Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2003
07/30/2003EP1073877B1 Endpoint detection in chemical mechanical polishing (cmp) by substrate holder elevation detection
07/30/2003EP0900410B1 Attenuating embedded phase shift photomask blanks
07/30/2003EP0832407B1 Passive gas substrate thermal conditioning apparatus and method
07/30/2003EP0738185B1 Spin-on-glass process with controlled environment
07/30/2003CN1433577A Memory cell structure integrated on semiconductor
07/30/2003CN1433576A Anti-tamper encapsulation for integrated circuit
07/30/2003CN1433574A 集成电路封装 IC packaging
07/30/2003CN1433573A Leadless semiconductor product packaging apparatus having window lid and method for packaging
07/30/2003CN1433572A Novel chip interconnect and packaging deposition methods and structures
07/30/2003CN1433571A Semiconductor device, metal laminated plate for fabricating circuit on semiconductor, and method of fabricating circuit
07/30/2003CN1433570A Analysis of CD-SEM signal to detect scummed/closed contact holes and lines
07/30/2003CN1433569A Method of making power MOSFET
07/30/2003CN1433568A Removal of silicon oxynitride material using wet chemical process after gate etch processing
07/30/2003CN1433567A Post chemical-mechanical planarization (CMP) cleaning composition
07/30/2003CN1433566A 压力控制方法 Pressure Control Method
07/30/2003CN1433533A Method and apparatus for aligning crystalline substrate
07/30/2003CN1433531A Lithography device which uses source of radiation in the extreme ultraviolet range and multi-layered mirrors with broad spectral band in this range
07/30/2003CN1433487A Method and apparatus for electrodeposition or etching of uniform film with miniml edge exclusion on substrate
07/30/2003CN1433358A Thermal transfer of microstructured layers
07/30/2003CN1433351A Hardening flux, soldering resist, remicondctor package reinforced by hardening flux, semiconductor device and method of producing semiconductor package and semiconductor device
07/30/2003CN1433342A Label sheel for cleaning conveying member having cleaning function
07/30/2003CN1433142A Voltage controlled oscillator circuit and its PLL circuit
07/30/2003CN1433088A Semiconductor light-emitting device and its making process
07/30/2003CN1433084A Polysilicon film for film transistor and display device with the polysilicon film
07/30/2003CN1433082A Bipolar heterojunction transistor and semiconductor IC device of the transistors
07/30/2003CN1433081A 影像感测器及其封装方法 Image sensor and method for packaging
07/30/2003CN1433080A Semiconductor device making process and semiconductor chip with SOI substrate
07/30/2003CN1433079A Vertical ROM and its making process
07/30/2003CN1433078A Layout of static RAM units and device
07/30/2003CN1433075A Semiconductor and its manufacture
07/30/2003CN1433074A Semiconductor lead frame
07/30/2003CN1433073A Semiconductor device and its making process, circuit board and electronic instrument
07/30/2003CN1433072A Wiring structure and its making process, semiconductor device with the wiring structure and its wiring base board
07/30/2003CN1433071A Chip package and its making process
07/30/2003CN1433070A Chip package and its making process
07/30/2003CN1433068A 半导体器件 Semiconductor devices
07/30/2003CN1433065A Semiconductor integrated circuit and its manufacture
07/30/2003CN1433064A Operation process of non-volatile memory element
07/30/2003CN1433063A Manufacture of single-chip system module
07/30/2003CN1433062A Method of forming opening in low dielectric constant material
07/30/2003CN1433061A Making process of intraconnection with no effect of chemical and mechanical grinding disc
07/30/2003CN1433060A Element-isolating film forming method for semiconductor device
07/30/2003CN1433058A Presintering test circuit and method for wafer stage memory
07/30/2003CN1433057A Directly connected interface unit for memory test machine and integrated circuit sorter
07/30/2003CN1433056A Technological process of splitting ship material layers
07/30/2003CN1433055A Protective strip adhering method and apparatus and protective strip separating method
