Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2003
10/30/2003WO2002019033A3 Photoacid generators and photoresists comprising same
10/30/2003WO2002018101A9 Chemical mechanical polishing (cmp) head, apparatus, and method and planarized semiconductor wafer produced thereby
10/30/2003WO2002017387A9 Conductive material patterning methods
10/30/2003WO2001035718A3 System and method for product yield prediction
10/30/2003US20030204832 Automatic generation method of dummy patterns
10/30/2003US20030204829 Macro design techniques to accommodate chip level wiring and circuit placement across the macro
10/30/2003US20030204828 Method for calculation of cell delay time and method for layout optimization of semiconductor integrated circuit
10/30/2003US20030204827 Method of performing timing-driven layout
10/30/2003US20030204826 Inspection method and inspection system using charged particle beam
10/30/2003US20030204822 Digital logic optimization using selection operators
10/30/2003US20030204802 Multiple scan chains with pin sharing
10/30/2003US20030204795 Testing of ECC memories
10/30/2003US20030204783 Repair analyzer of dram in semiconductor integrated circuit using built-in CPU
10/30/2003US20030204528 Semiconductor wafer manufacturing execution system with special engineer requirement database
10/30/2003US20030204488 Management system, management method and apparatus, and management apparatus control method
10/30/2003US20030204340 Power supply voltage fluctuation analyzing method
10/30/2003US20030204326 Real time analysis of periodic structures on semiconductors
10/30/2003US20030204282 Management system and apparatus, method therefor, and device manufacturing method
10/30/2003US20030204281 Semiconductor wafer manufacturing execution system with recipe distribution management database
10/30/2003US20030204280 Method for manufacturing semiconductor device, semiconductor manufacturing apparatus, and method for controlling transfer in production line
10/30/2003US20030203804 Aluminum nitride materials and members used for the production of semiconductors
10/30/2003US20030203706 Method for preventing localized Cu corrosion during CMP
10/30/2003US20030203705 Chemical-mechanical polishing slurry with improved defectivity
10/30/2003US20030203683 Probe card
10/30/2003US20030203678 Method and apparatus for forming modular sockets using flexible interconnects and resulting structures
10/30/2003US20030203661 Connection terminals and manufacturing method of the same, semiconductor device and manufacturing method of the same
10/30/2003US20030203657 SOI annealing method
10/30/2003US20030203656 Semiconductor device, manufacturing method thereof, and electronic device
10/30/2003US20030203655 Method of forming interlayer insulating film
10/30/2003US20030203654 Method for improving thickness uniformity of deposited ozone-teos silicate glass layers
10/30/2003US20030203653 Nitrogen-rich barrier layer and structures formed
10/30/2003US20030203652 Method for forming a carbon doped oxide low-k insulating layer
10/30/2003US20030203650 Method and apparatus for shaping thin films in the near-edge regions of in-process semiconductor substrates
10/30/2003US20030203649 Method of fabricating one or more tiers of an integrated circuit
10/30/2003US20030203648 Plasma polymerized electron beam resist
10/30/2003US20030203647 Promoting adhesion of fluoropolymer films to semiconductor substrates
10/30/2003US20030203646 Process for manufacturing semiconductor integrated circuit device including treatment of gas used in the process
10/30/2003US20030203645 Method for forming thin film heads using a bi-layer anti-reflection coating for photolithographic applications and a structure thereof
10/30/2003US20030203644 Methods for preventing cross-linking between multiple resists and patterning multiple resists
10/30/2003US20030203643 Method and apparatus for fabricating a device, and the device and an electronic equipment
10/30/2003US20030203642 Method for photoresist strip, sidewall polymer removal and passivation for aluminum metallization
10/30/2003US20030203641 Plasma treatment apparatus and method of producing semiconductor device using the apparatus
10/30/2003US20030203640 Plasma etching apparatus
10/30/2003US20030203639 Etchant with selectivity for doped silicon dioxide over undoped silicon dioxide and silicon nitride, processes which employ the etchant, and structures formed thereby
10/30/2003US20030203637 Method for high aspect ratio HDP CVD gapfill
10/30/2003US20030203636 Method of fabricating high density sub-lithographic features on a substrate
10/30/2003US20030203635 Polishing composition for metal CMP
10/30/2003US20030203634 Polishing agent and polishing method
10/30/2003US20030203633 Methods for forming capacitor structures; and methods for removal of organic materials
