Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2003
11/04/2003US6641382 Resin encapsulation mold
11/04/2003US6641350 Dual loading port semiconductor processing equipment
11/04/2003US6641349 Clean box, clean transfer method and system
11/04/2003US6641348 Docking station for substrate transport containers
11/04/2003US6641302 Thermal process apparatus for a semiconductor substrate
11/04/2003US6641030 Method and apparatus for placing solder balls on a substrate
11/04/2003US6640840 Delivery of liquid precursors to semiconductor processing reactors
11/04/2003US6640822 System and method of operation of a digital mass flow controller
11/04/2003US6640816 Method for post chemical-mechanical planarization cleaning of semiconductor wafers
11/04/2003US6640436 Method of fabricating a coated metallic wire, method of removing insulation from the coated metallic wire and method of fabricating a semiconductor device with the wire
11/04/2003US6640433 Forming organic thin film by building up of monomolecular film, baking to produce amorphous carbon or graphite, microcutting, applying electroconductive film
11/04/2003US6640423 Apparatus and method for the placement and bonding of a die on a substrate
11/04/2003US6640415 Segmented contactor
11/04/2003US6640403 Method for forming a dielectric-constant-enchanced capacitor
11/04/2003CA2292769C A titanium nitride diffusion barrier for use in non-silicon technologies and metallization method
10/2003
10/30/2003WO2003090445A2 Wide bandgap digital radiation imaging array
10/30/2003WO2003090347A2 Acoustic wave sensor apparatus, method and system using wide bandgap materials
10/30/2003WO2003090284A1 Self-assembled nanobump array structures and a method to fabricate such structures
10/30/2003WO2003090283A2 Semiconductor component comprising an integrated capacitor structure that has a plurality of metallization planes
10/30/2003WO2003090280A1 Semiconductor component having an integrated capacitance structure and method for producing the same
10/30/2003WO2003090279A1 Semiconductor component comprising an integrated latticed capacitance structure
10/30/2003WO2003090276A2 Method for the production of contact pads on a substrate and device for carrying out said method
10/30/2003WO2003090275A1 Methods used in fabricating gates in integrated circuit device structures
10/30/2003WO2003090274A2 Method for reducing the resistivity of p-type ii-vi and iii-v semiconductors
10/30/2003WO2003090273A1 Method for producing a sub-lithographic mask
10/30/2003WO2003090272A2 Methods for the formation of thin film layers using short-time thermal processes
10/30/2003WO2003090271A1 Film formation method
10/30/2003WO2003090270A1 Method for removing photoresist and etch residues
10/30/2003WO2003090269A1 Method for ashing
10/30/2003WO2003090268A1 Method of treating substrate and process for producing semiconductor device
10/30/2003WO2003090267A1 Method for removing photoresist and etch residues
10/30/2003WO2003090266A1 Methods of manufacturing thin-film device and transistor, electro-optical device, and electronic equipment
10/30/2003WO2003090264A1 Semiconductor processing system
10/30/2003WO2003090263A1 Silicon parts for plasma reaction chambers
10/30/2003WO2003090262A1 Apparatus and method for semiconductor wafer test yield enhancement
10/30/2003WO2003090260A2 Apparatus for depositing a multilayer coating on discrete sheets
10/30/2003WO2003090258A2 Laser machining
10/30/2003WO2003090257A2 Method for the production of thin metal-containing layers having low electrical resistance
10/30/2003WO2003090256A2 Method and apparatus for connecting vertically stacked integrated circuit chips
10/30/2003WO2003090253A2 Single axis manipulator with controlled compliance
10/30/2003WO2003089992A1 Antireflective sio-containing compositions for hardmask layer
10/30/2003WO2003089964A1 Reflection element of exposure light and production method therefor, mask, exposure system, and production method of semiconductor device
10/30/2003WO2003089696A1 Dislocation reduction in non-polar gallium nitride thin films
10/30/2003WO2003089695A1 Non-polar a-plane gallium nitride thin films grown by metalorganic chemical vapor deposition
10/30/2003WO2003089694A1 NON-POLAR (A1,B,In,Ga) QUANTUM WELL AND HETEROSTRUCTURE MATERIALS AND DEVICES
10/30/2003WO2003089684A2 Method and device for depositing thin layers on a substrate in a height-adjustable process chamber
10/30/2003WO2003089683A1 Apparatus and method for depositing thin film on wafer using remote plasma
10/30/2003WO2003089682A1 System for depositing a film onto a substrate using a low vapor pressure gas precursor
10/30/2003WO2003089681A2 Mixed frequency high temperature nitride cvd process
10/30/2003WO2003089680A2 Process modules for transport polymerization of low dieletric constant thin films
