Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2003
11/18/2003US6649426 System and method for active control of spacer deposition
11/18/2003US6649424 Method for fabricating an integrated semiconductor circuit having a strongly polarizable dielectric or ferroelectric
11/18/2003US6649423 Method for modifying switching field characteristics of magnetic tunnel junctions
11/18/2003US6649422 Integrated circuit having a micromagnetic device and method of manufacture therefor
11/18/2003US6649403 Method of preparing a sensor array
11/18/2003US6649327 Applying electroconductive polymer; masking; exposure to radiation; etching
11/18/2003US6649308 Ultra-short channel NMOSFETS with self-aligned silicide contact
11/18/2003US6649288 Nitride film
11/18/2003US6649287 Transistor, few or no cracks
11/18/2003US6649278 Process for fabricating films of uniform properties on semiconductor devices
11/18/2003US6649270 Jigs comprised of at least 50% silicon chloride for use in heat treatment of vitreous plates such as glass substrates for plasma display devices; porosity for easy removal of plate; low coefficient of thermal expansion for less warp
11/18/2003US6649253 Method of using films having optimized optical properties for chemical mechanical polishing endpoint detection
11/18/2003US6649219 Reacting one or more organofluorosilanes with an oxidizing agent
11/18/2003US6649218 Single substrate processing film forming method
11/18/2003US6649208 Thickness of the thin film being deposited on one or more substrates is continuously monitored enabling precise control of the thickness of the film
11/18/2003US6649077 Method and apparatus for removing coating layers from alignment marks on a wafer
11/18/2003US6649076 Method for performing plasma process on particles
11/18/2003US6649075 Method and apparatus for measuring etch uniformity of a semiconductor wafer
11/18/2003US6649073 Method for compensating for nonuniform etch profiles
11/18/2003US6649038 Electroplating method
11/18/2003US6649032 System and method for sputtering silicon films using hydrogen gas mixtures
11/18/2003US6649021 Apparatus and method for plasma processing high-speed semiconductor circuits with increased yield
11/18/2003US6649019 Apparatus for conditioning the atmosphere in a vacuum chamber
11/18/2003US6649017 Method of detaching article fixed through pressure sensitive adhesive double coated sheet
11/18/2003US6649012 Adhesion method and electronic component
11/18/2003US6648987 Method for producing nanostructures in thin films
11/18/2003US6648982 Steam cleaning system and method for semiconductor process equipment
11/18/2003US6648979 Of semiconductor wafers, pressing a sponge or brush against the wafer with a constant force applied using a bias; cleaning pressure from the cleaning sponge to the wafer, can be constant and is adjustable
11/18/2003US6648976 Apparatus and method for plasma processing
11/18/2003US6648974 Device and method for handling substrates by means of a self-leveling vacuum system in epitaxial induction
11/18/2003US6648740 Carrier head with a flexible membrane to form multiple chambers
11/18/2003US6648739 Wafer polishing apparatus
11/18/2003US6648736 Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads
11/18/2003US6648735 Method of abrading both faces of work piece
11/18/2003US6648731 Polishing pad conditioning apparatus in chemical mechanical polishing apparatus
11/18/2003US6648730 Calibration tool
11/18/2003US6648728 Polishing system
11/18/2003US6648654 Electrical connector
11/18/2003US6648588 Multiple sided robot blade for semiconductor processing equipment
11/18/2003US6648587 Material delivery system for clean room-like environments
11/18/2003US6648215 Method and apparatus for mounting semiconductor chips
11/18/2003US6648213 Solder balls and an underfill compound; chip assembly
11/18/2003US6648205 Method for the calibration of a wire bonder
11/18/2003US6648128 Conveyor, method for conveying a semiconductor wafer, and method for manufacturing a semiconductor device
11/18/2003US6648045 Chip bonding apparatus
11/18/2003US6648034 Purgeable manifold for low vapor pressure chemicals containers
11/18/2003US6648020 Fluid control apparatus and gas treatment system comprising same
11/18/2003US6647998 Electrostatic charge-free solvent-type dryer for semiconductor wafers
11/18/2003US6647996 Forcing the fluid through a plate having a plurality of slits arranged in rows
11/18/2003US6647995 Bombarding with electrons
