Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2013
11/19/2013US8587091 Wafer-leveled chip packaging structure and method thereof
11/19/2013US8587088 Side-mounted controller and methods for making the same
11/19/2013US8587086 Self-aligned dual depth isolation and method of fabrication
11/19/2013US8587085 Semiconductor device with trench isolation having a diffusion preventing film and manufacturing method thereof
11/19/2013US8587084 Seamless multi-poly structure and methods of making same
11/19/2013US8587078 Integrated circuit and fabricating method thereof
11/19/2013US8587072 Silicon carbide semiconductor device
11/19/2013US8587068 SRAM with hybrid FinFET and planar transistors
11/19/2013US8587066 Structure and method having asymmetrical junction or reverse halo profile for semiconductor on insulator (SOI) metal oxide semiconductor field effect transistor (MOSFET)
11/19/2013US8587046 System with logic and embedded MIM capacitor
11/19/2013US8587044 Complementary logic device using spin injection
11/19/2013US8587043 Magnetoresistive random access memory and method of manufacturing the same
11/19/2013US8587042 Magnetoresistive random access memory device
11/19/2013US8587041 Solid-state imaging device and method of manufacturing the same
11/19/2013US8587037 Test structure to monitor the in-situ channel temperature of field effect transistors
11/19/2013US8587027 Field effect transistor, method of manufacturing the same, and semiconductor device
11/19/2013US8587026 Semiconductor device and manufacturing method thereof
11/19/2013US8587017 Light emitting device and method of fabricating a light emitting device
11/19/2013US8587012 LED package and mold of manufacturing the same
11/19/2013US8587009 Light emitting chip package
11/19/2013US8587004 Semiconductor light emitting device, its manufacturing method, semiconductor device and its manufacturing method
11/19/2013US8587001 Light-emitting diode light module free of jumper wires
11/19/2013US8586991 Semiconductor device
11/19/2013US8586988 Semiconductor device and manufacturing method thereof
11/19/2013US8586987 Active matrix substrate and active matrix display device
11/19/2013US8586978 Non-volatile memory device including diode-storage node and cross-point memory array including the non-volatile memory device
11/19/2013US8586961 Resistive changing device
11/19/2013US8586958 Switching element and manufacturing method thereof
11/19/2013US8586909 Method of manufacturing an optical member having stacked high and low refractive index layers
11/19/2013US8586488 Configuring radiation sources to simultaneously irradiate a substrate
11/19/2013US8586487 Low temperature plasma enhanced chemical vapor deposition of conformal silicon carbon nitride and silicon nitride films
11/19/2013US8586486 Method for forming semiconductor device
11/19/2013US8586485 Molecular self-assembly in substrate processing
11/19/2013US8586484 Film forming method and film forming apparatus
11/19/2013US8586483 Semiconductor device structures and compositions for forming same
11/19/2013US8586482 Film stack including metal hardmask layer for sidewall image transfer fin field effect transistor formation
11/19/2013US8586481 Chemical planarization of copper wafer polishing
11/19/2013US8586480 Power MOSFET having selectively silvered pads for clip and bond wire attach
11/19/2013US8586479 Methods for forming a contact metal layer in semiconductor devices
11/19/2013US8586478 Method of making a semiconductor device
11/19/2013US8586477 Semiconductor apparatus, method of manufacturing the same, and method of manufacturing semiconductor package
11/19/2013US8586476 Fabrication method for circuit substrate having post-fed die side power supply connections
11/19/2013US8586475 Semiconductor device including gate electrode for applying tensile stress to silicon substrate, and method of manufacturing the same
11/19/2013US8586474 Method to form a via
11/19/2013US8586473 Methods for fabricating integrated circuits with ruthenium-lined copper
11/19/2013US8586472 Conductive lines and pads and method of manufacturing thereof
11/19/2013US8586471 Seed layers for metallic interconnects and products
11/19/2013US8586470 Multilevel interconnect structures and methods of fabricating same
11/19/2013US8586469 Metal layer end-cut flow
11/19/2013US8586468 Integrated circuit chip stack employing carbon nanotube interconnects
11/19/2013US8586467 Method of mounting electronic component and mounting substrate
11/19/2013US8586466 Electrical fuse with a current shunt
