Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2003
07/17/2003US20030132027 Integrated circuit contactor, and method and apparatus for production of integrated circuit contactor
07/17/2003US20030132019 Virtual gate design for thin packages
07/17/2003US20030131939 Apparatus and method for etching the edges of semiconductor wafers
07/17/2003US20030131938 Apparatus for preparing and supplying slurry for CMP apparatus
07/17/2003US20030131937 Thermosetting resin compositions useful as underfill sealants
07/17/2003US20030131932 Liquid matrix includes one or more additive materials that are strongly absorbing for the wavelength of the laser radiation, such as carbon black, a dye or a metal.
07/17/2003US20030131929 Protective tape applying method and apparatus, and protective tape separating method
07/17/2003US20030131902 Vacuum load lock, system including vacuum load lock, and associated methods
07/17/2003US20030131885 Cabinet for chemical delivery with solvent purging
07/17/2003US20030131874 Automated semiconductor processing systems
07/17/2003US20030131872 Wafer cleaning device, wafer cleaning method and chemical mechanical polishing machine
07/17/2003US20030131792 Pressure control apparatus and method of establshing a desired level of pressure within at least one processing chamber
07/17/2003US20030131788 Method for fabricating semiconductor device
07/17/2003US20030131785 Pattern for monitoring epitaxial layer washout
07/17/2003US20030131661 Method and apparatus for controlling the level of liquids
07/17/2003US20030131648 Calibration element for adjustable nozzle
07/17/2003US20030131535 Of barrier/adhesion layers as occur in the manufacture of integrated circuits; using an aqueous oxidizer such as hydroxylamine nitrate and nitric acid or aluminum nitrate
07/17/2003US20030131495 Method and apparatus for heating and colling substrates
07/17/2003US20030131494 Apparatus and method for rinsing substrates
07/17/2003US20030131493 Wafer temperature compensator having reflector
07/17/2003US20030131476 Heat conduits and terminal radiator for microcircuit packaging and manufacturing process
07/17/2003US20030131470 Non leadframe clamping for matrix leadless leadframe package molding
07/17/2003US20030131458 Apparatus and method for improving throughput in a cluster tool for semiconductor wafer processing
07/17/2003US20030131428 Mold cleaning sheet and method for producing semiconductor devices using the same
07/17/2003DE10158564C1 Leiterbahnstruktur für eine integrierte Schaltung und entsprechendes Herstellungsverfahren Interconnect structure for an integrated circuit and method of manufacture
07/17/2003DE10158563C1 Verfahren zur Herstellung eines Bauelementmoduls A method for producing a component module
07/17/2003CA2472478A1 Method for cleaning an article
07/17/2003CA2471434A1 Automated foot bath apparatus and method
07/17/2003CA2471380A1 Methods of making electromechanical three-trace junction devices
07/17/2003CA2443846A1 Organic compositions
07/16/2003EP1328023A2 Lead frame, method for manufacturing the same, resin-encapsulated semiconductor device and method for manufacturing the same
07/16/2003EP1328018A1 Cover tape for packaging electronic elements
07/16/2003EP1328017A2 Complementary Tranistors
07/16/2003EP1328016A2 Wafer-level test of integrated circuits
07/16/2003EP1328015A2 Method of bonding a flip chip
07/16/2003EP1328014A1 Semiconductor base material and method of manufacturing the material
07/16/2003EP1328013A1 Method of forming a line structure in a layer of a semiconductor wafer
07/16/2003EP1328012A1 Method of manufactoring an electronic device comprising an inductive mirco component
07/16/2003EP1328011A2 Protective tape applying method and apparatus
07/16/2003EP1328010A2 Method of automatic handling of semiconductor wafers
07/16/2003EP1328009A2 Apparatus for mounting an element on a substrate
07/16/2003EP1328008A1 Clamping element for flat workpieces
07/16/2003EP1327944A1 Method for modeling and making an integrated circuit having at least an insulated gate field effect transistor and corresponding integrated circuit
07/16/2003EP1327913A2 Method and apparatus for transferring and loading a reticle with a robotic reticle end-effector
07/16/2003EP1327894A1 Filter member manufacturing method, filter member cutting method, filter chip cutting method, and filter chip manufacturing method
07/16/2003EP1327890A2 Integrated circuit defect detection system
07/16/2003EP1327654A2 Polyester film for release film
07/16/2003EP1327603A2 Cabinet for chemical delivery with solvent purge
07/16/2003EP1327519A2 Apparatus and method for pressing together disc-shaped elements to be bonded
