Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2003
11/13/2003WO2003094182A1 Method of forming mram devices
11/13/2003WO2003094170A2 Layout for thermally selected cross-point mram cell
11/13/2003WO2003093905A1 Photodetector and exposure system
11/13/2003WO2003093904A1 Projection lens comprising an extremely high aperture
11/13/2003WO2003093903A2 Projection method comprising pupillary filtration and a projection lens therefor
11/13/2003WO2003093902A2 Lighting system, particularly for use in extreme ultraviolet (euv) lithography
11/13/2003WO2003093880A1 Method for producing an optical element from a quartz substrate
11/13/2003WO2003093845A2 Semiconductor test system having multitasking algorithmic pattern generator
11/13/2003WO2003093540A1 Device for the production of crystal rods having a defined cross-section and column-shaped polycrystalline structure by means of floating-zone continuous crystallization
11/13/2003WO2003093524A2 Apparatus and method for regulating the electrical power applied to a substrate during immersion
11/13/2003WO2003093494A2 Apparatus including ion transport detecting structures and methods of use
11/13/2003WO2003093118A1 Chemical mix and delivery systems and methods thereof
11/13/2003WO2003092945A1 Electrolytic polishing liquid, electrolytic polishing method and method for fabricating semiconductor device
11/13/2003WO2003092944A1 Polishing method and polishing system, and method for fabricating semiconductor device
11/13/2003WO2003083429A8 A novel highly-integrated flash memory and mask rom array architecture
11/13/2003WO2003075096A3 Refractive projection lens
11/13/2003WO2003071511A3 Active matrix type organic electroluminescent display device and method of manufacturing the same
11/13/2003WO2003068699A8 Group iii nitride semiconductor crystal, production method thereof and group iii nitride semiconductor epitaxial wafer
11/13/2003WO2003067665A3 Cellular mosfet devices and their manufacture
11/13/2003WO2003067600A3 Antiferromagnetically stabilized pseudo spin valve for memory applications
11/13/2003WO2003066246B1 Capillary drying of substrates
11/13/2003WO2003065437A3 Method for forming high quality oxide layers of different thickness in one processing step
11/13/2003WO2003065419A3 Plasma etching of ni-containing materials
11/13/2003WO2003064962A9 Multi-axis interferometer
11/13/2003WO2003064544A3 Liquid crystal-templated conducting organic polymers
11/13/2003WO2003063245A3 Process condition sensing wafer and data analysis system
11/13/2003WO2003060980A3 Methods for planarization of group viii metal-containing surfaces using oxidizing gases
11/13/2003WO2003058683A3 Method for fabricating a high voltage power mosfet having a voltage sustaining region that includes doped columns formed by rapid diffusion
11/13/2003WO2003057702A3 Materials and methods for forming hybrid organic-inorganic dielectric materials
11/13/2003WO2003052800A3 Semiconductor wafer carrier mapping sensor
11/13/2003WO2003050883A3 Silicon on insulator device and method of making the same
11/13/2003WO2003050867A3 Planarity detection methods and apparatus for electrochemical mechanical processing systems
11/13/2003WO2003050587A3 Catadioptrical reduction lens
11/13/2003WO2003046961A3 Photolithographic method for forming a structure in a semiconductor substrate
11/13/2003WO2003042721A3 Trilayered beam mems device and related methods
11/13/2003WO2003041161A3 High frequency signal isolation in a semiconductor device
11/13/2003WO2003038873A3 Removing an amorphous oxide from a monocrystalline surface
11/13/2003WO2003036715A3 Adhesive wafers for die attach application
11/13/2003WO2003036693A3 Method and system to provide electrical contacts for electrotreating processes
11/13/2003WO2003034492A8 Apparatus and methods for semiconductor ic failure detection
11/13/2003WO2003033428A9 Recycle for supercritical carbon dioxide
11/13/2003WO2003031677B1 Method and device for depositing a plurality of layers on a substrate
11/13/2003WO2003030222A3 Tool for handling wafers and epitaxial growth station
11/13/2003WO2003026005A3 Formation of refractory metal nitrides using chemisorption techniques
11/13/2003WO2003019693A3 Solutions of organic semiconductors
11/13/2003WO2003019649A8 Strip conductor arrangement and method for producing a strip conductor arrangement
11/13/2003WO2003018252A3 Metal polishing
11/13/2003WO2003017328A3 Encapsulated integrated circuit package and method of manufacturing an integrated circuit package
11/13/2003WO2003011521B1 Electro-chemical polishing apparatus
