Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2003
11/25/2003US6653218 Method of fabricating resin-encapsulated semiconductor device
11/25/2003US6653217 Method of connecting a conductive trace to a semiconductor chip
11/25/2003US6653216 Transparent electrode forming apparatus and method of fabricating active matrix substrate
11/25/2003US6653214 Measured via-hole etching
11/25/2003US6653213 Structure and method for doping of III-V compounds
11/25/2003US6653211 Semiconductor substrate, SOI substrate and manufacturing method therefor
11/25/2003US6653210 Method and apparatus for cutting a non-metallic substrate using a laser beam
11/25/2003US6653209 Method of producing silicon thin film, method of constructing SOI substrate and semiconductor device
11/25/2003US6653208 Wafer on wafer packaging and method of fabrication for full-wafer burn-in and testing
11/25/2003US6653207 Process for the production of electric part
11/25/2003US6653206 Method and apparatus for processing composite member
11/25/2003US6653205 Applying a force asymmetric with respect to the interface between first and second members, to the end portion of the composite member to form a crack; growing crack along the separation layer to separate the member; silicon on insulator
11/25/2003US6653204 Method of forming a shallow trench isolation structure
11/25/2003US6653203 Thin sidewall multi-step HDP deposition method to achieve completely filled high aspect ratio trenches
11/25/2003US6653202 Method of shallow trench isolation (STI) formation using amorphous carbon
11/25/2003US6653201 Method for forming an isolation region in a semiconductor device
11/25/2003US6653200 Trench fill process for reducing stress in shallow trench isolation
11/25/2003US6653199 Multilayer; capacitor containers; dielectrics; high density integrated circuits
11/25/2003US6653198 Method for fabricating capacitor in semiconductor device and capacitor fabricated thereby
11/25/2003US6653197 Method for fabricating capacitor of semiconductor device
11/25/2003US6653196 Open pattern inductor
11/25/2003US6653194 Method for forming contact hole in semiconductor device
11/25/2003US6653192 Method of manufacturing semiconductor devices using nitrification
11/25/2003US6653191 Memory manufacturing process using bitline rapid thermal anneal
11/25/2003US6653190 Flash memory with controlled wordline width
11/25/2003US6653189 Source side boron implant and drain side MDD implant for deep sub 0.18 micron flash memory
11/25/2003US6653188 Method of forming poly tip of floating gate in split-gate memory
11/25/2003US6653187 Semiconductor processing methods
11/25/2003US6653186 Methods of fabrication integrated circuit capacitors having a dielectric layer between a u-shaped lower electrode and a support layer
11/25/2003US6653185 Method of providing trench walls by using two-step etching processes
11/25/2003US6653184 Method of forming transistors associated with semiconductor substrates comprising forming a nitrogen-comprising region across an oxide region of a transistor gate
11/25/2003US6653183 Single-poly EPROM and method for forming the same
11/25/2003US6653182 Process for forming deep and shallow insulative regions of an integrated circuit
11/25/2003US6653181 At least three layers of material are formed on the substrate, structure is selectively doped to form an n-type region and a p-type region in the structure
11/25/2003US6653180 Transistors including gate dielectric layers having different nitrogen concentrations and related structures
11/25/2003US6653179 Method for manufacturing a thin film semiconductor device, method for manufacturing a display device, method for manufacturing a thin film transistors, and method for forming a semiconductor thin film
11/25/2003US6653178 Thin film transistor and method for manufacturing the same
11/25/2003US6653177 Patterning method, thin film transistor matrix substrate manufacturing method, and exposure mask
11/25/2003US6653176 Method for manufacturing x-ray detector
11/25/2003US6653174 Thyristor-based device over substrate surface
11/25/2003US6653173 Method and apparatus for packaging a microelectronic die
11/25/2003US6653172 Methods for providing void-free layers for semiconductor assemblies
11/25/2003US6653171 Flip-chip type semiconductor device having split voids within under-fill layer and its manufacturing method
11/25/2003US6653170 Semiconductor chip assembly with elongated wire ball bonded to chip and electrolessly plated to support circuit
11/25/2003US6653169 Packaged semiconductor and process for manufacturing the same
11/25/2003US6653168 LSI package and internal connecting method used therefor
11/25/2003US6653167 Facilitating heat transfer from an integrated circuit package
11/25/2003US6653166 Semiconductor device and method of making same
11/25/2003US6653165 Adhesion; weatherproofing; high frequency plasma vapor deposition
11/25/2003US6653161 Method and apparatus for forming a capacitive structure including single crystal silicon
