufacturing method
07/10/2003US20030128127 Online tension monitor system for robot X-belt of mirra CMP
07/10/2003US20030128050 FPGA and embedded circuitry initialization and processing
07/10/2003US20030128049 Programmable logic device including multipliers and configurations thereof to reduce resource utilization
07/10/2003US20030128024 Apparatus for recognizing working position of device transfer system in semiconductor device test handler and method thereof
07/10/2003US20030127872 Clamping element for flat work pieces
07/10/2003US20030127752 Layouts for CMOS SRAM cells and devices
07/10/2003US20030127751 Alignment mark structure
07/10/2003US20030127750 Electronic chip component with an integrated circuit and fabrication method
07/10/2003US20030127748 Semiconductor package
07/10/2003US20030127747 Semiconductor device and manufacturing method thereof
07/10/2003US20030127745 Low capacitance wiring layout and method for making same
07/10/2003US20030127744 Low electrical resistance, smoothness, high strength, stress resistance
07/10/2003US20030127743 Interconnect on a substrate
07/10/2003US20030127740 Air gaps copper interconnect structure
07/10/2003US20030127738 Semiconductor device with SI-GE layer-containing low resistance, tunable contact
07/10/2003US20030127735 Stackable layers containing encapsulated integrated circuit chips with one or more overlying interconnect layers and a method of making the same
07/10/2003US20030127734 Electroconductivity chips; solder blocks; masking pattern
07/10/2003US20030127733 Resin-sealed type semiconductor device
07/10/2003US20030127732 Resin-sealed type semiconductor device
07/10/2003US20030127726 Cover tape for packaging electronic elements
07/10/2003US20030127725 Metal wiring board, semiconductor device, and method for manufacturing the same
07/10/2003US20030127724 Double side connected type semiconductor apparatus
07/10/2003US20030127722 Semiconductor device and method for fabricating the same
07/10/2003US20030127718 Semiconductor component and a method for identifying a semiconductor component
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