Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2003
11/06/2003WO2003092063A1 Thin-film processing device
11/06/2003WO2003092062A2 Surface protection sheet and electronic device package
11/06/2003WO2003092061A1 Crystallization device and crystallization method, and phase shift mask
11/06/2003WO2003092060A1 Processing device using shower head structure and processing method
11/06/2003WO2003092059A1 Window type probe, plasma monitoring device, and plasma processing device
11/06/2003WO2003092058A2 Method for producing one or more monocrystalline layers, each with a different lattice structure, on one plane of a series of layers
11/06/2003WO2003092056A1 Exposure apparatus and device fabrication method using the same
11/06/2003WO2003092055A1 Substrate treatment apparatus
11/06/2003WO2003092054A1 Mounting method and mounting system
11/06/2003WO2003092053A1 Mounting method and mounting device
11/06/2003WO2003092052A1 Packaging method and packaging system
11/06/2003WO2003092051A2 Barrier for capacitor over plug structures
11/06/2003WO2003092050A2 Substrate transfer apparatus
11/06/2003WO2003092049A1 Improvement in process control for etch processes
11/06/2003WO2003092045A2 Method for producing an electrical circuit
11/06/2003WO2003092044A2 Method and apparatus for simplified system configuration
11/06/2003WO2003092041A2 Method for fabricating a soi substrate a high resistivity support substrate
11/06/2003WO2003092040A2 Method for processing a wafer
11/06/2003WO2003092022A1 Semiconductor capacitor comprising praseodymium oxide as a dielectric and an intermediate layer as a diffusion barrier for oxygen
11/06/2003WO2003092014A1 Memory storage device with heating element
11/06/2003WO2003092013A2 Self-aligned magnetic tunneling junction and via contact
11/06/2003WO2003092012A2 Flexible redundancy for memories
11/06/2003WO2003092011A2 Semiconductor memory device and operating method for a semiconductor memory device
11/06/2003WO2003091956A1 Controlling device for monitoring the spatial or mechanical delimitation of producer goods or materials in the production cycle by using transponder technology
11/06/2003WO2003091822A2 Method for producing nitrides and uses thereof as fluorescent markers and light-emitting diodes
11/06/2003WO2003091819A1 Semiconductor device and ic card
11/06/2003WO2003091815A1 Ozonated water flow and concentration control apparatus and method
11/06/2003WO2003091806A1 Method for removing photoresist
11/06/2003WO2003091795A1 Active matrix display device
11/06/2003WO2003091741A1 Electronic component test apparatus
11/06/2003WO2003091740A1 Electronic component test apparatus
11/06/2003WO2003091486A1 Methods of using pre-formed nanotubes to make carbon nanotube films, layers, fabrics, ribbons, elements and articles
11/06/2003WO2003091476A1 Method of electroless plating and semiconductor wafer having metal plating layer formed thereon
11/06/2003WO2003091377A1 Non-corrosive cleaning compositions for removing etch residues
11/06/2003WO2003091376A1 Oxalic acid as a cleaning product for aluminium, copper and dielectric surfaces
11/06/2003WO2003091173A2 Capping layer for crystallizing germanium, and substrate having thin crystallized germanium layer
11/06/2003WO2003090987A1 Method of manufacturing ceramic laminated body
11/06/2003WO2003090965A1 Polishing method, polishing device, and method of manufacturing semiconductor equipment
11/06/2003WO2003090964A1 Polishing system and polishing method
11/06/2003WO2003090942A1 Composition and method for removing photoresist materials from elelectronic components
11/06/2003WO2003090792A2 Method and apparatus for treating a substrate with an ozone-solvent solution iii
11/06/2003WO2003077618A3 Attachment of surface mount devices to printed circuit boards using a thermoplastic adhesive
11/06/2003WO2003071585A3 High voltage power mosfet having low on-resistance
11/06/2003WO2003065423A3 Electroless deposition apparatus and method
11/06/2003WO2003065417A3 Charge controlled avalanche photodiode and method of making the same
11/06/2003WO2003063218A3 Method for forming shallow junctions by ion implantation in silicon wafers
11/06/2003WO2003056625A3 Wirebond structure and method of wire bonding a microelectronic die
11/06/2003WO2003052812A3 Non volatile memory cell with a trench transistor
11/06/2003WO2003050853A3 A method of forming a silicon nitride layer on a substrate
11/06/2003WO2003046531A3 Method for detecting defects in substrates
11/06/2003WO2003043078A3 Preferential corner rounding of trench structures using post-fill oxidation
