Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2003
12/24/2003WO2003054927A3 Structure and process for packaging rf mems and other devices
12/24/2003WO2003054921A3 Method for the production of iii-v laser components
12/24/2003WO2003032382A3 Method for evaluating anomalies in a semiconductor manufacturing process
12/24/2003WO2003024865A8 Method for producing micro-electromechanical components
12/24/2003WO2003015981A3 Improved chemical mechanical polishing compositions for metal and associated materials and method of using same
12/24/2003WO2003012821A3 Method and apparatus for producing uniform process rates
12/24/2003WO2003003449A3 Ceramic electrostatic chuck and method of fabricating same
12/24/2003WO2002088243A3 Method for producing thin homogeneous layers with the help of screen printing technology, device for carrying out said method and the use thereof
12/24/2003WO2002079880A9 Method for adjusting the overlay of two masking planes in a photolithographic process
12/24/2003WO2002073695A3 Thyristor configuration and surge suppressor comprising a thyristor configuration of this type
12/24/2003WO2002061010A8 Method for adhering substrates using light activatable adhesive film
12/24/2003WO2002059941A3 A self-aligned cross-point mram device with aluminum metallization layers
12/24/2003WO2002052631A3 An isotropic etch to form mim capacitor top plates
12/24/2003WO2002018670A3 Cvd reactor with a gas outlet ring made of solid graphite
12/24/2003WO2002017409A3 Method of fabricating thermally stable mtj cell and apparatus
12/24/2003CN1463572A Method for mfg. ceramic multilayered board
12/24/2003CN1463471A Semiconductor device and production method therefor
12/24/2003CN1463470A Method of mfg. electronic device
12/24/2003CN1463469A Method for preparing nitrogen-doped and annealed wafer and nitrogen-doped and annealed wafer
12/24/2003CN1463467A Electrolytic processing device and substrate processing appts.
12/24/2003CN1463466A Conductive thin film for semiconductor device, semiconductor device and methods for producing them
12/24/2003CN1463444A Conductivity organic film, its mfg. method and electrode and cable using such film
12/24/2003CN1463414A Method for connecting chip to antenna of radio frequency identification device of contactless chip card variety
12/24/2003CN1463390A Photoimageable compsn.
12/24/2003CN1463383A Active plate
12/24/2003CN1463382A Active matrix display substrate
12/24/2003CN1463305A Silicon single crystal wafer having void denuded zone on surface and diameter of above 300mm and its production method
12/24/2003CN1463294A Unleaded solder
12/24/2003CN1463287A Cerium oxide slurry, and method of mfg. substrate
12/24/2003CN1463279A Organosilicate polyer and insulating film therefrom
12/24/2003CN1463261A Method for mfg. ceramic part
12/24/2003CN1463218A Substrate and method of separating compsns. from substrate
12/24/2003CN1463045A Semiconductor device and its mfg. method
12/24/2003CN1463044A Capacitance with combined type storage section structure and its manufacturing method
12/24/2003CN1463043A Semiconductor device and its mfg. method
12/24/2003CN1463041A 半导体集成电路装置 The semiconductor integrated circuit device
12/24/2003CN1463038A Semiconductor device and its mfg. method
12/24/2003CN1463037A Semiconductor device and its mfg. method
12/24/2003CN1463036A Chip of memory, chip-on-chip device of using same and its mfg. method
12/24/2003CN1463035A Technique for repairing salient point and memory by using laser
12/24/2003CN1463034A Semiconductor structure and method of processing same
12/24/2003CN1463033A Vessel assembly for storage of semiconductor wafer
12/24/2003CN1463032A Identifying method of mark on semiconductor device
12/24/2003CN1463031A Fault-telerance method and system of testing chip for boundary scanning
12/24/2003CN1463030A Method for manufacturing silicon transistor with high back voltage and low negative resistance
12/24/2003CN1463029A Method for producing low electrode
12/24/2003CN1463010A Magnetoresistive effect component and magnetic memory with such component
12/24/2003CN1463009A Thin film magnet storage device set with false unit
12/24/2003CN1462909A Chemical amplification light resistance agent compsn.
12/24/2003CN1462868A Isothermal solidification method for air-tight packing micro mechanical sensor
12/24/2003CN1462757A High molecular polymer of chemical amplification type light resistance agent compsn.
