Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2013
11/21/2013US20130309846 Methods of forming a silicon seed layer and layers of silicon and silicon-containing material therefrom
11/21/2013US20130309845 Method of processing substrate
11/21/2013US20130309844 Laser beam processing method for wafer
11/21/2013US20130309843 Sos substrate having low defect density in vicinity of interface
11/21/2013US20130309842 Method for manufacturing soi wafer
11/21/2013US20130309841 Method for molecular bonding of silicon and glass substrates
11/21/2013US20130309840 Combination of a substrate and a wafer
11/21/2013US20130309839 Methods of forming semiconductor devices having recesses
11/21/2013US20130309838 Methods for fabricating finfet integrated circuits on bulk semiconductor substrates
11/21/2013US20130309837 Preventing shorting of adjacent devices
11/21/2013US20130309834 Method of semiconductor integrated circuit fabrication
11/21/2013US20130309832 Mos capacitors with a finfet process
11/21/2013US20130309829 Method of Forming a Semiconductor Device
11/21/2013US20130309826 Radical oxidation process for fabricating a nonvolatile charge trap memory device
11/21/2013US20130309818 Manufacturing method of substrate for a semiconductor package, manufacturing method of semiconductor package, substrate for a semiconductor package and semiconductor package
11/21/2013US20130309817 Method of fabricating package structure
11/21/2013US20130309816 Semiconductor encapsulation method
11/21/2013US20130309815 Isostress grid array and method of fabrication thereof
11/21/2013US20130309814 Lid attach process
11/21/2013US20130309813 Embedded 3D Interposer Structure
11/21/2013US20130309811 WAFER LEVEL PACKAGED GaN POWER DEVICE AND MANUFACTURING METHOD THEREOF
11/21/2013US20130309810 Multi-chip package with offset die stacking and method of making same
11/21/2013US20130309791 Semiconductor active matrix on buried insulator
11/21/2013US20130309786 Method for manufacturing image sensor module
11/21/2013US20130309785 Rotational absorption spectra for semiconductor manufacturing process monitoring and control
11/21/2013US20130309783 Hydrogen-blocking film for ferroelectric capacitors
11/21/2013US20130309621 Method and apparatus for adjusting wafer warpage
11/21/2013US20130309602 Optically semitransmissive film, photomask blank and photomask, and method for designing optically semitransmissive film
11/21/2013US20130309449 Method for treating the surface of a silicon substrate
11/21/2013US20130309048 Apparatus and method for transporting wafer-shaped articles
11/21/2013US20130309047 Substrate relay apparatus, substrate relay method, and substrate processing apparatus
11/21/2013US20130309045 Substrate processing apparatus
11/21/2013US20130308928 Heater block and a substrate treatment apparatus
11/21/2013US20130308367 Structure and method for forming conductive path in resistive random-access memory device
11/21/2013US20130308274 Thermal spreader having graduated thermal expansion parameters
11/21/2013US20130307963 Method and apparatus for inspecting patterns formed on a substrate
11/21/2013US20130307628 Radio Frequency Power Amplifier and Packaging and Fabrication Method Thereof
11/21/2013US20130307626 Silicon-on-Insulator High Power Amplifiers
11/21/2013US20130307578 Tamper resistant ic
11/21/2013US20130307166 Method for forming patterns of dense conductor lines and their contact pads, and memory array having dense conductor lines and contact pads
11/21/2013US20130307165 Method for low temperature wafer bonding and bonded structure
11/21/2013US20130307164 Integrated circuit apparatus, systems, and methods
11/21/2013US20130307163 Semiconductor device and method of manufacturing the same
11/21/2013US20130307162 Wiring board and method for manufacturing the same
11/21/2013US20130307161 Chip package and method for forming the same
11/21/2013US20130307160 Via Structure For Three-Dimensional Circuit Integration
11/21/2013US20130307159 Physical design symmetry and integrated circuits enabling three dimentional (3d) yield optimization for wafer to wafer stacking
11/21/2013US20130307158 Curvilinear wiring structure to reduce areas of high field density in an integrated circuit
11/21/2013US20130307156 Reliable Area Joints for Power Semiconductors
11/21/2013US20130307155 Semiconductor device, method of manufacturing the same, and electronic component
11/21/2013US20130307152 Semiconductor package and fabrication method thereof
11/21/2013US20130307151 Method to resolve hollow metal defects in interconnects
