Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2004
01/08/2004US20040004275 Lead-frame-based semiconductor package and fabrication method thereof
01/08/2004US20040004274 Semiconductor die with attached heat sink and transfer mold
01/08/2004US20040004273 Semiconductor device and method for making the same
01/08/2004US20040004272 Reduces the package electrical resistance, inductance and thermal resistance to enable the device be more efficient and dissipate more power.
01/08/2004US20040004271 Improved heat radiation; either the ratio of one Si isotope or the ratio of one Ge isotope is set higher, whereby the heat can be scattered in the direction horizontal to the substrate plane.
01/08/2004US20040004270 Germanium implanted HBT bipolar
01/08/2004US20040004266 Semiconductor integrated circuit and method of manufacturing the same
01/08/2004US20040004265 Flash memory devices having self aligned shallow trench isolation structures and methods of fabricating the same
01/08/2004US20040004264 Semiconductor device and method of manufacturing the same
01/08/2004US20040004262 Semiconductor devices in compensated semiconductor
01/08/2004US20040004261 Magneto-resistive devices
01/08/2004US20040004260 Method of forming dual-implanted gate and structure formed by the same
01/08/2004US20040004259 Scaled mosfet device and its fabricating method
01/08/2004US20040004257 Dynamic random access memory cells having laterally offset storage nodes, and fabrication methods thereof
01/08/2004US20040004256 Structure of a memory device and fabrication method thereof
01/08/2004US20040004255 Semiconductor device
01/08/2004US20040004253 Silicon-on-insulator wafer and method of manufacturing the same
01/08/2004US20040004252 Semiconductor switching devices
01/08/2004US20040004251 Insulated-gate field-effect thin film transistors
01/08/2004US20040004250 Semiconductor device and method of fabricating the same
01/08/2004US20040004248 Semiconductor device and method for fabricating the same
01/08/2004US20040004246 Semiconductor integrated circuit apparatus and fabrication method thereof
01/08/2004US20040004244 Structures, methods, and systems for ferroelectric memory transistors
01/08/2004US20040004243 Programmable memory devices comprising tungsten
01/08/2004US20040004242 Semiconductor device and method for fabricating the same
01/08/2004US20040004241 On-chip capacitor
01/08/2004US20040004240 Semiconductor memory device having cylinder-type stacked capacitor and method for fabricating such a semiconductor memory device
01/08/2004US20040004237 Method for producing crystallographically textured electrodes for textured PZT capacitors
01/08/2004US20040004236 Method for producing crystallographically textured electrodes for textured PZT capacitors
01/08/2004US20040004235 Formation position of nanotubes can be precisely controlled.
01/08/2004US20040004234 Semiconductor device with a disposable gate and method of manufacturing the same
01/08/2004US20040004233 Semiconductor circuit configuration and associated fabrication method
01/08/2004US20040004229 Semiconductor device and manufacturing method thereof
01/08/2004US20040004225 Light emitting diode and manufacturing method thereof
01/08/2004US20040004222 Polysilicon thin film transistor used in a liquid crystal display and the fabricating method
01/08/2004US20040004220 Thin film transistor
01/08/2004US20040004219 Polycrystalline silicon thin film used in a thin film transistor and a device using the same
01/08/2004US20040004218 Transistor circuit
01/08/2004US20040004213 Organic contact-enhancing layer for organic field effect transistors
01/08/2004US20040004195 Mask inspecting apparatus
01/08/2004US20040004167 Paddle for securely mounting a wafer cassette holder thereto
01/08/2004US20040004079 Fire retardant foup wafer carrier
01/08/2004US20040004058 Methods for forming openings in a substrate and apparatuses with these openings and methods for creating assemblies with openings
01/08/2004US20040004054 Method to form both high and low-k materials over the same dielectric region, and their application in mixed mode circuits
01/08/2004US20040004006 Selectively removing a layer of electrolytically dissoluble metal such as copper overplate from a substrate such as a low-k dielectric interconnect
01/08/2004US20040003999 Such as cationic tetrabromobisphenol a-diethylene glycol-diethanolamine resin and curing agent; flame resistance protective layer; circuit board fabrication
01/08/2004US20040003992 Coating apparatus for disk-shaped workpieces
01/08/2004US20040003898 Apparatus for manufacturing semiconductor device
01/08/2004US20040003897 Plasma stabilization method and plasma apparatus
01/08/2004US20040003896 Controller for plasma processing apparatus performing good etching process
01/08/2004US20040003895 Abrasive pad for cmp
01/08/2004US20040003894 Method and apparatus for electro-chemical processing
01/08/2004US20040003883 Energy-beam-curable thermal-releasable pressure-sensitive adhesive sheet and method for producing cut pieces using the same
01/08/2004US20040003873 Forming a copper layer by electroplating on a substrate in an integrated processing system and treating the copper layer in a gas environment, especially annealing
01/08/2004US20040003831 Soaking in a pressure vessel at a supercritical temperature and a higher of two supercritical pressures; rapidly decompressing to a lower of two supercritical pressures; and flushing said pressure vessel with said process fluid.
