Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2003
11/13/2003US20030210534 Integrated circuit die and an electronic assembly having a three-dimensional interconnection scheme
11/13/2003US20030210531 Method of forming an apparatus to reduce thermal fatigue stress on flip chip solder connections
11/13/2003US20030210510 Dynamic dechucking
11/13/2003US20030210484 Mask, substrate with light reflecting film, method for manufacturing light reflecting film, optical display device, and electronic apparatus
11/13/2003US20030210458 Method and device for decontaminating optical surfaces
11/13/2003US20030210408 Method of measuring thickness of layer
11/13/2003US20030210391 Method and apparatus for inspecting pattern defects
11/13/2003US20030210388 Projection exposure apparatus using wavefront detection
11/13/2003US20030210357 Contact structure
11/13/2003US20030210089 Boosted voltage generating circuit and semiconductor memory device having the same
11/13/2003US20030210075 Semiconductor integrated circuit capable of high-speed circuit operation
11/13/2003US20030210069 Semiconductor device, and the method of testing or making of the semiconductor device
11/13/2003US20030210068 Apparatus of testing semiconductor
11/13/2003US20030210066 Apparatus and method for determining electrical properties of a semiconductor wafer
11/13/2003US20030210063 Contact probe with guide unit and fabrication method thereof
11/13/2003US20030210062 Method of testing semiconductor device
11/13/2003US20030210058 Electrical print resolution test die
11/13/2003US20030210033 System for evaluating probing networks
11/13/2003US20030209971 Programmable structure, an array including the structure, and methods of forming the same
11/13/2003US20030209847 Handling device comprising multiple immobilization segments
11/13/2003US20030209837 Underfill and encapsulation of carrier substrate-mounted flip-chip components using stereolithography
11/13/2003US20030209817 Apparatus and method for molding simultaneously a plurality of semiconductor devices
11/13/2003US20030209816 Semiconductor device and method of manufacturing the same
11/13/2003US20030209815 Semiconductor device and its manufacturing method
11/13/2003US20030209814 Method of alignment for buried structures formed by surface transformation of empty spaces in solid state materials
11/13/2003US20030209813 Semiconductor device and manufacturing method of the same
11/13/2003US20030209811 Semiconductor device and method of formation
11/13/2003US20030209810 Gold-silver bonding wire for semiconductor device
11/13/2003US20030209809 Power distribution design method for stacked flip-chip packages
11/13/2003US20030209808 Semiconductor device having semiconductor chips mounted on package substrate
11/13/2003US20030209807 Organic substrate for flip chip bonding
11/13/2003US20030209806 Method for manufacturing semiconductor device
11/13/2003US20030209805 Flourine doped SiO2 film and method of fabrication
11/13/2003US20030209802 Semiconductor device and method for fabricating the same
11/13/2003US20030209801 Reactive solder material
11/13/2003US20030209800 Stacked fin heat sink and method of making
11/13/2003US20030209799 Copper plated PTH barrels and methods for fabricating
11/13/2003US20030209792 Spherical shaped semiconductor device, a flexible printed wiring substrate, and mounting method thereof
11/13/2003US20030209791 Semiconductor structure having stacked semiconductor devices
11/13/2003US20030209788 Semiconductor device with chamfered substrate and method of making the same
11/13/2003US20030209782 Method and apparatus on (110) surfaces of silicon structures with conduction in the <110> direction
11/13/2003US20030209781 Semiconductor power device
11/13/2003US20030209779 Multiple thickness semiconductor interconnect and method therefor
11/13/2003US20030209778 Capacitors
11/13/2003US20030209776 Semiconductor device having an interconnect that electrically connects a conductive material and a doped layer, and a method of manufacture therefor
11/13/2003US20030209775 Methods and structures for metal interconnections in integrated circuits
11/13/2003US20030209767 Forming channels; diffusion of impurities; forming silicide
11/13/2003US20030209765 All-in-one disposable/permanent spacer elevated source/drain, self-aligned silicide CMOS
11/13/2003US20030209764 Semiconductor device
11/13/2003US20030209763 Semiconductor device and method for fabricating the same
11/13/2003US20030209762 Semiconductor device and method for fabricating the same
11/13/2003US20030209761 Semiconductor device and manufacturing method thereof
11/13/2003US20030209760 Semiconductor integrated circuit and method of fabricating the same
11/13/2003US20030209759 Mosfet device having geometry that permits frequent body contact
11/13/2003US20030209758 Transistor of semiconductor device, and method for forming the same