11/19/2013US8586465 Through silicon via dies and packages
11/19/2013US8586464 Chemical mechanical polishing slurry composition for polishing phase-change memory device and method for polishing phase-change memory device using the same
11/19/2013US8586463 Method for preparing a layer comprising nickel monosilicide NiSi on a substrate comprising silicon
11/19/2013US8586462 Method of manufacturing a field-effect transistor
11/19/2013US8586460 Controlling laser annealed junction depth by implant modification
11/19/2013US8586459 Ion implantation with molecular ions containing phosphorus and arsenic
11/19/2013US8586458 Process of preparing carbon nanotube having improved conductivity
11/19/2013US8586457 Method of fabricating high efficiency CIGS solar cells
11/19/2013US8586456 Use of CL2 and/or HCL during silicon epitaxial film formation
11/19/2013US8586455 Preventing shorting of adjacent devices
11/19/2013US8586454 Two-step hydrogen annealing process for creating uniform non-planar semiconductor devices at aggressive pitch
11/19/2013US8586453 Methods for fabricating thin film pattern and array substrate
11/19/2013US8586452 Methods for forming semiconductor device structures
11/19/2013US8586451 Flexible electronic device and method for the fabrication of same
11/19/2013US8586450 Process for fabricating semiconductor devices and a semiconductor device comprising a chip with through-vias
11/19/2013US8586449 Raised isolation structure self-aligned to fin structures
11/19/2013US8586448 Method and apparatus for forming silicon film
11/19/2013US8586447 Semiconductor device and manufacturing method of the same
11/19/2013US8586446 Manufacturing method of semiconductor device
11/19/2013US8586445 Method for manufacturing a suspended membrane and dual-gate MOS transistor
11/19/2013US8586444 Creating deep trenches on underlying substrate
11/19/2013US8586443 Method of fabricating phase change memory device capable of reducing disturbance
11/19/2013US8586442 Manufacturing method for high voltage transistor
11/19/2013US8586441 Germanium lateral bipolar junction transistor
11/19/2013US8586440 Methods for fabricating integrated circuits using non-oxidizing resist removal
11/19/2013US8586439 Inversion mode varactor
11/19/2013US8586438 Semiconductor device and manufacturing method thereof
11/19/2013US8586437 Semiconductor device and method of manufacturing the semiconductor device
11/19/2013US8586436 Method of forming a variety of replacement gate types including replacement gate types on a hybrid semiconductor device
11/19/2013US8586435 Fabrication of MOSFET device with reduced breakdown voltage
11/19/2013US8586434 Method of manufacturing semiconductor device
11/19/2013US8586433 Compound semiconductor device and manufacturing method thereof
11/19/2013US8586432 Method for manufacturing vertical-channel tunneling transistor
11/19/2013US8586431 Three dimensional integration and methods of through silicon via creation
11/19/2013US8586430 Method of forming dielectric film and capacitor manufacturing method using the same
11/19/2013US8586429 Methods of forming an array of memory cells, methods of forming a plurality of field effect transistors, methods of forming source/drain regions and isolation trenches, and methods of forming a series of spaced trenches into a substrate
11/19/2013US8586428 Interconnection structure for N/P metal gates
11/19/2013US8586427 Thin film transistors and methods of manufacturing thin film transistors
11/19/2013US8586426 Method of forming isolation structures for SOI devices with ultrathin SOI and ultrathin box
11/19/2013US8586425 Thin film transistor
11/19/2013US8586424 Switching materials comprising mixed nanoscopic particles and carbon nanotubes and method of making and using the same
11/19/2013US8586423 Silicon controlled rectifier with stress-enhanced adjustable trigger voltage
11/19/2013US8586422 Optical semiconductor device having pre-molded leadframe with window and method therefor
11/19/2013US8586421 Method of forming semiconductor device package having high breakdown voltage and low parasitic inductance
11/19/2013US8586420 Power semiconductor arrangement and method for producing a power semiconductor arrangement
11/19/2013US8586419 Semiconductor packages including die and L-shaped lead and method of manufacture
11/19/2013US8586416 Method of manufacturing semiconductor device
11/19/2013US8586415 Dicing/die-bonding film, method of fixing chipped work and semiconductor device
1 ... 423 424 425 426 427 428 429 430 431 432 433 434 435 436 437 438 439 440 441 442 443 ... 6590