01/08/2004US20040003829 Using ultrasonic vibrations in which a drip-proof plate disposed so as to cover the front surface of the substrate blocks the mist from splashing
01/08/2004US20040003828 Selective cleaning, drying, and modifying substrate surfaces and depositing thin films thereon using a dense phase gas solvent and admixtures within a first created supercritical fluid antisolvent.
01/08/2004US20040003780 Self aligning non contact shadow ring process kit
01/08/2004US20040003779 Device for depositing in particular crystalline layers on one or more, in particular likewise crystalline substrates
01/08/2004US20040003778 Method of replacing atmosphere of chamber apparatus, chamber apparatus, electro-optic apparatus, and organic EL device
01/08/2004US20040003769 Method of producing silicon wafer and silicon wafer
01/08/2004US20040003691 Forming folded-stack packaged device using vertical progression folding tool
01/08/2004US20040003497 Method of manufacturing an IC package
01/08/2004US20040003495 GaN boule grown from liquid melt using GaN seed wafers
01/08/2004DE19531618B4 Bipolartransistor, Halbleitereinrichtung mit einem Bipolartransistor und Verfahren zum Herstellen derselben Bipolar transistor semiconductor device having a bipolar transistor and method for manufacturing the same
01/08/2004DE10326771A1 Integrierte Speicherschaltung und Verfahren zum Bilden einer integrierten Speicherschaltung An integrated circuit memory and method of forming an integrated circuit memory
01/08/2004DE10324606A1 Herstellungsverfahren für Speicherzellen mit Kragenisolationsschichten Manufacturing process for memory cells with collar insulating layers
01/08/2004DE10324491A1 Herstellungsverfahren für Dual-Workfunction-Logikbauelemente in vertikalen DRAM-Prozessen Manufacturing method for dual workfunction logic components in vertical DRAM processes
01/08/2004DE10323400A1 Löschschema für eine Flashspeicherzelle unter Verwendung sowohl des Source- als auch des Kanalbereichs Erase scheme for a flash memory cell using both the source and the channel region
01/08/2004DE10320598A1 Transistor und Verfahren zur Herstellung eines Transistors mit der Ausbildung einer flachen Implantierung unter Verwendung einer Epitaxieschicht Transistor and method of manufacturing a transistor with the formation of a shallow implantation using an epitaxial layer
01/08/2004DE10310537A1 Halbleitervorrichtung und Verfahren zu ihrer Herstellung Semiconductor device and process for their preparation
01/08/2004DE10252818A1 Halbleitervorrichtung mit Kondensator A semiconductor device having capacitor
01/08/2004DE10245769A1 Nichtflüchtige Speicherzelle mit Ladungseinfangstruktur, Speicherbauelement und Herstellungsverfahren A non-volatile memory cell having charge trapping memory device and manufacturing method
01/08/2004DE10243961A1 Metallfüllverfahren und Gegenstand aufweisend metallgefüllte Löcher Metallfüllverfahren and article comprising metal-filled holes
01/08/2004DE10227867A1 Zusammensetzung zum Entfernen von Sidewall-Residues Composition for removing Sidewall Residues
01/08/2004DE10227365A1 Vorrichtung zur Bewegung von Einbauteilen in Vakuumanlagen Means for moving installed equipment in vacuum systems