07/16/2003EP1327266A2 Protection diode for improved ruggedness of a radio frequency power transistor and self-defining method to manufacture such protection diode
07/16/2003EP1327264A1 Solvent assisted burnishing of pre-underfilled solder-bumped wafers for flipchip bonding
07/16/2003EP1327263A1 Layer transfer of low defect sige using an etch-back process
07/16/2003EP1327262A2 Method and apparatus for providing communication between a defect source identifier and a tool data collection and control system
07/16/2003EP1327261A1 Silicon oxide liner for reduced nickel silicide bridging
07/16/2003EP1327260A2 Simplified method to produce nanoporous silicon-based films
07/16/2003EP1327258A1 Chemical-mechanical polishing slurry and method
07/16/2003EP1327257A1 Method of cleaning an electronic device
07/16/2003EP1327172A1 8-mirrored microlithographic projector lens
07/16/2003EP1327126A1 Differential numerical aperture methods and device
07/16/2003EP1327010A2 Vapor deposition of oxides, silicates and phosphates
07/16/2003EP1326951A1 Stabilized alkaline compositions for cleaning microelectronic substrates
07/16/2003EP1326936A2 Energy-beam-curable thermal-releasable pressure-sensitive adhesive sheet and method for producing cut pieces using the same
07/16/2003EP1326906A2 Fractionation of resins using a static mixer and a liquid-liquid centrifuge
07/16/2003EP1326903A2 Compositions for microlithography
07/16/2003EP1326733A1 Method of chemical mechanical polishing
07/16/2003EP1326729A1 Method and device for applying pieces of material to a workpiece
07/16/2003EP1297396A4 Flow control of process gas in semiconductor manufacturing
07/16/2003EP1256075B1 Supporting multiple fpga configuration modes using dedicated on-chip processor
07/16/2003EP1212787A4 A cleaving process to fabricate multilayered substrates using low implantation doses
07/16/2003EP1190487A4 High voltage protection circuit on standard cmos process
07/16/2003EP1121713A4 Gas immersion laser annealing method suitable for use in the fabrication of reduced-dimension integrated circuits
07/16/2003EP0968524A4 Atmospheric-pressure plasma jet
07/16/2003EP0870218B1 Method and system for assessing a measurement procedure and measurement-induced uncertainties on a batchwise manufacturing process of discrete products
07/16/2003EP0654173B1 High density power device structure and fabrication process
07/16/2003CN2561096Y Semiconductor material electric signal measuring apparatus
07/16/2003CN1430793A Semiconductor device and methdo of manufacturing the same
07/16/2003CN1430792A Semiconductor device and method
07/16/2003CN1430791A Chip scale surface mounted device and its process of manufacture
07/16/2003CN1430790A Method for forming bottom anti-reflective coating using rapid thermal anneal with oxidizing gas
07/16/2003CN1430789A Method and apparatus for thermally processing wafers
07/16/2003CN1430545A Multilayer retaining ring for chemical mechanical polishing
07/16/2003CN1430542A Improved apparatus and method for dispensing solder
07/16/2003CN1430406A Optical device and its manufacturing method, optical module, circuit board and electronic equipment
07/16/2003CN1430405A Optical device and its manufacturing method, optical module, circuit board and electronic instrument
07/16/2003CN1430313A Optoelectronic device and selection district epitaxial method of autocollimation model spot inverter integration
07/16/2003CN1430292A Magnetic switch element and magnetic memory
07/16/2003CN1430285A Semiconductor device used partial SOI substrate and its manufacturing method
07/16/2003CN1430283A High coupling rate rapid flash memory and its manufacturing method
07/16/2003CN1430282A Semiconductor device for variable capacity capacitor and amplifier
07/16/2003CN1430281A Semiconductor device and its manufacturing method
07/16/2003CN1430280A 半导体器件 Semiconductor devices
07/16/2003CN1430279A Semiconductor device with partial SOI structure and its manufacturing method
07/16/2003CN1430278A Double-side connection type semiconductor device
07/16/2003CN1430275A Internal connecting wire structure covered by metal barrier layer and its manufacturing method
07/16/2003CN1430274A Structure and method for isolating porous low-K dielectric film
07/16/2003CN1430272A Semiconductor device and its manufacturing method
07/16/2003CN1430271A Semiconductor device and its manufacturing method
07/16/2003CN1430270A Internal circuit structure for chip with weld pad array and its manufacturing method
07/16/2003CN1430266A Method for manufacturing chip, semiconductor device using the chip and its making method
07/16/2003CN1430265A Method for designing system large-scale integrated circuit
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