Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2013
11/27/2013CN103415915A Nucleation of aluminum nitride on a silicon substrate using an ammonia preflow
11/27/2013CN103415914A Post-planarization densification
11/27/2013CN103415913A Process for producing silicon wafer
11/27/2013CN103415912A Apparatus and process for atomic layer deposition
11/27/2013CN103415911A Catalytic chemical vapor deposition device, and deposition method and catalyst body surface treatment method using same
11/27/2013CN103415910A Off-angled heating of the underside of a substrate using a lamp assembly
11/27/2013CN103415810A 曝光装置 Exposure device
11/27/2013CN103415809A Resist underlayer film formation composition and method for forming resist pattern using same
11/27/2013CN103415649A Atomic layer deposition carousel with continuous rotation and methods of use
11/27/2013CN103415633A Copper or copper alloy reduced in a-ray emission, and bonding wire obtained from copper or copper alloy as raw material
11/27/2013CN103415488A Oxide sintered compact and sputtering target
11/27/2013CN103415381A Die, manufacturing method for die, and manufacturing method for nanoimprinted film
11/27/2013CN103415372A Polishing composition
11/27/2013CN103415352A Liquid-application device and liquid-application method
11/27/2013CN103413867A Diffusion and junction forming method for solar cell, solar cell and manufacturing method thereof
11/27/2013CN103413842A Al doped ZnO transparent conducting micrometer/nanometer wire array film and preparation method thereof
11/27/2013CN103413837A MOS capacitor of germanium based high dielectric constant insulated medium and preparation method thereof
11/27/2013CN103413836A Trench gate Schottky barrier diode
11/27/2013CN103413835A Film transistor and manufacturing method thereof
11/27/2013CN103413834A Thin film transistor and manufacturing method, array substrate and display device thereof
11/27/2013CN103413833A Flexible ZnO based thin film transistor and preparation method thereof
11/27/2013CN103413832A Metal oxide thin film transistor and preparation method thereof
11/27/2013CN103413831A Horizontal high-voltage device and manufacturing method of horizontal high-voltage device
11/27/2013CN103413830A Laterally high-voltage MOSFET and manufacturing method thereof
11/27/2013CN103413829A U-type surrounding gate tunneling transistor device and manufacturing method thereof
11/27/2013CN103413828A Polygon channel layer multiple-grid structure tunneling transistor and forming method thereof
11/27/2013CN103413826A Planar insulated gate bipolar transistor and manufacturing method thereof
11/27/2013CN103413825A Flat type insulated gate bipolar transistor and manufacturing method thereof
11/27/2013CN103413824A RC-LIGBT device and manufacturing method thereof
11/27/2013CN103413823A 超级结晶体管及其形成方法 Super-junction transistor and method of forming
11/27/2013CN103413822A Method for reducing leakage current of floating buried layer semiconductor device
11/27/2013CN103413815A 晶圆级图像传感器封装结构和晶圆级图像传感器封装方法 A wafer level image sensor package structure and an image sensor wafer level packaging method
11/27/2013CN103413813A Array substrate, manufacturing method for array substrate and display device for array substrate
11/27/2013CN103413812A Array substrate, preparing method of array substrate and displaying device
11/27/2013CN103413811A Array substrate, preparing method of array substrate and displaying device
11/27/2013CN103413810A Pixel structure, display panel, and manufacture method of pixel structure
11/27/2013CN103413809A Split gate type flash memory and forming method thereof
11/27/2013CN103413807A Low-capacitance unidirectional transient voltage suppressor
11/27/2013CN103413803A Hybrid integrated circuit and manufacturing method thereof
11/27/2013CN103413796A Substrate/multi-chip-integrated large port interconnection chip and realization method thereof
11/27/2013CN103413795A Semiconductor device packing structure and semiconductor device packing technological process
11/27/2013CN103413791A Ceramic copper-coated film heat sink module with good heat dissipation efficiency and manufacturing method thereof
11/27/2013CN103413788A Method for preparing non-planar metal nanocrystalline multi-bit memory device
11/27/2013CN103413787A Method for preparing step-shaped oxide layer Au/SiO2/Si nanometer rod memory device
11/27/2013CN103413786A Storage unit, forming method of storage unit and driving method of storage unit
11/27/2013CN103413785A Chip cutting method and chip packaging method
11/27/2013CN103413784A Array substrate, preparing method thereof and display device
11/27/2013CN103413783A Array substrate, method for manufacturing same and display device
11/27/2013CN103413782A Array substrate, method for manufacturing array substrate and display panel
11/27/2013CN103413781A Method for preparing metal hard mask layers and method for preparing copper interconnection structure