11/13/2003US20030209756 Semiconductor memory reducing current consumption and narrow channel effect and method of manufacturing the same
11/13/2003US20030209755 Vertical split gate flash memory cell and method for fabricating the same
11/13/2003US20030209754 Two bit non-volatile electrically erasable and programmable memory structure, a process for producing said memory structure and methods for programming, reading and erasing said memory structure
11/13/2003US20030209753 Nonvolatile semiconductor memory device and method for manufacturing the same
11/13/2003US20030209752 EEPROM device with substrate hot-electron injector for low-power
11/13/2003US20030209751 Computer; intakes, drains diffusion zones; channel segments
11/13/2003US20030209750 Semiconductor layer with laterally variable doping, and method for producing it
11/13/2003US20030209749 Ferroelectric capacitor and a method for manufacturing thereof
11/13/2003US20030209748 Dielectric cure for reducing oxygen vacancies
11/13/2003US20030209747 Multilayer; overcoating substrate with electrode, dielectric, electrode
11/13/2003US20030209745 Tailored insulator properties for devices
11/13/2003US20030209742 Semiconductor device and method for manufacturing the same
11/13/2003US20030209739 Vertical semiconductor device with tunnel insulator in current path controlled by gate electrode
11/13/2003US20030209738 Semiconductor device having silicon-including metal wiring layer and its manufacturing method
11/13/2003US20030209737 Thin film transistor, method for manufacturing same, and liquid crystal display device using same
11/13/2003US20030209735 IT-CCD and manufacturing method thereof
11/13/2003US20030209733 Semiconductor integrated circuit having high-density base cell array
11/13/2003US20030209729 Fabrication of low resistance, non-alloyed, ohmic contacts to InP using non-stoichiometric InP layers
11/13/2003US20030209727 Semiconductor integrated circuit
11/13/2003US20030209726 Array substrate used for a display device and a method of making the same
11/13/2003US20030209725 Semiconductor memory device using ferroelectric film
11/13/2003US20030209723 Gallium nitride-based compound semiconductor device
11/13/2003US20030209720 Multilayer; intermetallics overcoating sapphire substrate
11/13/2003US20030209719 Susceptor for MOCVD reactor
11/13/2003US20030209715 Semiconductor device with ohmic electrode formed on compound semiconductor having wide band gap and its manufacture method
11/13/2003US20030209713 Transferring, connecting pad chip to substrates; adjustment width
11/13/2003US20030209711 Thin film transistor and fabricating method thereof
11/13/2003US20030209710 Semiconductor device and method of manufacturing the semiconductor device
11/13/2003US20030209709 Display device with an improved contact hole arrangement for contacting a semiconductor layer through an insulation film
11/13/2003US20030209703 Ferritin; controlling particle size; combustion ; forming metal aggregate
11/13/2003US20030209702 Internal hydrogen sources for heat conductive packaging of low dielectric constant semiconductor chips, and method of providing hydrogen therefor
11/13/2003US20030209677 Integral lens for high energy particle flow, method for producing such lenses and use thereof in analysis devices and devices for radiation therapy and lithography
11/13/2003US20030209673 Electrooptic system array, charged-particle beam exposure apparatus using the same, and device manufacturing method
11/13/2003US20030209667 Charged particle beam apparatus and method for inspecting samples
11/13/2003US20030209646 Snubber for pneumatically isolated platforms
11/13/2003US20030209590 SMT passive device noflow underfill methodology and structure
11/13/2003US20030209585 Conductive powder applying device immersing substrate into conductive powder by rotating tank including conductive powder and substrate at opposing positions
11/13/2003US20030209560 Dispensation of controlled quantities of material onto a substrate
11/13/2003US20030209528 Laser cutting apparatus and method
11/13/2003US20030209523 Planarization by chemical polishing for ULSI applications
11/13/2003US20030209522 CMP composition containing silane-modified abrasive particles
11/13/2003US20030209520 Etching using mixture of carbon monoxide, carbon dioxide and sulfur dioxide
11/13/2003US20030209519 Layer-by-layer etching apparatus using neutral beam and method of etching using the same
11/13/2003US20030209515 adhesive film contains a polycarbodiimide copolymer with butadiene and optionally acrylonitrile units, and maintains a high thermal resistance and also has a low elastic modulus; use as a sealing resin layer between the wiring circuit board and the semiconductor element
11/13/2003US20030209514 Etching composition and use thereof with feedback control of HF in BEOL clean
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