Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2004
01/08/2004US20040005761 Method for manufacturing non-volatile memory device
01/08/2004US20040005760 Programmable memory devices comprising tungsten, and methods of forming programmable memory devices comprising tungsten
01/08/2004US20040005759 Structure and manufacturing method of non-volatile semiconductor memory device
01/08/2004US20040005758 Structure for preventing salicide bridging and method thereof
01/08/2004US20040005757 Semiconductor device and method of forming the same
01/08/2004US20040005756 Method of forming an isolated-grain rugged polysilicon surface via a temperature ramping step
01/08/2004US20040005755 Semiconductor memory device and a method of manufacturing the same
01/08/2004US20040005754 Method for attaching an integrated circuit on a silicon chip to a smart label
01/08/2004US20040005753 Method of growing electrical conductors
01/08/2004US20040005752 Formation of standard voltage threshold and low voltage threshold MOSFET devices
01/08/2004US20040005751 Method for fabricating CMOS transistor of a semiconductor device
01/08/2004US20040005750 Approach to prevent spacer undercut by low temperature nitridation
01/08/2004US20040005749 Methods of forming dual gate semiconductor devices having a metal nitride layer
01/08/2004US20040005748 Methods of forming a gate insulating layer in an integrated circuit device in which the gate insulating layer is nitrified and then annealed to cure defects caused by the nitridation process
01/08/2004US20040005747 Thin-film semiconductor device, manufacturing method of the same and image display apparatus
01/08/2004US20040005746 Method of manufacturing a MOS transistor
01/08/2004US20040005745 Doping method, doping apparatus, and control system for doping apparatus
01/08/2004US20040005744 Crystallization apparatus, optical member for use in crystallization apparatus, crystallization method, thin film transistor, and display
01/08/2004US20040005743 Method of manufacturing thin film transistor
01/08/2004US20040005742 Process for fabricating semiconductor device
01/08/2004US20040005741 Active matrix substrate, electrooptical device, and method of producing active matrix substrate
01/08/2004US20040005740 Strained-semiconductor-on-insulator device structures
01/08/2004US20040005739 Method of manufacturing device, device, and electronic apparatus
01/08/2004US20040005737 Method for manufacturing encapsulated electronic components, particularly integrated circuits
01/08/2004US20040005735 Dicing method for micro electro mechanical system chip
01/08/2004US20040005733 Method of manufacturing semiconductor device
01/08/2004US20040005732 Microelectronic device packages and methods for controlling the disposition of non-conductive materials in such packages
01/08/2004US20040005731 Device and method for the depostion of, in particular, crystalline layers on, in particular, crystalline substrates
01/08/2004US20040005730 Controller module for a semiconductor manufacturing device
01/08/2004US20040005729 Solid state image pickup device and method of producing solid state image pickup device
01/08/2004US20040005727 Device and method for automatically determining the surface quality of a bonding interface between two wafers
01/08/2004US20040005726 Plasma chamber equipped with temperature-controlled focus ring and method of operating
01/08/2004US20040005725 Method of forming a contact structure and a ferroelectric memory device
01/08/2004US20040005724 Ferroelectric memory device and method of forming the same
01/08/2004US20040005518 Method for forming a planarized layer of a semiconductor device
01/08/2004US20040005517 Forming a conductive trace on a substrate. The conductive trace is patterned with a photoresist mask and etched, thereby forming a polymer layer on a top surface and sidewalls of the photoresist mask and on sidewalls of the conductive trace and
01/08/2004US20040005507 Controlling a lithography process are provided. For example, a method for reducing within wafer variation of a critical metric of a lithography process may include measuring at least one property of a resist disposed upon a wafer during the
01/08/2004US20040005506 Composition having permitivity being radiation-sensitively changeable and method for forming permitivity pattern
01/08/2004US20040005459 Conductive adhesive agent, packaging structure, and method for manufacturing the same structure
01/08/2004US20040005444 Substrate for and a process in connection with the product of structures
01/08/2004US20040005440 Thin-plate-like protective film
01/08/2004US20040005412 Organometallic precursor mixture for forming metal alloy pattern and method of forming metal alloy pattern using the same
01/08/2004US20040005408 Method of forming a dielectric film
01/08/2004US20040005258 Having intersecting channel-like voids parallel to the major axis of said template; used to produce micro- and nano-scale filaments and particles, e.g., polymerizing acetylene and decomposing polyacetylene to form carbon nanotubes
01/08/2004US20040005212 Wafer aligner