11/27/2013CN103413780A Method for manufacturing three-dimensional through hole interconnection structure based on molten glass skeleton
11/27/2013CN103413779A Through-silicon-via etching method
11/27/2013CN103413778A Forming method of isolation structure
11/27/2013CN103413777A Deep groove filling structure and manufacturing method thereof
11/27/2013CN103413776A Composite substrate with isolation layer and manufacturing method thereof
11/27/2013CN103413775A Manufacturing method and device of flexible display device
11/27/2013CN103413774A Ceramic positioning cap
11/27/2013CN103413773A Silicon wafer fully-automatic feeding/discharging manipulator and movement trajectory control method thereof
11/27/2013CN103413772A Wafer thinning method
11/27/2013CN103413771A Dispatching method of wafer acceptance test machine
11/27/2013CN103413770A Salient point manufacturing method
11/27/2013CN103413769A Wafer level chip size packaging method
11/27/2013CN103413768A Method for manufacturing silicon substrate switchover plate for electronic device packaging
11/27/2013CN103413767A Packaging-first-etching-second chip upside-upward-installation three-dimensional system-in-package structure and process method
11/27/2013CN103413766A Etching-first-packaging-second upside-upward-installation three-dimensional system-in-package metal circuit board structure and process method
11/27/2013CN103413765A Groove MOSFET device and manufacturing method thereof
11/27/2013CN103413764A Super junction power device and forming method thereof
11/27/2013CN103413763A 超级结晶体管及其形成方法 Super-junction transistor and method of forming
11/27/2013CN103413762A Semiconductor structure and corresponding manufacturing method thereof
11/27/2013CN103413761A 绝缘栅双极型晶体管及其制造方法 Insulated gate bipolar transistor and its manufacturing method
11/27/2013CN103413760A Method for constructing organic micron linear array with form board assisting in volatilization induced self-assemble
11/27/2013CN103413759A Texture surface making method of polycrystalline silicon wafers
11/27/2013CN103413758A Manufacturing method for semiconductor fin ray and manufacturing method for FinFET device
11/27/2013CN103413757A Laser processing apparatus and method of controlling the same
11/27/2013CN103413756A Split gate resistor structure and manufacturing method thereof
11/27/2013CN103413755A Method for preparing monocrystal SiC film with silicon substrate gel lamination pyrolytic reaction method
11/27/2013CN103413754A Method for processing glass wafer, glass wafer and method for detecting glass wafer
11/27/2013CN103413746A Germanium implanting method for improving service cycle of ion implanter
11/27/2013CN103413694A Method for manufacturing plane solid state supercapacitor
11/27/2013CN103412450A Array substrate, manufacturing method thereof and display device
11/27/2013CN103412444A Array substrate and manufacturing method thereof, and display panel
11/27/2013CN103411134A Air passage for double welding arm and welding/suction nozzle of LED wafer sorting machine
11/27/2013CN103409804A Laser processing apparatus and method of controlling the same
11/27/2013CN103409654A Silver-gold-palladium alloy bump manufacture line
11/27/2013CN103406280A Bad chip screening method
11/27/2013CN102723290B Packaging-first and etching-later manufacturing method for chip formal single-surface three-dimensional circuit and packaging structure of chip formal single-surface three-dimensional circuit
11/27/2013CN102723286B Packaging-first and etching-later manufacturing method for chip formal double-surface three-dimensional circuit and packaging structure of chip formal double-surface three-dimensional circuit
11/27/2013CN102723285B Etching-first and packaging-later manufacturing method for chip formal single-surface three-dimensional circuit and packaging structure of chip formal single-surface three-dimensional circuit
11/27/2013CN102664166B CMOS (complementary metal-oxide-semiconductor) device and manufacturing method thereof
11/27/2013CN102593065B Preparation method for backgate thin film transistor storage
11/27/2013CN102543884B Method for manufacturing one time programmable (OTP) device
11/27/2013CN102543832B Method for manufacturing transparent silicon-based substrate with integrated circuit (IC) device
11/27/2013CN102522318B Self-splitting and transfer method for GaN-based epitaxial film
11/27/2013CN102496599B Flexible substrate structure and method for manufacturing same
11/27/2013CN102468304B Memory device and method of fabricating same
11/27/2013CN102437195B Film transistor and its manufacturing method
11/27/2013CN102422391B Method for manufacturing nitride semiconductor element
11/27/2013CN102403241B Double-side plastic packaging method of LGA (Land Grid Array)
11/27/2013CN102396061B Methods of depositing antimony-comprising phase change material onto substrate and methods of forming phase change memory circuitry
11/27/2013CN102386082B Method for forming semiconductor device
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