11/21/2013US20130307150 Copper interconnect structure and its formation
11/21/2013US20130307147 Chip package and method for forming the same
11/21/2013US20130307146 Mounting structure of electronic component and method of manufacturing the mounting structure of the electronic component
11/21/2013US20130307145 Semiconductor package and method of fabricating the same
11/21/2013US20130307143 Wafer-level packaging mechanisms
11/21/2013US20130307142 Selective solder bump formation on wafer
11/21/2013US20130307141 Wire-Based Methodology of Widening the Pitch of Semiconductor Chip Terminals
11/21/2013US20130307140 Packaging with interposer frame
11/21/2013US20130307137 Chip package and method for forming the same
11/21/2013US20130307134 Conductive chip disposed on lead semiconductor package and methods of making the same
11/21/2013US20130307133 Semiconductor device assembly and semiconductor device and method of manufacturing the same
11/21/2013US20130307128 Semiconductor packages with thermal dissipation structures and emi shielding
11/21/2013US20130307127 Semiconductor Device Including A Silicate Glass Structure and Method of Manufacturing A Semiconductor Device
11/21/2013US20130307126 Semiconductor structure and process thereof
11/21/2013US20130307124 Method for manufacturing electronic component, and electronic apparatus
11/21/2013US20130307122 Bipolar transistor with embedded epitaxial external base region and method of forming the same
11/21/2013US20130307118 Semiconductor Devices, Methods of Manufacture Thereof, and Methods of Manufacturing Capacitors
11/21/2013US20130307117 Structure and Method for Inductors Integrated into Semiconductor Device Packages
11/21/2013US20130307115 Anti-fuse structure and fabrication
11/21/2013US20130307088 Metal gate finfet device and method of fabricating thereof
11/21/2013US20130307087 Method for forming a self-aligned contact opening by a lateral etch
11/21/2013US20130307086 Mask free protection of work function material portions in wide replacement gate electrodes
11/21/2013US20130307081 Gate stack with electrical shunt in end portion of gate stack
11/21/2013US20130307080 Semiconductor device with self-aligned interconnects
11/21/2013US20130307076 Method and structure for forming fin resistors
11/21/2013US20130307074 Epitaxial Semiconductor Resistor With Semiconductor Structures On Same Substrate
11/21/2013US20130307073 Fluoropolymer Mask for Transistor Channel Definition
11/21/2013US20130307072 Double Diffused Metal Oxide Semiconductor Device and Manufacturing Method Thereof
11/21/2013US20130307070 Double Diffused Drain Metal Oxide Semiconductor Device and Manufacturing Method Thereof
11/21/2013US20130307063 MANUFACTURING METHOD OF GaN-BASED SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
11/21/2013US20130307060 Trench semiconductor devices with edge termination structures, and methods of manufacture thereof
11/21/2013US20130307059 Semiconductor Device and Method for Manufacturing a Semiconductor Device
11/21/2013US20130307058 Semiconductor Devices Including Superjunction Structure and Method of Manufacturing
11/21/2013US20130307052 Sonos ono stack scaling
11/21/2013US20130307050 Nonvolatile memory device and method for fabricating the same
11/21/2013US20130307049 Semiconductor device and method of fabricating the same
11/21/2013US20130307048 Semiconductor Device and a Method of Manufacturing the Same
11/21/2013US20130307044 Selective Air Gap Isolation In Non-Volatile Memory
11/21/2013US20130307034 Semiconductor Structure and Method for Manufacturing the Same
11/21/2013US20130307033 Borderless Contact For An Aluminum-Containing Gate
11/21/2013US20130307032 Methods of forming conductive contacts for a semiconductor device
11/21/2013US20130307031 Semiconductor structure, semiconductor device having a semiconductor structure, and method for manufacturing a semiconductor structure
11/21/2013US20130307028 Nonvolatile memory device and method for fabricating the same
11/21/2013US20130307024 Semiconductor device and method for manufacturing semiconductor device
11/21/2013US20130307023 Semiconductor device and method for manufacturing semiconductor device
11/21/2013US20130307021 CMOS Device and Method of Forming the Same
11/21/2013US20130306995 Method for making glass substrate for display, glass substrate and display panel
11/21/2013US20130306992 Silicon carbide semiconductor device and method for manufacturing the same
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