01/08/2004DE10226965A1 Integrierter Halbleiterspeicher und Herstellungsverfahren Integrated semiconductor memory and manufacturing processes
01/08/2004DE10226964A1 Verfahren zur Herstellung einer NROM-Speicherzellenanordnung Process for the preparation of an NROM memory cell array
01/08/2004DE10226914A1 Verfahren zur Herstellung einer Spacerstruktur A method for producing a spacer structure
01/08/2004DE10226660A1 Flächenoptimierte Arrayanordnung für DRAM-Speicherzellen Optimised surface array arrangement for DRAM memory cells
01/08/2004DE10226655A1 Vorrichtung zur Positionierung eines optischen Elements in einer Struktur A device for positioning an optical element in a structure
01/08/2004DE10226604A1 Verfahren zum Strukturieren einer Siliziumschicht A method for patterning a silicon layer
01/08/2004DE10226603A1 Verfahren zum Strukturieren einer Siliziumschicht sowie dessen Verwendung zur Herstellung einer integrierten Halbleiterschaltung A method for patterning a silicon layer as well as its use for producing a semiconductor integrated circuit
01/08/2004DE10226583A1 DRAM-Speicherzelle für schnellen Schreib-/Lesezugriff DRAM memory cell for fast read / write access
01/08/2004DE10226366A1 Elektroden für optoelektronische Bauelemente und deren Verwendung Electrodes for optoelectronic devices and their use
01/08/2004DE10226363A1 Halbleiterbauelemente Semiconductor devices
01/08/2004DE10225941A1 Verfahren zur Füllung von Graben- und Reliefgeometrien in Halbleiterstrukturen Method for filling trench and relief geometries in semiconductor structures
01/08/2004DE10225431A1 Verfahren zur Anschlußkontaktierung von elektronischen Bauelementen auf einem isolierenden Substrat und nach dem Verfahren hergestelltes Bauelement-Modul A process for Contact connection of electronic components on an insulating substrate and component produced by the process module
01/08/2004DE10225410A1 Verfahren zur Herstellung von NROM-Speicherzellen mit Grabentransistoren Process for the preparation of NROM memory cells having transistors grave
01/08/2004DE10223945A1 Verfahren und System zum Verbessern der Herstellung von Damaszener-Metallstrukturen A method and system for improving the production of damascene metal structures
01/08/2004DE10220584B3 Dynamische Speicherzelle und Verfahren zum Herstellen derselben Dynamic memory cell and method for manufacturing the same
01/08/2004DE10212923A1 Verfahren zum Beschichten eines Substrates und Vorrichtung zur Durchführung des Verfahrens A method for coating a substrate and apparatus for carrying out the method
01/08/2004DE10200538B4 Vorrichtung und Verfahren zum flächigen Zusammendrücken zu verbindender scheibenförmiger Elemente Apparatus and method for two-dimensional compression to be connected to disc-shaped elements
01/08/2004DE10163477B4 Transportmodul Transport Module
01/08/2004DE10128481B4 Verfahren zur Ätzung eines Substrats A method for etching a substrate
01/08/2004DE10033817B4 Waferauflageplatte Wafer platen
01/08/2004CA2459554A1 Semiconductor light-emitting device
01/07/2004EP1378945A2 Semiconductor device for electrostatic discharge protection comprising a thyristor
01/07/2004EP1378943A1 Semiconductor device and its manufacturing method
01/07/2004EP1378937A2 Silicon-rich oxide for copper damascene interconnect incorporating low dielectric constant dielectrics