Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2003
07/17/2003WO2003058696A1 Method of producing metal film
07/17/2003WO2003058695A1 Preparation of stack high-k gate dielectrics with nitrided layer
07/17/2003WO2003058694A1 Method for post-etch and strip residue removal on coral films
07/17/2003WO2003058693A2 Method for producing a capacitor
07/17/2003WO2003058692A1 Redox-switchable materials
07/17/2003WO2003058691A1 Methods and apparatus for conditioning and temperature control of a processing surface
07/17/2003WO2003058690A2 Deposition of tungsten for the formation of conformal tungsten silicide
07/17/2003WO2003058689A1 Optical measurement apparatus
07/17/2003WO2003058688A1 Method and apparatus for aligning a cassette handler
07/17/2003WO2003058687A1 Method of detecting, identifying and correcting process performance
07/17/2003WO2003058686A2 Device and method for the treatment of disk-shaped substrates
07/17/2003WO2003058684A2 High voltage power mosfet having a voltage sustaining region and diffusion from regions of oppositely doped polysilicon
07/17/2003WO2003058683A2 Method for fabricating a high voltage power mosfet having a voltage sustaining region that includes doped columns formed by rapid diffusion
07/17/2003WO2003058682A2 A METHOD FOR FORMING A POWER SEMICONDUCTOR AS IN FIGURE 5 HAVING A SUBSTRATE (2), A VOLTAGE SUSTAINING EPITAXIAL LAYER (1) WITH AT LEAST A TRENCH (52), A DOPED REGION (5a) ADJACENT AND SURROUNDING THE TRENCH.
07/17/2003WO2003058681A2 Differential detector coupled with defocus for improved phase defect sensitivity
07/17/2003WO2003058680A2 Supercritical fluid-assisted deposition of materials on semiconductor substrates
07/17/2003WO2003058679A2 System and method of processing composite substrate within a high throughput reactor
07/17/2003WO2003058678A2 Automotive code reader
07/17/2003WO2003058677A2 System for the production of electric and integrated circuits
07/17/2003WO2003058655A1 Material deposition from a liquefied gas solution
07/17/2003WO2003058644A2 Superhard dielectric compounds and methods of preparation
07/17/2003WO2003058515A1 Method for automatically defining a part model
07/17/2003WO2003058350A1 A cleaning agent composition for a positive or a negative photoresist
07/17/2003WO2003058348A1 Process for producing an image using a first minimum bottom antireflective coating composition
07/17/2003WO2003058347A1 Negative deep ultraviolet photoresist
07/17/2003WO2003058345A2 Negative-working photoimageable bottom antireflective coating
07/17/2003WO2003058344A2 System and method for aerial image sensing
07/17/2003WO2003058332A1 Reflection type liquid crystal display device and method of manufacturing the same
07/17/2003WO2003058264A1 Cooling assembly with direct cooling of active electronic components
07/17/2003WO2003058199A2 Arrays of microparticles and methods of preparation thereof
07/17/2003WO2003058158A2 Stereoscopic three-dimensional metrology system and method
07/17/2003WO2003057943A2 Electroless plating system
07/17/2003WO2003057942A1 Methods for silicon oxide and oxynitride deposition using single wafer low pressure cvd
07/17/2003WO2003057755A1 Organic composition
07/17/2003WO2003057749A1 Organic compositions
07/17/2003WO2003057703A1 Materials and methods for forming hybrid organic-inorganic dielectric materials for integrated circuit applications
07/17/2003WO2003057702A2 Materials and methods for forming hybrid organic-inorganic dielectric materials
07/17/2003WO2003057647A1 Methods of roughening a ceramic surface
07/17/2003WO2003057406A1 Apparatus and methods for controlling wafer temperature in chemical mechanical polishing
07/17/2003WO2003057405A1 Grooved rollers for a linear chemical mechanical planarization system
07/17/2003WO2003057404A2 Method and apparatus for applying downward force on wafer during cmp
07/17/2003WO2003057377A1 Method for cleaning an article
07/17/2003WO2003057343A1 Liquid medicine supplying device and mwthod for supplying liquid medicine
07/17/2003WO2003056918A2 Automated foot bath apparatus and method
07/17/2003WO2003049153A3 On chip smart capacitors
07/17/2003WO2003036698A3 Method of depositing high-quality sige on sige substrates
07/17/2003WO2003030228A3 Method and apparatus for mitigating cross-contamination between liquid dispensing jets in close proximity to a surface
07/17/2003WO2003027767A3 Means and method for structuring a substrate with a mask
07/17/2003WO2003017745A8 Architecture tool and methods of use
07/17/2003WO2002097963A3 Dielectric resonator
07/17/2003WO2002080269A3 Method and structure for ex-situ polymer stud grid array contact formation
07/17/2003WO2002055762A3 Electrochemical co-deposition of metals for electronic device manufacture
