Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2003
08/05/2003US6602756 Semiconductor device and its manufacture
08/05/2003US6602755 Method for manufacturing a compact bipolar transistor structure
08/05/2003US6602754 Nitrogen implant into nitride spacer to reduce nickel silicide formation on spacer
08/05/2003US6602753 Semiconductor device having a gate insulating film comprising a metal oxide and method of manufacturing the same
08/05/2003US6602751 Method for manufacturing semiconductor devices
08/05/2003US6602750 Container structure for floating gate memory device and method for forming same
08/05/2003US6602749 Capacitor under bitline (CUB) memory cell structure with reduced parasitic capacitance
08/05/2003US6602748 Method for fabricating a semiconductor device
08/05/2003US6602747 Method for fabricating bipolar complementary metal oxide semiconductor (BiCMOS) device structure
08/05/2003US6602746 Dual-gate CMOS semiconductor device manufacturing method
08/05/2003US6602745 Field effect transistor and method of fabrication
08/05/2003US6602744 Process for fabricating thin film semiconductor device
08/05/2003US6602743 Method of manufacturing a flat panel display
08/05/2003US6602740 Encapsulation of microelectronic assemblies
08/05/2003US6602739 Method for making multichip module substrates by encapsulating electrical conductors and filling gaps
08/05/2003US6602738 Method of manufacturing semiconductor device having tie bars for interconnecting leads
08/05/2003US6602736 Method and apparatus for separating semiconductor chips
08/05/2003US6602734 Method of manufacturing a semiconductor device
08/05/2003US6602733 Method for fabricating electronic circuit device, semiconductor device and electronic circuit device including bump bonding
08/05/2003US6602732 Method for mounting a semiconductor chip on a substrate and semiconductor device adapted for mounting on a substrate
08/05/2003US6602730 Method for gravitation-assisted control of spread of viscous material applied to a substrate
08/05/2003US6602729 Pulse voltage breakdown (VBD) technique for inline gate oxide reliability monitoring
08/05/2003US6602727 Scatterometry based active control of exposure conditions
08/05/2003US6602726 Bond surface conditioning system for improved bondability
08/05/2003US6602725 Method of manufacturing a semiconductor device having a monitor pattern, and a semiconductor device manufactured thereby
08/05/2003US6602724 Chemical mechanical polishing of a metal layer with polishing rate monitoring
08/05/2003US6602722 Process for fabricating capacitor having dielectric layer with pervskite structure and apparatus for fabricating the same
08/05/2003US6602721 Method for fabricating ferroelectric memory device and method for fabricating the same
08/05/2003US6602720 Single transistor ferroelectric transistor structure with high-K insulator and method of fabricating same
08/05/2003US6602654 Wettability and dissolution selectivity to alicyclic compound-based resists; does not produce dissolution residues, and it makes it possible to reliably form ultra fine patterns
08/05/2003US6602653 Surface oxidation and removal of selected portions forming fine line structures
08/05/2003US6602652 Light absorbing, crosslinking; for short wavelength imaging; photoresists; semiconductors
08/05/2003US6602650 Organic anti-reflective coating polymer, anti-reflective coating composition comprising the same and methods of preparation thereof
08/05/2003US6602647 Sulfonium salt compound and resist composition and pattern forming method using the same
08/05/2003US6602613 Heterointegration of materials using deposition and bonding
08/05/2003US6602549 Indium source reagent composition, and use thereof for deposition of indium-containing films on subtrates and ion implantation of indium-doped shallow junction microelectronic structures
08/05/2003US6602446 Electrically conductive filler and a heating element adapted to generate heat on electromagnetic induction compounded with resin
08/05/2003US6602439 Controlled particle size
08/05/2003US6602436 Chemical mechanical planarization of metal substrates
08/05/2003US6602435 Etching method
08/05/2003US6602434 Process for etching oxide using hexafluorobutadiene or related fluorocarbons and manifesting a wide process window
08/05/2003US6602433 Gas delivery system
08/05/2003US6602430 Methods for finishing microelectronic device packages
08/05/2003US6602384 Plasma processing apparatus
08/05/2003US6602383 Apparatus and methods for controlling workpiece surface exposure to processing liquids during the fabrication of microelectronic components
08/05/2003US6602382 Solution processing apparatus
08/05/2003US6602351 Remove water, entrained solvents and solid particles using high density carbon dioxide