11/13/2003WO2003009063A3 Real time analysis of periodic structures on semiconductors
11/13/2003WO2003007334A3 Semiconductor structures and devices for detecting chemical reactant
11/13/2003WO2003007129A3 Trajectory planning and motion control strategies for a planar three-degree-of-freedom robotic arm
11/13/2003WO2003003475A3 Semiconductor device comprising a mim capacitor and an interconnect structure
11/13/2003WO2002101793A3 Systems and methods for calibrating integrated inspection tools
11/13/2003WO2002101468A3 Design and layout of phase shifting photolithographic masks
11/13/2003WO2002101465A3 Phase conflict resolution for photolithographic masks
11/13/2003WO2002073687A3 Method of removing oxide from copper bond pads
11/13/2003WO2002069390A3 Grating test patterns and methods for overlay metrology
11/13/2003WO2002065516A3 Improved process for deposition of semiconductor films
11/13/2003WO2002058108A8 Wafer applied fluxing and underfill material, and layered electronic assemblies manufactured therewith
11/13/2003WO2002013226A8 Spatial light modulator driven photocathode source electron beam pattern generator
11/13/2003WO2002012948A9 Pneumatic control system and method for shaping deformable mirrors in lithographic projection systems
11/13/2003WO2001035440A8 Method and apparatus for electron beam column assembly with precise alignment using displaced semi-transparent membranes
11/13/2003US20030212979 Depopulated programmable logic array
11/13/2003US20030212977 Design method for gate array integrated circuit
11/13/2003US20030212966 Optimization of die placement on wafers
11/13/2003US20030212916 Semiconductor integrated circuit
11/13/2003US20030212687 Data archive recovery
11/13/2003US20030212525 Overlay measurements using periodic gratings
11/13/2003US20030212507 Real time mass flow control system with interlock
11/13/2003US20030212469 Method for automatically controlling defect -specification in a semiconductor manufacturing process
11/13/2003US20030211833 Radio architecture
11/13/2003US20030211815 Compositions and methods for dielectric CMP
11/13/2003US20030211814 Method for achieving uniform CU CMP polishing
11/13/2003US20030211813 Protection of work piece during surface processing
11/13/2003US20030211812 Substrate delivery method, a substrate delivery mechanism and a substrate polishing apparatus
11/13/2003US20030211761 Low cost integrated out-of-plane micro-device structures and method of making
11/13/2003US20030211758 Alignment mark shielding ring without arcing defect and method for using
11/13/2003US20030211757 Cleaning with an oil which is not a plasticizer
11/13/2003US20030211756 Film forming method, film forming apparatus, pattern forming method, and manufacturing method of semiconductor apparatus
11/13/2003US20030211755 Adjustment of N and K values in a darc film
11/13/2003US20030211754 Methods for use of pulsed voltage in a plasma reactor
11/13/2003US20030211753 Method of etching a trench in a silicon-on-insulator (SOI) structure
11/13/2003US20030211752 Method of smoothing a trench sidewall after a deep trench silicon etch process
11/13/2003US20030211751 Combined e-beam and optical exposure semiconductor lithography
11/13/2003US20030211750 Method of etching a trench in a silicon-containing dielectric material
11/13/2003US20030211749 Gas assisted method for applying resist stripper and gas-resist stripper combinations
11/13/2003US20030211748 Method of plasma etching of high-K dielectric materials
11/13/2003US20030211747 Shallow trench isolation polishing using mixed abrasive slurries
11/13/2003US20030211746 Dual damascene aperture formation method absent intermediate etch stop layer
11/13/2003US20030211745 Slurry and method for chemical mechanical polishing of copper
11/13/2003US20030211744 Method for preventing or reducing anodic cu corrosion during cmp
11/13/2003US20030211743 Method for avoiding slurry sedimentation in CMP slurry delivery systems
11/13/2003US20030211742 CMP process for a damascene pattern
11/13/2003US20030211741 Dielectric thin film, method for making the same and electric components thereof
11/13/2003US20030211740 Apparatus and method for manufacturing semiconductor devices
11/13/2003US20030211739 Method for forming micro groove structure
11/13/2003US20030211738 Method of detecting endpoint of etching
11/13/2003US20030211737 Semiconductor device and method of manufacturing same
11/13/2003US20030211736 Method for depositing tantalum silicide films by thermal chemical vapor deposition