07/17/2003WO2002039463A3 Methods and system for attaching substrates using solder structures
07/17/2003US20030135837 Method and apparatus for automatic arrangement and wiring for a semiconductor integrated circuit design and wiring program therefor
07/17/2003US20030135835 Method of designing layout of semiconductor device
07/17/2003US20030135834 Method of designing semiconductor integrated circuit device
07/17/2003US20030135833 Method of designing semiconductor integrated circuit device
07/17/2003US20030135302 Method of calibrating a wafer edge gripping end effector
07/17/2003US20030135295 Defect source identifier with static manufacturing execution system
07/17/2003US20030135061 Volatile precursors for deposition of metals and metal-containing films
07/17/2003US20030134582 Oscillating chemical mechanical planarization apparatus
07/17/2003US20030134580 Polishing apparatus
07/17/2003US20030134578 Method of backgrinding wafers while leaving backgrinding tape on a chuck
07/17/2003US20030134576 Method for polishing copper on a workpiece surface
07/17/2003US20030134575 Chemical mechanical polishing system for substrate comprising liquid carrier, polishing pad and/or abrasive, per-type oxidizer, and phosphono group-containing additive
07/17/2003US20030134574 Air bearing-sealed micro-processing chamber
07/17/2003US20030134570 Wafer edge polishing system
07/17/2003US20030134521 Damascene method employing multi-layer etch stop layer
07/17/2003US20030134520 Silicon semiconductor substrate and method for production thereof
07/17/2003US20030134519 Thin film device provided with coating film, liquid crystal panel and electronic device, and method for making the thin film device
07/17/2003US20030134517 Semiconductor device and method for fabricating the same
07/17/2003US20030134514 Method of manufacturing nano transistors
07/17/2003US20030134513 Methods of forming integrated circuitry, semiconductor processing methods, and processing method of forming MRAM circuitry
07/17/2003US20030134512 High ph slurry for chemical mechanical polishing of copper
07/17/2003US20030134511 Method for depositing metal film through chemical vapor deposition process
07/17/2003US20030134510 Methods of forming metal layers in integrated circuit devices using selective deposition on edges of recesses and conductive contacts so formed
07/17/2003US20030134509 Manufacturing method of semiconductor device
07/17/2003US20030134508 Controlled conformality with alternating layer deposition
07/17/2003US20030134507 Semiconductor device fabricating method and treating liquid
07/17/2003US20030134506 Plasma display panel having trench discharge cell and method of fabricating the same
07/17/2003US20030134505 Fine-pitch device lithography using a sacrificial hardmask
07/17/2003US20030134504 Method of making an inlaid structure in a semiconductor device
07/17/2003US20030134503 Methods of forming materials between conductive electrical components, and insulating materials
07/17/2003US20030134502 Method for fabricating high aspect ratio electrodes
07/17/2003US20030134501 Process for removing a silicon-containing material through use of a byproduct generated during formation of a diffusion barrier layer
07/17/2003US20030134500 Insulating film forming method and insulating film forming apparatus
07/17/2003US20030134499 Bilayer HDP CVD / PE CVD cap in advanced BEOL interconnect structures and method thereof
07/17/2003US20030134498 Method and apparatus for pretreating a substrate prior to electroplating
07/17/2003US20030134497 Metal foil for wiring formation comprising copper, aluminum, nickel or alloy; accuracy
07/17/2003US20030134496 Method of making a wafer level chip scale package
07/17/2003US20030134495 Integration scheme for advanced BEOL metallization including low-k cap layer and method thereof
07/17/2003US20030134494 Compound semiconductor device and manufacturing method thereof
07/17/2003US20030134493 Method for doping Gallium Nitride (GaN) substrates and the resulting doped gan substrate
07/17/2003US20030134492 Adjusting defect profiles in crystal or crystalline-like structures
07/17/2003US20030134491 Vapor growth method, semiconductor producing method, and production method for semiconductor device
07/17/2003US20030134490 Method of fabricating semiconductor device on semiconductor wafer
07/17/2003US20030134489 Process for cleaving a wafer layer from a donor wafer
07/17/2003US20030134488 Method for fabricating semiconductor device
07/17/2003US20030134487 Method of forming a planar polymer transistor using substrate bonding techniques
07/17/2003US20030134486 Semiconductor-on-insulator comprising integrated circuitry
1 ... 4622 4623 4624 4625 4626 4627 4628 4629 4630 4631 4632 4633 4634 4635 4636 4637 4638 4639 4640 4641 4642 ... 6590