| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 01/01/2004 | US20040000679 High density 3D rail stack arrays and method of making |
| 01/01/2004 | US20040000676 Semiconductor device |
| 01/01/2004 | US20040000675 Method for manufacturing avalanche photodiodes, avalanche photodiode, optical receiver module and optical receiving apparatus |
| 01/01/2004 | US20040000671 Electrode for p-type gallium nitride-based semiconductors |
| 01/01/2004 | US20040000669 Solid-state imaging device, solid-state imaging apparatus and methods for manufacturing the same |
| 01/01/2004 | US20040000667 Laminated thin-film device, manufacturing method thereof, and circuit |
| 01/01/2004 | US20040000651 Ion source having replaceable and sputterable solid source material |
| 01/01/2004 | US20040000638 Undercut measurement using sem |
| 01/01/2004 | US20040000627 Method for focus detection and an imaging system with a focus-detection system |
| 01/01/2004 | US20040000580 Forming solder structure with exterior tin oxide layer over under bump metallurgy; exposure to hydrogen, carbon tetrafluoride, and/or sulfur tetrafluoride; heating and cooling semiconductor |
| 01/01/2004 | US20040000578 Initial ball forming method for wire bonding wire and wire bonding apparatus |
| 01/01/2004 | US20040000577 Initial ball forming method for wire bonding wire and wire bonding apparatus |
| 01/01/2004 | US20040000534 Hardmask of amorphous carbon-hydrogen (a-C:H) layers with tunable etch resistivity |
| 01/01/2004 | US20040000495 Wafer shipping device and storage method for preventing fluoridation in bonding pads |
| 01/01/2004 | US20040000489 Electrochemistry; forming three-dimensional multilayer structures; measurement voltage profile |
| 01/01/2004 | US20040000486 Apparatus and method for treating a substrate electrochemically while reducing metal corrosion |
| 01/01/2004 | US20040000425 Methods for fabricating three-dimensional all organic interconnect structures |
| 01/01/2004 | US20040000415 Magnetic shielding for electronic circuits which include magnetic materials |
| 01/01/2004 | US20040000378 Isolation chamber arrangement for serial processing of semiconductor wafers for the electronic industry |
| 01/01/2004 | US20040000377 Liquid delivery system |
| 01/01/2004 | US20040000375 Plasma etch chamber equipped with multi-layer insert ring |
| 01/01/2004 | US20040000370 Multilayer stacks; substrates, viscoelastic layer, heat expansion microspheres |
| 01/01/2004 | US20040000368 Method and apparatus for manufacturing electronic devices |
| 01/01/2004 | US20040000330 Apparatus for cleaning semiconductor wafers |
| 01/01/2004 | US20040000328 Purge bars for CMP cleaner |
| 01/01/2004 | US20040000327 Insertion semiconductor into hermetic sealed enclosure; etching uisng hot water jets |
| 01/01/2004 | US20040000326 Removal impurities; brush cleaning; rotation; dilution aqueous solution of hydrogen fluoride |
| 01/01/2004 | US20040000324 Substrate cleaning method and substrate cleaning apparatus |
| 01/01/2004 | US20040000322 Point-of-use mixing with H2SO4 and H2O2 on top of a horizontally spinning wafer |
| 01/01/2004 | US20040000268 Etch stop layer system |
| 01/01/2004 | US20040000266 Method for reducing defect concentrations in crystals |
| 01/01/2004 | US20040000234 System and method for reducing the chemical reactivity of water and other chemicals used in the fabrication of integrated circuits |
| 01/01/2004 | US20040000129 Carrying vehicle, manufacturing apparatus, and carrying system |
| 12/31/2003 | WO2004002003A1 Packaging of a microchip device |
| 12/31/2003 | WO2004001926A2 Nano-architected/assembled solar electricity cell |
| 12/31/2003 | WO2004001904A2 Stabilized wire bonded electrical connections and method of making same |
| 12/31/2003 | WO2004001872A1 Magnetoresistive device and magnetic memory device |
| 12/31/2003 | WO2004001863A1 Led chip mounting structure and image reader having same |
| 12/31/2003 | WO2004001857A1 Ge photodetectors |
| 12/31/2003 | WO2004001856A1 Vertical nrom |
| 12/31/2003 | WO2004001855A1 Organic semiconductor element, production method therefor and organic semiconductor device |
| 12/31/2003 | WO2004001852A1 Deep wordline trench to shield cross coupling between adjacent cells for scaled nand |
| 12/31/2003 | WO2004001851A1 Large-capacity magnetic memory using carbon nano-tube |
| 12/31/2003 | WO2004001850A1 Integrated circuit structure for mixed-signal rf applications and circuits |
| 12/31/2003 | WO2004001848A1 Electronics circuit manufacture |
| 12/31/2003 | WO2004001847A1 Improved integrated circuit package and method of manufacturing the integrated circuit package |
| 12/31/2003 | WO2004001843A1 An electronic and optoelectronic component packaging technique |
| 12/31/2003 | WO2004001842A2 Layer assembly and method for producing a layer assembly |
| 12/31/2003 | WO2004001841A2 Method and system for realtime critical dimention microloading control |
| 12/31/2003 | WO2004001840A1 System and process for calibrating temperature measurement devices in thermal processing chambers |
| 12/31/2003 | WO2004001839A1 Semiconductor device and its producing method |
