Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2004
01/06/2004US6673638 Method and apparatus for the production of process sensitive lithographic features
01/06/2004US6673637 Methods and systems for determining a presence of macro defects and overlay of a specimen
01/06/2004US6673636 Method of real-time plasma charging voltage measurement on powered electrode with electrostatic chuck in plasma process chambers
01/06/2004US6673635 Method for alignment mark formation for a shallow trench isolation process
01/06/2004US6673634 Wafer protection method
01/06/2004US6673633 Method of forming patterned thin film and method of manufacturing thin-film magnetic head
01/06/2004US6673526 Illumination from light sources to phase shifting masks through lenses and optical filters onto substrates; photolithography
01/06/2004US6673520 Method of making an integrated circuit using a reflective mask
01/06/2004US6673516 Coating composition for chemically amplified positive resist and method of patterning resist using the same
01/06/2004US6673512 Photoresists comprising homo(co)polycarbons, acid generators, curing agents and bases, used to form miniaturized patterns on semiconductors using x-rays or radiation beams; high sensitivity and resolution
01/06/2004US6673478 Crystal-growth substrate and a ZnO-containing compound semiconductor device
01/06/2004US6673441 Adhesive, adhesive member, interconnecting substrate for semiconductor mounting having adhesive member, and semiconductor device containing the same
01/06/2004US6673392 Method of vertically aligning carbon nanotubes on substrates at low pressure using thermal chemical vapor deposition with DC bias
01/06/2004US6673262 Comprising hypofluorite which dissociates more easily than, for example, each of cf4, c2f6, c4f8, and nf3
01/06/2004US6673255 By which a predetermined number of flat workpieces may be parallel processed, whereby the number of operating cycles for such treatment is minimalized so as to reach optimal short throughput times with optimal low handling
01/06/2004US6673253 Method of fabricating integrated LC/ESI device using smile, latent masking, and delayed locos techniques.
01/06/2004US6673220 System and method for fabricating silicon targets
01/06/2004US6673216 For transmitting electrical signals and fluids to and/or from microelectronic workpiece during electrochemical processing
01/06/2004US6673200 Method of reducing process plasma damage using optical spectroscopy
01/06/2004US6673196 Plasma processing apparatus
01/06/2004US6673195 Apparatus and method for etching glass panels
01/06/2004US6673189 Method for producing a stable bond between two wafers
01/06/2004US6673180 Multilayered ceramic substrate production method
01/06/2004US6673163 Apparatus and method for cleaning a semiconductor substrate
01/06/2004US6673161 Vacuum chuck containing a vacuum passage that connects to a vacuum source and a liquid passage connected to the vacuum passage, and to a liquid source; cleaning fluid may be flushed through the vacuum passage; corrosion resistance
01/06/2004US6673155 Apparatus for forming coating film and apparatus for curing the coating film
01/06/2004US6673151 Substrate processing apparatus
01/06/2004US6673149 Production of low defect, crack-free epitaxial films on a thermally and/or lattice mismatched substrate
01/06/2004US6673147 High resistivity silicon wafer having electrically inactive dopant and method of producing same
01/06/2004US6673126 Multiple chamber fabrication equipment for thin film transistors in a display or electronic device
01/06/2004US6672946 Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads
01/06/2004US6672945 Polishing apparatus and dressing method
01/06/2004US6672941 Method and apparatus for chemical/mechanical planarization (CMP) of a semiconductor substrate having shallow trench isolation
01/06/2004US6672882 Socket structure for grid array (GA) packages
01/06/2004US6672877 Contactor block and apparatus for electrical connection
01/06/2004US6672876 Probe card with pyramid shaped thin film contacts
01/06/2004US6672875 Spring interconnect structures
01/06/2004US6672864 Method and apparatus for processing substrates in a system having high and low pressure areas
01/06/2004US6672820 Semiconductor processing apparatus having linear conveyer system
01/06/2004US6672819 Vacuum processing apparatus and semiconductor manufacturing line using the same
01/06/2004US6672779 Wafer thermal processing unit; rapid, precise temperature regulation
01/06/2004US6672761 X-ray system
01/06/2004US6672378 Thermal interface wafer and method of making and using the same