11/25/2003US6653160 Method of manufacturing array substrate for use in liquid crystal display device
11/25/2003US6653159 Glass transparent substrate; patterned overcoatings; pixel electrode; passivation layer
11/25/2003US6653156 Ferroelectric device with capping layer and method of making same
11/25/2003US6653155 Integrated circuit devices including a resistor pattern and methods for manufacturing the same
11/25/2003US6653154 Method of forming self-aligned, trenchless mangetoresistive random-access memory (MRAM) structure with sidewall containment of MRAM structure
11/25/2003US6653121 Masking silicon substrates; blasting; oxidation; Dna immobilization substrate
11/25/2003US6653058 Forming polymer layer over patterned photoresist mask, then plasma etching to remove both polymer layer and mask
11/25/2003US6653053 Overcoating semiconductor wafer; repairable; miniaturization resolution; photoresist pattern transfer
11/25/2003US6653052 Electron device manufacturing method, a pattern forming method, and a photomask used for those methods
11/25/2003US6653049 High conformality antireflective coating compositions
11/25/2003US6653048 High silicon content monomers and polymers suitable for 193 nm bilayer resists
11/25/2003US6653047 Photoresist monomers containing fluorine-substituted benzylcarboxylate and photoresist polymers comprising the same
11/25/2003US6653032 Exposure method
11/25/2003US6653030 Optical-mechanical feature fabrication during manufacture of semiconductors and other micro-devices and nano-devices that include micron and sub-micron features
11/25/2003US6653028 Radiation transparent substrate; sheild pattern
11/25/2003US6653026 Photolithography; integrated circuits; semiconductors
11/25/2003US6652989 Structure and method for controlling band offset and alignment at a crystalline oxide-on-semiconductor interface
11/25/2003US6652981 Etching process for making electrodes
11/25/2003US6652934 Silica glass crucible and method of fabricating thereof
11/25/2003US6652924 Sequential chemical vapor deposition
11/25/2003US6652922 Electron-beam processed films for microelectronics structures
11/25/2003US6652912 Increasing the uniformity of the viscous material coating such as spin on glass, photoresist, or spin on polymer on a wafer by varying the pressure at which it is applied according to given method
11/25/2003US6652911 Rotation; scanning with spray nozzle
11/25/2003US6652808 Electric field assisted self-assembly of functionalized programmable nucleic acids, modified structures and other selective affinity or binding moieties
11/25/2003US6652805 Highly filled composites of powdered fillers and polymer matrix
11/25/2003US6652795 Production method for semiconductor devices using resin molding mold
11/25/2003US6652784 Method for handling and processing microelectronic-device substrate assemblies
11/25/2003US6652764 Methods and apparatuses for making and using planarizing pads for mechanical and chemical-mechanical planarization of microelectronic substrates
11/25/2003US6652726 Method for reducing wafer edge defects in an electrodeposition process
11/25/2003US6652718 Electrostatic chuck modulation without use of collimator or shutter; obtaining superior step coverage, grain size and orientation, roughness and uniformity; forming void free filling of high aspect ratio opening
11/25/2003US6652717 Time averaging radio frequency voltage distributions
11/25/2003US6652713 Pedestal with integral shield
11/25/2003US6652711 Inductively-coupled plasma processing system
11/25/2003US6652710 Process monitoring apparatus and method
11/25/2003US6652709 Plasma processing apparatus having circular waveguide, and plasma processing method
11/25/2003US6652708 Methods and apparatus for conditioning and temperature control of a processing surface
11/25/2003US6652707 Method and apparatus for demounting workpieces from adhesive film
11/25/2003US6652688 Process for producing semiconductor wafer with adhesive film
11/25/2003US6652666 Exposing said wafer to heated etchant solution; cooling wafer; rinsing with water without exposing to buffer solvent for removing surface layer on wafer
11/25/2003US6652663 Composition for eliminating thermosetting resin
11/25/2003US6652662 Accurately measuring contact pressure applied to wafer during cleaning
11/25/2003US6652659 Eliminating flutuations in amount of residue on electronic substrate using deionized water containing alkali metal bicarbonate
11/25/2003US6652658 Method for machining/cleaning by hydroxide ion in ultrapure water
11/25/2003US6652656 Semiconductor wafer holding assembly
11/25/2003US6652655 Method to isolate multi zone heater from atmosphere
11/25/2003US6652650 Modified susceptor for use in chemical vapor deposition process
11/25/2003US6652648 Method for fabricating GaN single crystal substrate
11/25/2003US6652368 Chemical mechanical polishing carrier head
11/25/2003US6652365 Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads
11/25/2003US6652364 Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads
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