07/30/2003CN1433054A Protective strip cutting method and protective strip adhering device in the method
07/30/2003CN1433053A Semiconductor device manufacturing process and equipment
07/30/2003CN1433052A Pattern forming method
07/30/2003CN1433051A Protective film pattern sorming method and semiconductor device manufacturing process
07/30/2003CN1433050A Pin inserter and inserting method
07/30/2003CN1433049A Processing liquid compounding and supplying method and device
07/30/2003CN1433048A Semiconductor device making apparatus
07/30/2003CN1433023A Magnetic film memory device with redundant repair function
07/30/2003CN1433022A High-density magnetic RAM and its operation method
07/30/2003CN1433021A 磁存储器 Magnetic memory
07/30/2003CN1432966A Non-contact data carrier and its making process
07/30/2003CN1432875A Photoetching equipment and device making process
07/30/2003CN1432871A Photoresist composite and pattern forming process with it
07/30/2003CN1432869A Photoresist composite for short wavelength purpose
07/30/2003CN1432858A Electronic circuit
07/30/2003CN1432856A Image display unit with transistor possessing polycrystal semiconductor layer and its making process
07/30/2003CN1432854A Display unit and its manufacture
07/30/2003CN1432849A Regenerating method of liquid crystal device
07/30/2003CN1432666A Copper electroplating method
07/30/2003CN1432531A Hydrogen dissolving water producing apparatus
07/30/2003CN1432514A Electonic element packing belt
07/30/2003CN1432440A Solution processing unit and method
07/30/2003CN1432439A Solvent sweeped chemical transporting box
07/30/2003CN1116790C Printed circuit board and electronic element assembly and manufacture thereof
07/30/2003CN1116703C Input protection circuit for use in semiconductor device having improved electrostatic breakdown voltage
07/30/2003CN1116702C Low resistance silicide filler for channel capacitor
07/30/2003CN1116701C Method of manufacturing semiconductor device
07/30/2003CN1116700C Method of manufacturing active matrix device
07/30/2003CN1116699C Semiconductor IC and its chip arrangement
07/30/2003CN1116698C Method of processing workpiece
07/30/2003CN1116697C Film carrier, its manufacture and mask used for the method
07/30/2003CN1116696C Manufacture of metal band for packing IC card module
07/30/2003CN1116695C Method for forming fine inter-pattern space in semiconductor device
07/30/2003CN1116681C Flash memory cells, method for fabricating the same and method for writing in, erasing and reading
07/30/2003CN1116613C Method and apparatus for probing, testing, burning, repairing and programming of integrated circuits in closed environment using single apparatus
07/30/2003CN1116372C Polishing agent for semiconductor substrates
07/30/2003CN1116203C IC tray with self aligning pocket
07/29/2003US6601225 Semiconductor device having definite size of input/output blocks and its designing method
07/29/2003US6601219 Electronic apparatus and manufacturing method for an electronic apparatus
07/29/2003US6601218 Semiconductor integrated circuit device
07/29/2003US6601202 Circuit configuration with deactivatable scan path
07/29/2003US6601201 Method and apparatus for displaying test results and recording medium
07/29/2003US6601199 Memory-embedded LSI
07/29/2003US6601198 Semiconductor integrated circuit
07/29/2003US6601177 Semiconductor integrated circuit
07/29/2003US6601008 Parametric device signature
07/29/2003US6600692 Semiconductor device with a voltage regulator
07/29/2003US6600685 Semiconductor memory device having test mode
07/29/2003US6600683 Semiconductor integrated circuit
07/29/2003US6600671 Reduced area sense amplifier isolation layout in a dynamic RAM architecture
07/29/2003US6600608 Catadioptric objective comprising two intermediate images
07/29/2003US6600606 Projection optical system with diffractive optical element
07/29/2003US6600565 Real-time evaluation of stress fields and properties in line features formed on substrates
07/29/2003US6600561 Overlappingly formed on semiconductor; alignment reference mark