11/06/2003WO2003041185A3 Organic thin film transistor with polymeric interface
11/06/2003WO2003041126A3 Electrochemical mechanical processing with advancible sweeper
11/06/2003WO2003041110A3 Method for molding a polymer surface
11/06/2003WO2003038875A3 Method for photolithographic structuring by means of a carbon hard mask layer which has a diamond-like hardness and is deposited by means of a plasma method
11/06/2003WO2003038386A3 Real-time component monitoring and replenishment system for multicomponent fluids
11/06/2003WO2003036702A3 Integrated circuit having interconnect to a substrate and method therefor
11/06/2003WO2003034469A3 Method of fabricating a device having a desired non-planar surface or profile and device produced thereby
11/06/2003WO2003032375A3 System and method for process monitoring of polysilicon etch
11/06/2003WO2003032370A3 Stacked packages
11/06/2003WO2003028094A3 Method of self-assembly of electronic or optical components using an adhesive
11/06/2003WO2003028085A3 Method for producing a ceramic substrate
11/06/2003WO2003021727A3 Line selected f2 two chamber laser system
11/06/2003WO2003021690A3 Method of depositing an oxide layer on a substrate and a photovoltaic cell using said substrate
11/06/2003WO2003021636A3 Electronic devices and methods of manufacture
11/06/2003WO2003019568A3 Control device for reversing the direction of magnetisation without an external magnetic field
11/06/2003WO2003015180A3 Mis device having a trench gate electrode and method of making the same
11/06/2003WO2003015138A3 Optimized buried-channel fets based on sige heterostructures
11/06/2003WO2003009339A3 Graded base gaassb for high speed gaas hbt
11/06/2003WO2003008140A3 Apparatus for processing a workpiece
11/06/2003WO2003005434A3 Method for reducing surface rugosity of a semiconductor slice
11/06/2003WO2003005418A3 Assembly for manipulating and/or storing a mask and/or a substrate
11/06/2003WO2003001565A3 Method for improved die release of a semiconductor device from a wafer
11/06/2003WO2002099898A3 Integrated circuit for optical clock signal distribution
11/06/2003WO2002097863A3 Method for manufacturing contacts for a chalcogenide memory device
11/06/2003WO2002089182A3 Recessed gat dram transistor and method
11/06/2003WO2002086904A3 Vertical transistor trench capacitor memory cell and method of making the same
11/06/2003WO2002084722A3 Detachable substrate with controlled mechanical hold and method for production thereof
11/06/2003WO2002084721A3 Detachable substrate or detachable structure and method for the production thereof
11/06/2003WO2002082534A3 Method and apparatus for incorporating in-situ sensors
11/06/2003WO2002082502A3 Method for selectively transferring at least an element from an initial support onto a final support
11/06/2003WO2002077716A3 Scanning probe based lithographic alignment
11/06/2003WO2002077484A3 Method and device for vibration control
11/06/2003WO2002075926A3 Antifuse reroute of dies
11/06/2003WO2002073620A3 Reference for mram cell
11/06/2003WO2002071446A3 Method and apparatus for active temperature control of susceptors
11/06/2003WO2002062527A8 Abrasive article suitable for modifying a semiconductor wafer
11/06/2003WO2002061819A3 Method for ultra thin film formation
11/06/2003WO2002054446A3 Barbed vias for electrical and mechanical connection between conductive layers in semiconductor devices
11/06/2003WO2002044814A3 Photoresist compositions comprising bases and surfactants for microlithography
11/06/2003WO2002041378A3 Semiconductor structure and process for fabricating same
11/06/2003WO2002041362A9 Laser separated die with tapered sidewalls for improved light extraction
11/06/2003WO2002003141A8 Network-based photomask data entry interface and instruction generator for manufacturing photomasks
11/06/2003WO2001041188A3 Process chamber cooling
11/06/2003US20030208731 Semiconductor inspecting system, semiconductor defect analyzing system, semiconductor design data modifying system, semiconductor inspecting method, semiconductor defect analyzing method, semiconductor design data modifying method, and computer readable recorded medium
11/06/2003US20030208728 Method and system for simulating resist and etch edges
11/06/2003US20030208725 Method of designing semiconductor integrated circuit device and semiconductor integrated circuit device
11/06/2003US20030208455 Method for classifying a substrate
11/06/2003US20030208337 Apparatus for analyzing a failure of a semiconductor device and method therefor
11/06/2003US20030207778 Copper polishing cleaning solution
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