10/30/2003WO2003089519A1 Polysulfone compositions exhibiting very low color and high light transmittance properties and articles made therefrom
10/30/2003WO2003089515A1 Organic semiconductor composition, organic semiconductor element, and process for producing the same
10/30/2003WO2003089191A1 Method and device for the chemical-mechanical polishing of workpieces
10/30/2003WO2003089184A1 Thermal flux processing by scanning electromagnetic radiation
10/30/2003WO2003067648A3 Semiconductor device and method of manufacturing the same
10/30/2003WO2003063202A3 Field effect transistor having source and/or drain forming schottky or schottky-like contact with strained semiconductor substrate
10/30/2003WO2003063199A3 Apparatus and method for etching the edges of semiconductor wafers
10/30/2003WO2003061011A3 Non-volatile two-transistor semiconductor memory cell
10/30/2003WO2003058690A3 Deposition of tungsten for the formation of conformal tungsten silicide
10/30/2003WO2003057405A8 Grooved rollers for a linear chemical mechanical planarization system
10/30/2003WO2003054911A3 Plasma process apparatus
10/30/2003WO2003047306A3 Radial power megasonic transducer
10/30/2003WO2003046979A3 Method of using ternary copper alloy to obtain a low resistance and large grain size interconnect
10/30/2003WO2003046978A3 Method of implantation after copper seed deposition
10/30/2003WO2003046947A3 Bipolar transistor
10/30/2003WO2003044841A3 Method of dicing a complex topologically structured wafer
10/30/2003WO2003044839A3 Formation of high-mobility silicon-germanium structures by low-energy plasma enhanced chemical vapor deposition
10/30/2003WO2003043780B1 Method for polishing a substrate surface
10/30/2003WO2003043076A3 Surface protective sheet for use in wafer back grinding and process for producing semiconductor chip
10/30/2003WO2003043057B1 Synthesis strategies based on the appropriate use of inductance effects
10/30/2003WO2003038899A3 Semiconductor structure with a coil underneath the first wiring layer or between two wiring layers
10/30/2003WO2003038888A3 Method and apparatus for cascade control using integrated metrology
10/30/2003WO2003038864B1 Magneto-resistive bit structure and method of manufacturing therefor
10/30/2003WO2003038153A8 Process for low temperature, dry etching, and dry planarization of copper
10/30/2003WO2003036681A3 Methods and apparatus for plasma doping by anode pulsing
10/30/2003WO2003032406A3 A process for large-scale production of cdte/cds thin film solar cells
10/30/2003WO2003027003A3 Methods of nanotube films and articles
10/30/2003WO2003015489A3 Apparatus and method for mounting electronic parts
10/30/2003WO2003015163A3 Method for the parallel production of an mos transistor and a bipolar transistor
10/30/2003WO2003015162A3 Method for the parallel production of an mos transistor and a bipolar transistor
10/30/2003WO2003012499A8 Semiconductor multi-path wave guide to concurrently route signals
10/30/2003WO2003009360A3 Method and apparatus for depositing tungsten after surface treatment to improve film characteristics
10/30/2003WO2003005377A3 Passivating overcoat bilayer
10/30/2003WO2003003472A3 Transistor-arrangement, method for operating a transistor-arrangement as a data storage element and method for producing a transistor-arrangement
10/30/2003WO2003003072A3 Optical element and manufacturing method therefor
10/30/2003WO2003001582A3 Microelectronic substrate having conductive material with blunt cornered apertures, and associated methods for removing conductive material
10/30/2003WO2003001581A3 Methods and apparatus for electrical, mechanical and/or chemical removal of conductive material from a microelectronic substrate
10/30/2003WO2002101792A3 Method and apparatus for alignment of automated workpiece handling systems
10/30/2003WO2002095829A3 Non-volatile memory cells utilizing substrate trenches
10/30/2003WO2002095801A3 Improved connection assembly for integrated circuit sensors
10/30/2003WO2002084312A3 Measuring back-side voltage of an integrated circuit
10/30/2003WO2002082558A3 Method for producing a semiconductor circuit and semiconductor circuits produced according to said method
10/30/2003WO2002071611A3 Monotonic dynamic-static pseudo-nmos logic circuit and method of forming a logic gate array
10/30/2003WO2002071471A3 Traceless flip chip assembly & method
10/30/2003WO2002069372A3 Self-coplanarity bumping shape for flip chip
10/30/2003WO2002068321A3 Forming tool for forming a contoured microelectronic spring mold
10/30/2003WO2002065517A3 Deposition method over mixed substrates using trisilane
10/30/2003WO2002046839A3 Laser plasma from metals and nano-size particles
10/30/2003WO2002043115A8 Surface preparation prior to deposition
10/30/2003WO2002023595A3 A method for forming a semiconductor device, and a semiconductor device formed by the method
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