10/30/2003US20030203632 Etchant used in the manufacture of semiconductor devices and etching method using the same
10/30/2003US20030203631 Method of etching silicon nitride film and method of producing semiconductor device
10/30/2003US20030203630 Removal of copper oxides from integrated interconnects
10/30/2003US20030203629 Method for fabricating nitride semiconductor, method for fabricating nitride semiconductor device, and nitride semiconductor device
10/30/2003US20030203628 Integrated circuitry
10/30/2003US20030203627 Method for fabricating thin film transistor
10/30/2003US20030203625 Method of preventing tungsten plugs from corrosion
10/30/2003US20030203624 Manufacturing method of semiconductor device
10/30/2003US20030203623 Substrate conductive post formation
10/30/2003US20030203622 Low via resistance system
10/30/2003US20030203621 Method for coating a semiconductor substrate with a mixture containing an adhesion promoter
10/30/2003US20030203620 Ion beam dual damascene process
10/30/2003US20030203619 Method of manufacturing semiconductor device
10/30/2003US20030203618 Manufacturing method for semiconductor device
10/30/2003US20030203617 Process of forming copper structures
10/30/2003US20030203616 Atomic layer deposition of tungsten barrier layers using tungsten carbonyls and boranes for copper metallization
10/30/2003US20030203615 Method for depositing barrier layers in an opening
10/30/2003US20030203614 Method for forming silicon containing layers on a substrate
10/30/2003US20030203613 Method and apparatus for fabricating self-aligned contacts in an integrated circuit
10/30/2003US20030203612 Collar positionable about a periphery of a contact pad and around a conductive structure secured to the contact pads, semiconductor device components including same, and methods for fabricating same
10/30/2003US20030203611 Method of manufacturing a dual gate semiconductor device with a poly-metal electrode
10/30/2003US20030203610 Semiconductor processing method
10/30/2003US20030203609 Metal gate electrode using silicidation and method of formation thereof
10/30/2003US20030203608 Fabrication of semiconductor devices with transition metal boride films as diffusion barriers
10/30/2003US20030203607 Method of manufacturing a portion of a memory
10/30/2003US20030203606 Method for manufacturing a semiconductor device
10/30/2003US20030203605 Semiconductor device having MISFETs
10/30/2003US20030203604 Methods of fabricating layered structure and semiconductor device
10/30/2003US20030203603 Method and apparatus for self-doping contacts to a semiconductor
10/30/2003US20030203602 Method of fabricating a semiconductor device
10/30/2003US20030203601 Method for manufacturing semiconductor thin film, and magnetoelectric conversion element provided with semiconductor thin film thereby manufactured
10/30/2003US20030203600 Strained Si based layer made by UHV-CVD, and devices therein
10/30/2003US20030203599 Semiconductor wafer and method for fabricating the same
10/30/2003US20030203598 Method for manufacturing optoelectronic material
10/30/2003US20030203597 Method and apparatus for peeling protective sheet
10/30/2003US20030203596 Manufacturing method of a high aspect ratio shallow trench isolation region
10/30/2003US20030203595 Method of filling isolation trenches in a substrate
10/30/2003US20030203594 Non-volatile semiconductor memory device and manufacturing method thereof
10/30/2003US20030203592 Forming openings within integrated circuits
10/30/2003US20030203591 Laser marking techniques
10/30/2003US20030203589 Method of wafer marking for multi-layer metal processes
10/30/2003US20030203588 Method for fabricating capacitor using electrochemical deposition
10/30/2003US20030203587 Vertical thermal nitride mask (anti-collar) and processing thereof
10/30/2003US20030203586 Production of metal insulator metal (MIM) structures using anodizing process
10/30/2003US20030203584 Method for forming a MIM (metal-insulator-metal) capacitor
10/30/2003US20030203583 Method and apparatus for a self-aligned heterojunction bipolar transistor using dielectric assisted metal liftoff process
10/30/2003US20030203582 Method of forming semiconductor device with bipolar transistor having lateral structure
10/30/2003US20030203581 Capacitor constructions comprising a nitrogen-containing layer over a rugged polysilicon layer
10/30/2003US20030203580 Application of single exposure alternating aperture phase shift mask to form sub 0.18 micron polysilicon gates
10/30/2003US20030203579 Method of fabricating mosfet transistors with multiple threshold voltages by halo compensation and masks
10/30/2003US20030203578 Hydrogen anneal before gate oxidation
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