01/08/2004US20040005211 Multiple independent robot assembly and apparatus and control system for processing and transferring semiconductor wafers
01/08/2004US20040005209 Reticle pod
01/08/2004US20040005181 Inking apparatus with multi-positioning capability
01/08/2004US20040005149 Substrate treating apparatus and method
01/08/2004US20040005147 Heat treatment apparatus, calibration method for temperature measuring system of the apparatus, and heat treatment system
01/08/2004US20040005112 Electronic device having a diffusion barrier region including aluminum and a method of manufacture therefor
01/08/2004US20040005090 Non-lot based method for assembling integrated circuit devices
01/08/2004US20040004993 Furnace temperature detector
01/08/2004US20040004989 Temperature measuring method, heat treating device and method, computer program, and radiation thermometer
01/08/2004US20040004982 Nanocrystal structures
01/08/2004US20040004902 Semiconductor integrated circuit device
01/08/2004US20040004894 Semiconductor integrated circuit and nonvolatile memory element
01/08/2004US20040004891 DRAM memory cell and memory cell array with fast read/write access
01/08/2004US20040004890 Semiconductor memory device and method of controlling the same
01/08/2004US20040004888 Scan path circuit and semiconductor integrated circuit comprising the scan path circuit
01/08/2004US20040004887 Volumetric data storage apparatus
01/08/2004US20040004884 Memory cell arrangement and method for the production thereof
01/08/2004US20040004879 Semiconductor integrated circuit device
01/08/2004US20040004878 Methods of increasing write selectivity in an MRAM
01/08/2004US20040004877 Semiconductor storage device with signal wiring lines RMED above memory cells
01/08/2004US20040004870 Method for manufacturing semiconductor device
01/08/2004US20040004863 Nonvolatile electrically alterable memory device and array made thereby
01/08/2004US20040004861 Differential EEPROM using pFET floating gate transistors
01/08/2004US20040004856 Magnetic random access memory
01/08/2004US20040004793 Capacitor and method for fabricating the same
01/08/2004US20040004771 Projection optical system, exposure system provided with the projection optical system, and exposure method using the projection optical system
01/08/2004US20040004724 Spin etcher with thickness measuring system
01/08/2004US20040004713 Method of and apparatus for detecting a defect at the outer peripheral edge of a wafer, and cleaning equipment comprising the apparatus
01/08/2004US20040004708 Method and system for data handling, storage and manipulation
01/08/2004US20040004702 Reversed, double-helical bellows seal
01/08/2004US20040004701 Radiation generating apparatus, radiation generating method, exposure apparatus, and exposure method
01/08/2004US20040004700 Exposure apparatus and exposure method for use in forming a pattern of a semiconductor device
01/08/2004US20040004678 Method of manufacturing device, device, and electronic apparatus
01/08/2004US20040004607 Image display element and image display device
01/08/2004US20040004597 Capacitor structure in a low temperature poly silicon display
01/08/2004US20040004535 Low temperature coefficient resistor
01/08/2004US20040004499 Semiconductor integrated circuit
01/08/2004US20040004493 Device and method for electronic device test
01/08/2004US20040004489 Needle fixture of a probe card in semiconductor inspection equipment and needle fixing method thereof
01/08/2004US20040004433 Buffer layers for organic electroluminescent devices and methods of manufacture and use
01/08/2004US20040004400 Semiconductor device for preventing noise generation
01/08/2004US20040004298 Semiconductor latches and SRAM devices
01/08/2004US20040004297 Semiconductor device and manufacturing method thereof, and registration accuracy measurement enhancement method
01/08/2004US20040004296 Internal circuit structure of semiconductor chip with array-type bonding pads and method of fabricating the same
01/08/2004US20040004295 Smart label web and a method for its manufacture
01/08/2004US20040004294 Underfilled, encapsulated semiconductor die assemblies and methods of fabrication
01/08/2004US20040004292 Non-conductive adhesive disposed in between and bonding the IC chip and the substrate together in a face-to-face relationship with the bumps in electrical communication with the bond pads.
01/08/2004US20040004291 Semiconductor device
01/08/2004US20040004290 Semiconductor with contact contacting diffusion adjacent gate electrode
01/08/2004US20040004289 Semiconductor device and manufacturing method thereof
01/08/2004US20040004288 Semiconductor device and manufacturing method of the same
01/08/2004US20040004287 Semiconductor device using metal nitride as insulating film and its manufacture method
01/08/2004US20040004285 BGA substrate via structure
01/08/2004US20040004282 Thermally enhanced semiconductor chip having integrated bonds over active circuits
01/08/2004US20040004278 Internal circuit structure of semiconductor chip with array-type bonding pads and method of fabricating the same