12/24/2003CN1462666A High accuracy barrel finishing machine with full automatic adjustable pressure and dual stepless speed changing
12/24/2003CN1132510C Transfer appts.
12/24/2003CN1132312C Method for turn-on regulation of IGBT and appts. for carrying out same
12/24/2003CN1132311C Semiconductor delay circuit
12/24/2003CN1132306C Differential amplifier circuit
12/24/2003CN1132304C Low voltage operated oscillator
12/24/2003CN1132251C Solid state imaging device and mfg. method thereof
12/24/2003CN1132250C EEPROM device and mfg. method thereof
12/24/2003CN1132249C Static random memory unit and its mfg. method
12/24/2003CN1132248C Semiconductor appts. and method for producing semiconductor appts.
12/24/2003CN1132247C Pull-up and pull-down circuit
12/24/2003CN1132246C Acceleration test method of semiconductor memory
12/24/2003CN1132244C Resin-encapsulated semiconductor device and method of mfg. same
12/24/2003CN1132243C Metal substrate having IC chip and carrier mounting
12/24/2003CN1132242C Automated stacking and soldering appts. for three dimensional stack package devices and mfg. method thereof
12/24/2003CN1132241C Mfg. method of semiconductor element, driver circuit and active matrix display device
12/24/2003CN1132240C Semiconductor chip and its mfg. method
12/24/2003CN1132239C Method of mfg. semiconductor device
12/24/2003CN1132238C 半导体元件及其制造方法 Semiconductor device and manufacturing method
12/24/2003CN1132237C External lead wire corrector and visual examinator for semiconductor device
12/24/2003CN1132236C Semiconductor devices and method of making devices
12/24/2003CN1132235C Upside down mounting chip package with optimization adhesiveness of selant and producing method thereof
12/24/2003CN1132234C 通过采用光滑底电极结构具有改进的存储保持的薄膜铁电电容器 By using a smooth bottom electrode structure having improved storage holding film ferroelectric capacitor
12/24/2003CN1132233C Plasma processing method and appts.
12/24/2003CN1132232C Method for plasma etching in process for fabrication of semiconductor device
12/24/2003CN1132231C Process for producing semiconductor bodies with MOVPE-layer sequence
12/24/2003CN1132230C Cleaning/drying station and prodn. line for semiconductor device
12/24/2003CN1132229C Cleaning methods of porous surface and semiconductor surface
12/24/2003CN1132228C 半导体集成电路装置及其制造方法 The semiconductor integrated circuit device and manufacturing method thereof
12/24/2003CN1132227C Ion beam neutralizing method and appts.
12/24/2003CN1132226C 用于高频集成电路的衬底 Substrate for high-frequency integrated circuits
12/24/2003CN1132225C 通过受控退火制造碳化硅功率器件的方法 The method of producing a silicon carbide power devices by controlled annealing
12/24/2003CN1132224C Optical mask and method of preparing electronic element
12/24/2003CN1132223C Semiconductor substrate and producing method thereof
12/24/2003CN1132222C Semiconductor mfg. tech. and semiconductor device mfg. tech
12/24/2003CN1132218C Ion filling appts. ion source appts. and method for positioning ion source appts.
12/24/2003CN1132203C Monolithic ceramic electronic element and its producing method
12/24/2003CN1132193C Device for testing multiple memory chips of one crystal plate
12/24/2003CN1132187C Row redundancy block architecture of random memory
12/24/2003CN1132047C Driving chip, liquid crystal panel, liquid crystal device and electronic equipment
12/24/2003CN1132015C Non-destructive measuring method for minotiry carrier diffusion length and life of semiconductor device
12/24/2003CN1131892C 静电屏蔽的射频室冷却系统和方法 RF chamber cooling system and method for electrostatic shielding
12/24/2003CN1131891C Chemical vapor phase deposition appts. its purification and appts. for mfg. semiconductors
12/24/2003CN1131888C Aqueous cleaning solution for semiconductor substrate
12/24/2003CN1131833C Gripping jaw of gripping deivce for use in modular integrated circuit information processor
12/24/2003CN1131831C Transfer appts. of chip components
12/24/2003CN1131765C 带有可装载的罩的换向线性抛光机 Cover with loadable commutation linear polishing machine
12/24/2003CA2493318A1 N-type semiconductor diamond producing method and semiconductor diamond
12/24/2003CA2489544A1 Oxide film forming method and oxide film forming apparatus