11/18/2003US6647994 Method of resist stripping over low-k dielectric material
11/18/2003US6647993 Surface-treated shower head for use in a substrate processing chamber
11/18/2003US6647918 Double slit-valve doors for plasma processing
11/18/2003US6647791 Device for contactlessly gripping and positioning components
11/18/2003US6647759 Sensor micro-machined with electrolytic welding and method for making same
11/18/2003US6647665 Door systems for low contamination, high throughput handling of workpieces for vacuum processing
11/18/2003US6647642 Cleaning of wafers held by a rotor; nozzle for cleaning liquid and drying gas
11/18/2003US6647641 Device and method for the treatment of substrates in a fluid container
11/18/2003US6647632 Position measuring apparatus
11/18/2003US6647620 Method of making center bond flip chip semiconductor carrier
11/18/2003US6647616 Bump bonding unit with tray storage and transport apparatuses
11/18/2003US6647607 Auxiliary tool for assembling a scrubber
11/18/2003US6647579 Brush pressure control system for chemical and mechanical treatment of semiconductor surfaces
11/18/2003CA2102781C Method and apparatus for plasma deposition
11/13/2003WO2003094581A1 Method of generating extreme ultraviolet radiation
11/13/2003WO2003094335A1 Improved platen for electrostatic wafer clamping apparatus
11/13/2003WO2003094257A1 Silicon particles used as additives for improving the charge carrier mobility in organic semiconductors
11/13/2003WO2003094244A1 Electronic devices comprising bottom-gate tfts and their manufacture
11/13/2003WO2003094243A1 Metal gate electrode using silicidation and method of formation thereof
11/13/2003WO2003094241A1 Esd-robust power switch and method of using same
11/13/2003WO2003094240A1 High voltage switching devices and process for forming same
11/13/2003WO2003094239A1 Semiconductor device having strained silicon and silicon germanium alloy layers
11/13/2003WO2003094238A1 Integrating device
11/13/2003WO2003094237A1 Line element and method of manufacturing the line element
11/13/2003WO2003094234A2 Component
11/13/2003WO2003094233A1 Integrated circuit with integrated capacitor and methods for making same
11/13/2003WO2003094229A1 Method of producing electronic units
11/13/2003WO2003094228A1 Trench capacitor with enhanced capacity and method of fabrication same
11/13/2003WO2003094226A2 Contacting of nanotubes
11/13/2003WO2003094225A1 Method for filling a contact hole
11/13/2003WO2003094224A1 Process for manufacturing substrates with detachment of a temporary support, and associated substrate
11/13/2003WO2003094223A1 Method for measuring withstand voltage of semiconductor epitaxial wafer and semiconductor epitaxial wafer
11/13/2003WO2003094222A1 Bonding method and bonding device
11/13/2003WO2003094221A1 Encapsulation of an integrated circuit
11/13/2003WO2003094220A1 Submount and semiconductor device
11/13/2003WO2003094219A1 Method of making transistors
11/13/2003WO2003094218A2 Method of growing monocrystalline oxide having a semiconductor device thereon
11/13/2003WO2003094217A1 Method of etching silicon nitride spacers with high selectivity relative to oxide in a high density plasma chamber
11/13/2003WO2003094216A1 Polishing fluid and polishing method
11/13/2003WO2003094215A1 Semiconductor wafer manufacturing method and wafer
11/13/2003WO2003094214A1 Substrate for growing gallium nitride, method for preparing substrate for growing gallium nitride and method for preparing gallium nitride substrate
11/13/2003WO2003094213A1 Polymeric antireflective coatings deposited by plasma enhanced chemical vapor deposition
11/13/2003WO2003094212A1 Alignment system, alignment method and production method for semiconductor device
11/13/2003WO2003094211A1 Robot for handling semiconductor wafers
11/13/2003WO2003094210A1 Latch for detachably attaching and mounting a semiconductor wafer to a support ring
11/13/2003WO2003094209A2 Use of conductive electrolessly deposided etch stop layers, liner layers and via plugs in interconnect structures
11/13/2003WO2003094208A2 Method of isolating adjacent components of a semiconductor device
11/13/2003WO2003094207A1 Die head for hardening adhesive compounds by thermocompression
11/13/2003WO2003094204A2 Short channel trench power mosfet with low threshold voltage
11/13/2003WO2003094200A2 Low voltage high density trench-gated power device with uniformly doped channel and its edge termination technique
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