01/06/2004US6672358 Sample processing system
01/06/2004US6672319 Pressurized liquid diffuser
01/06/2004US6672318 Creating reduced pressure on upper disk surface using liquid centrifugal force; simple; eliminates expensive equipment
01/06/2004US6671957 Method of the manufacture of cooling devices
01/06/2004US6671950 Forming high frequence stable, high via density device
01/06/2004US6671948 Interconnection method using an etch stop
01/06/2004US6671947 Method of making an interposer
01/06/2004US6671940 Method and apparatus for manufacturing electronic parts
01/06/2004CA2273717C Method and apparatus for continuous cleaning of substrate surfaces using ozone
01/06/2004CA2259659C Automatic semiconductor wafer sorter/prober with extended optical inspection
01/06/2004CA2099232C Fluoro taxols
01/02/2004EP1377141A2 Printed circuit board, method for producing same and semiconductor device
01/02/2004EP1377138A1 Device and control method for micro wave plasma processing
01/02/2004EP1376787A2 Submount assembly and associated packaging method
01/02/2004EP1376704A2 Semiconductor device with field-shaping regions
01/02/2004EP1376703A2 Insulated gate semiconductor device and method of fabricating the same
01/02/2004EP1376702A1 Gate and cmos structure and mos structure
01/02/2004EP1376700A1 Soi wafer and its manufacturing method
01/02/2004EP1376699A1 Production method for simox substrate and simox substrate
01/02/2004EP1376698A1 Electrically erasable and programable non-volatile memory cell
01/02/2004EP1376694A2 Semiconductor switching circuit device
01/02/2004EP1376693A2 Flip-chip semiconductor device having I/O modules in an internal circuit area
01/02/2004EP1376692A2 Power grid and bump pattern with reduced inductance and resistance
01/02/2004EP1376691A2 Method of making a carrier from a metallic leadframe and leadframe with a support for electronic components
01/02/2004EP1376687A2 Semiconductor element and method for producing the same
01/02/2004EP1376686A2 Method of plugging through-holes in silicon substrate
01/02/2004EP1376685A2 Localized doping and/or alloying of metallization for increased interconnect performance
01/02/2004EP1376684A2 Fabrication of a semiconductor device with air gaps for ultra-low capacitance interconnections
01/02/2004EP1376683A1 Process for forming trenches with oblique profile and rounded top corners
01/02/2004EP1376682A1 Methods and apparatuses for clamping and declamping a semiconductor wafer in a wafer processing system
01/02/2004EP1376681A2 Data analysis apparatus
01/02/2004EP1376680A1 Method and corresponding detector for production monitoring and quality evaluation of a metallisation
01/02/2004EP1376679A2 Method and device for determining backgate characteristics
01/02/2004EP1376678A2 Manufacturing method of semiconductor device
01/02/2004EP1376677A2 Finned heat sinks
01/02/2004EP1376676A2 Multibit non-volatile memory device and method
01/02/2004EP1376675A2 Method of fabricating a trench MOSFET
01/02/2004EP1376674A2 Method of fabricating a trench MOSFET
01/02/2004EP1376673A2 Semiconductor device manufacturing method
01/02/2004EP1376672A1 Deposition method, deposition apparatus, insulating film and semiconductor integrated circuit
01/02/2004EP1376671A1 Compositions for preparing materials with a low dielectric constant
01/02/2004EP1376670A1 Plasma processing device
01/02/2004EP1376669A1 Plasma processing device
01/02/2004EP1376668A1 Microwave plasma process device, plasma ignition method, plasma forming method, and plasma process method
01/02/2004EP1376667A1 Heat treating device
01/02/2004EP1376666A2 Method of machining silicon wafer
01/02/2004EP1376665A1 Gaseous phase growing device
01/02/2004EP1376664A1 Method for manufacturing group-iii nitride compound semiconductor, and group-iii nitride compound semiconductor device
01/02/2004EP1376663A2 Method and system for forming a semiconductor device
01/02/2004EP1376662A2 Semiconductor device and method for fabricating the same
01/02/2004EP1376661A1 Processing apparatus and processing system for semiconductor device
01/02/2004EP1376660A2 Wafer heating apparatus with electrostatic attraction function
01/02/2004EP1376659A1 Clamping element with an integrated force sensor
01/02/2004EP1376658A2 Method and apparatus for manufacturing semiconductor device
01/02/2004EP1376602A2 Magnetic ram using thermo-magnetic spontaneous hall effect and method of writing and reading data using the magnetic ram
01/02/2004EP1376601A2 Magneto-resistive devices
01/02/2004EP1376600A1 Data storage device