| 12/31/2003 | WO2004001838A1 Packaging of a microchip device-i |
| 12/31/2003 | WO2004001837A2 Methods of forming electronic structures including conductive shunt layers and related structures |
| 12/31/2003 | WO2004001836A1 Method for producing semi-insulating resistivity in high purity silicon carbide crystals |
| 12/31/2003 | WO2004001835A1 Heat treating equipment, and methods of manufacturing substrate and semiconductor device |
| 12/31/2003 | WO2004001834A1 Composition for removing sidewall residues |
| 12/31/2003 | WO2004001833A1 Method for manufacturing semiconductor device |
| 12/31/2003 | WO2004001832A1 Fluoropolymer interlayer dielectric by chemical vapor deposition |
| 12/31/2003 | WO2004001831A1 Magnetron plasma processing apparatus |
| 12/31/2003 | WO2004001830A1 Substrate processing device |
| 12/31/2003 | WO2004001829A1 Polishing body, polishing device, semiconductor device, and method of manufacturing semiconductor device |
| 12/31/2003 | WO2004001828A1 Substrate processing device and substrate processing method |
| 12/31/2003 | WO2004001827A1 Method and apparatus for splitting semiconducor wafer |
| 12/31/2003 | WO2004001826A1 Method using silicide contacts for semiconductor processing |
| 12/31/2003 | WO2004001825A1 SiGe GATE ELECTRODES ON SiGe SUBSTRATES AND METHODS OF MAKING THE SAME |
| 12/31/2003 | WO2004001824A1 Conductive spacers extended floating gates |
| 12/31/2003 | WO2004001823A1 Semiconductor device manufacturing method |
| 12/31/2003 | WO2004001822A1 Plasma processing system, plasma processing method, plasma film deposition system, and plasma film deposition method |
| 12/31/2003 | WO2004001820A1 Exposure apparatus and method |
| 12/31/2003 | WO2004001819A1 Semiconductor device manufacturing method and ring-shaped reinforcing member |
| 12/31/2003 | WO2004001818A2 Shared sensors for detecting substrate position/presence |
| 12/31/2003 | WO2004001817A1 Transfer chamber for vacuum processing system |
| 12/31/2003 | WO2004001816A1 Angled sensors for detecting substrates |
| 12/31/2003 | WO2004001815A1 An ultralow dielectric constant material as an intralevel or interlevel dielectric in a semiconductor device |
| 12/31/2003 | WO2004001814A2 Method of forming a raised contact for a substrate |
| 12/31/2003 | WO2004001813A2 Substrate holder and plating apparatus |
| 12/31/2003 | WO2004001812A1 Device for liquid treatment of disk-shaped objects |
| 12/31/2003 | WO2004001810A2 Coplanar integration of lattice-mismatched semiconductor with silicon via wafer boning virtual substrates |
| 12/31/2003 | WO2004001809A2 Method for energy-assisted atomic layer deposition and removal |
| 12/31/2003 | WO2004001808A2 Method and system for atomic layer removal and atomic layer exchange |
| 12/31/2003 | WO2004001802A2 Nrom memory cell, memory array, related devices and methods |
| 12/31/2003 | WO2004001800A2 Chip package sealing method |
| 12/31/2003 | WO2004001799A2 Method for fabricating a gate structure of a field effect transistor |
| 12/31/2003 | WO2004001798A2 A silicon-on-insulator device with strained device film and method for making the same with partial replacement of isolation oxide |
| 12/31/2003 | WO2004001797A2 Sensitized chemically amplified photoresist for use in photomask fabrication and semiconductor processing |
| 12/31/2003 | WO2004001790A1 Dielectric barrier discharge apparatus and process for treating a substrate |
| 12/31/2003 | WO2004001789A2 Multi directional mechanical scanning in an ion implanter |
| 12/31/2003 | WO2004001760A1 Ferroelectric memory with series connected memory cells |
| 12/31/2003 | WO2004001737A1 Method for delivery of substrate to film forming device for disk-like substrate, substrate delivery mechanism and substrate holder used for the method, and method of manufacturing disk-like recording medium using the method |
| 12/31/2003 | WO2004001663A1 Tape manufacturing |
| 12/31/2003 | WO2004001582A1 Automated material handling system for semiconductor manufacturing based on a combination of vertical carousels and overhead hoists |
| 12/31/2003 | WO2004001510A1 Process for preventing development defect and composition for use in the same |
| 12/31/2003 | WO2004001502A1 Developer-soluble metal alkoxide coatings for microelectronic applications |
| 12/31/2003 | WO2004001490A1 Connection means for setting up an electric connection between a cell, in particular a crystal liquid cell, and a power or control circuit |
| 12/31/2003 | WO2004001480A2 Catadioptric reduction objective |
| 12/31/2003 | WO2004001433A1 Electronic circuit with asynchronously operating components |
| 12/31/2003 | WO2004001432A1 Electromigration test device and electromigration test method |
| 12/31/2003 | WO2004001355A2 Temperature control sequence of electroless plating baths |
| 12/31/2003 | WO2004001230A1 Apparatus for controlling the pressure in a process chamber and method of operating same |
| 12/31/2003 | WO2004000972A1 An etchant for a wiring, a method for manufacturing the wiring using the etchant, a thin film transistor array panel including the wiring, and a method for manufacturing the same |