08/05/2003US6602349 Supercritical fluid cleaning process for precision surfaces
08/05/2003US6602348 Substrate cooldown chamber
08/05/2003US6602347 Apparatus and method for processing a substrate
08/05/2003US6602346 Gas-purged vacuum valve
08/05/2003US6602344 Ceramic film and method of manufacturing the same, semiconductor device, and piezoelectric device
08/05/2003US6602323 Exhausting perfluoro compounds (PFC's) produced by etching and/or vapor deposition into a common stream then scrubbing
08/05/2003US6602305 Carrier reel, carriage method using the carrier reel, and method for manufacturing electronic device
08/05/2003US6602127 Plant for producing semiconductor products
08/05/2003US6602123 Finishing pad design for multidirectional use
08/05/2003US6602119 Dressing apparatus
08/05/2003US6602117 Slurry for use with fixed-abrasive polishing pads in polishing semiconductor device conductive structures that include copper and tungsten and polishing methods
08/05/2003US6602114 Multilayer retaining ring for chemical mechanical polishing
08/05/2003US6602038 Unified conveying apparatus, and semiconductor device manufacturing facility comprising the same
08/05/2003US6601888 Contactless handling of objects
08/05/2003US6601824 Single shaft, dual cradle vacuum slot valve
08/05/2003US6601777 Suspended particle container for an atomizer
08/05/2003US6601753 Void-free die attachment method with low melting metal
08/05/2003US6601752 Electronic part mounting method
08/05/2003US6601595 Method of reducing water spotting and oxide growth on a semiconductor structure
08/05/2003US6601594 Apparatus and method for delivering a treatment liquid and ozone to treat the surface of a workpiece
08/05/2003US6601592 Method of semiconductor substrate batch demounting
08/05/2003US6601468 Drive system for multiple axis robot arm
08/05/2003US6601314 Method of manufacturing alignment mark
08/05/2003US6601313 System and method for detecting position of semiconductor wafer
08/05/2003CA2107975C Columnar-grained polycrystalline solar cell and process of manufacture
07/2003
07/31/2003WO2003063570A2 A method and system for magnetically assisted statistical assembly of wafers
07/31/2003WO2003063356A1 Intergrated circuit and battery powered electronic device
07/31/2003WO2003063254A1 Semiconductor device
07/31/2003WO2003063252A1 Bipolar transistor comprising a low-resistance base terminal
07/31/2003WO2003063251A1 Automatically passivated n-p junction and a method for making it
07/31/2003WO2003063250A1 Programmable memory address and decode circuits with ultra thin vertical body transistors
07/31/2003WO2003063249A1 Magnetic storage apparatus and manufacturing method thereof
07/31/2003WO2003063248A1 Semiconductor die package with semiconductor die having side electrical connection
07/31/2003WO2003063245A2 Process condition sensing wafer and data analysis system
07/31/2003WO2003063244A1 Integrated circuit arrangement
07/31/2003WO2003063243A1 Thin films, structures having thin films, and methods of forming thin films
07/31/2003WO2003063239A2 Method and apparatus for controlling die attach fillet height to reduce die shear stress
07/31/2003WO2003063235A1 Eliminating substrate noise by an electrically isolated high-voltage i/o transistor
07/31/2003WO2003063234A1 Static eliminating mechanism for table, and tester
07/31/2003WO2003063233A2 Systems and methods for closed loop defect reduction
07/31/2003WO2003063232A1 Module device
07/31/2003WO2003063230A1 Ion-implantation and shallow etching to produce effective edge termination in high-voltage heterojunction bipolar transistors
07/31/2003WO2003063229A1 METHOD OF CREATING HIGH-QUALITY RELAXED SiGe-ON-INSULATOR FOR STRAINED Si CMOS APPLICATIONS
07/31/2003WO2003063228A1 Method for the production of a hetero-bipolar transistor
07/31/2003WO2003063227A2 A method of fabrication for iii-v semiconductor surface passivation
07/31/2003WO2003063226A2 Oxide layer on a gaas-based semiconductor structure and method of forming the same
07/31/2003WO2003063225A2 Dielectric films for narrow gap-fill applications
07/31/2003WO2003063224A1 An arrangement for preventing short-circuiting in a bipolar double-poly transistor and a method of fabricating such an arrangement
07/31/2003WO2003063222A1 Ozone-processing device
07/31/2003WO2003063220A1 Method and device for processing substrate, and apparatus for manufacturing semiconductor device
07/31/2003WO2003063219A1 Method for manufacturing electronic component
07/31/2003WO2003063218A2 Method for forming shallow junctions by ion implantation in silicon wafers
07/31/2003WO2003063217A1 Epitaxial growth method
1 ... 4607 4608 4609 4610 4611 4612 4613 4614 4615 4616 4617 4618 4619 4620 4621 4622 4623 4624 4625 4626 4627 ... 6590