Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2013
11/19/2013US8586414 Top exposed package and assembly method
11/19/2013US8586413 Multi-chip module having a support structure and method of manufacture
11/19/2013US8586412 Semiconductor device and method for manufacturing thereof
11/19/2013US8586411 Manufacturing a filling of a gap in semiconductor devices
11/19/2013US8586410 Enhanced magnetic self-assembly using integrated micromagnets
11/19/2013US8586409 Component with buried ductile conductive bumps and method of electrical connection between said component and a component equipped with hard conductive points
11/19/2013US8586408 Contact and method of formation
11/19/2013US8586407 Method for depackaging prepackaged integrated circuit die and a product from the method
11/19/2013US8586406 Method for forming an oxide thin film transistor
11/19/2013US8586404 Method for reducing contact resistance of CMOS image sensor
11/19/2013US8586403 Process and structures for fabrication of solar cells with laser ablation steps to form contact holes
11/19/2013US8586402 Method for the precision processing of substrates
11/19/2013US8586401 Gas injection device and solar cell manufacturing method using the same
11/19/2013US8586400 Fabricating method of organic photodetector
11/19/2013US8586399 Detection device manufacturing method using impurity semiconductor layer in arrayed pixels
11/19/2013US8586398 Sodium-incorporation in solar cell substrates and contacts
11/19/2013US8586397 Method for forming diffusion regions in a silicon substrate
11/19/2013US8586396 Method for producing a silicon solar cell with a back-etched emitter as well as a corresponding solar cell
11/19/2013US8586394 Method for producing a subminiature “micro-chip” oxygen sensor for control of internal combustion engines or other combustion processes, oxygen sensor and an exhaust safety switch
11/19/2013US8586393 Stress sensor for in-situ measurement of package-induced stress in semiconductor devices
11/19/2013US8586392 Display device and manufacturing method thereof
11/19/2013US8586390 Method for manufacturing semiconductor device
11/19/2013US8586189 Gas-barrier film and organic device comprising same
11/19/2013US8586133 Method for strengthening adhesion between dielectric layers formed adjacent to metal layers
11/19/2013US8585933 Methods for AIGS silver-containing photovoltaics
11/19/2013US8585932 Methods and articles for AIGS silver-containing photovoltaics
11/19/2013US8585918 Method of etching a silicon-based material
11/19/2013US8585862 Plasma processing device and plasma discharge state monitoring device
11/19/2013US8585830 Substrate processing apparatus and substrate processing method
11/19/2013US8585112 Sample conveying mechanism
11/19/2013US8584523 Sensor device and method for manufacturing a sensor device
11/19/2013US8584349 Flexible manufacturing system
11/19/2013CA2694777C Feature forming process using acid-containing composition
11/19/2013CA2448006C High voltage, high temperature capacitor structures and methods of fabricating same
11/14/2013WO2013170203A1 Wafer scale packaging die with offset redistribution layer capture pad
11/14/2013WO2013170197A1 Wafer scale packaging die having redistribution layer capture pad with at least one void
11/14/2013WO2013170130A1 Formulations for wet etching nipt during silicide fabrication
11/14/2013WO2013169818A1 Measurement recipe optimization based on spectral sensitivity and process variation
11/14/2013WO2013169816A1 Measurement model optimization based on parameter variations across a wafer
11/14/2013WO2013169791A1 Metrology tool with combined x-ray and optical scatterometers
11/14/2013WO2013169776A2 Complementary metal-oxide-semiconductor (cmos) device and method
11/14/2013WO2013169770A1 Visual feedback for inspection algorithms and filters
11/14/2013WO2013169763A1 Switching device structures and methods
11/14/2013WO2013169758A1 Resistive memory having confined filament formation
11/14/2013WO2013169744A1 Permutational memory cells
11/14/2013WO2013169677A1 Hyperbaric methods and systems for surface treatment, cleaning, and drying
11/14/2013WO2013169608A1 Contact probe with conductively coupled plungers
11/14/2013WO2013169559A1 Siox process chemistry development using microwave plasma chemical vapor deposition
11/14/2013WO2013169545A1 Compliant micro device transfer head
11/14/2013WO2013169544A1 Multi-cell rotary end effector mechanism
11/14/2013WO2013169501A1 Enhanced hydrogen barrier encapsulation of ferroelectric capacitors
11/14/2013WO2013169477A1 Electroplating processor with geometric electrolyte flow path
11/14/2013WO2013169424A1 Graphene cap for copper interconnect structures
11/14/2013WO2013169243A1 High performance transistor
11/14/2013WO2013169208A1 Non-acidic isotropic etch-back for silicon wafer solar cells
11/14/2013WO2013169019A1 Electrode-connecting structure for ceramic heater
11/14/2013WO2013168919A1 Apparatus and method for wirelessly receiving power, and apparatus and method for wirelessly transmitting power
11/14/2013WO2013168903A1 Thinner composition
11/14/2013WO2013168886A1 Air conditioning apparatus for network room rack
11/14/2013WO2013168875A1 Flexible integrated circuit and method for manufacturing flexible integrated circuit
11/14/2013WO2013168825A1 Gas supply device and substrate processing device
11/14/2013WO2013168813A1 Etching fluid and production method for silicon-based substrate using same
11/14/2013WO2013168796A1 Semiconductor device and method for producing semiconductor device
11/14/2013WO2013168782A1 Substrate case, substrate conveyance case, case cover, substrate conveyance system, and method for conveying substrate
11/14/2013WO2013168774A1 Thin-film transistor, display device, image sensor, and x-ray sensor
11/14/2013WO2013168707A1 Heat dissipation substrate and method for producing same
11/14/2013WO2013168645A1 Electronic device, laminated structure, and method for manufacturing same
11/14/2013WO2013168634A1 Transfer method and thermal nanoimprint device
11/14/2013WO2013168624A1 Semiconductor device
11/14/2013WO2013168623A1 Glass composition for semiconductor junction protection, method for producing semiconductor device, and semiconductor device
11/14/2013WO2013168611A1 Adhering apparatus and adhering method
11/14/2013WO2013168610A1 Resist underlayer film-forming composition
11/14/2013WO2013168567A1 Coating liquid for forming sulfide semiconductor, sulfide semiconductor thin film, and thin film solar cell
11/14/2013WO2013168557A1 Defect inspection method and defect inspection device
11/14/2013WO2013168521A1 Resin-sealed semiconductor device and production method therefor
11/14/2013WO2013168509A1 Etching method for substrate to be processed and plasma-etching device
11/14/2013WO2013168487A1 Defect analysis assistance device, program executed by defect analysis assistance device, and defect analysis system
11/14/2013WO2013168484A1 Semiconductor device and method for manufacturing same
11/14/2013WO2013168471A1 Electrostatic chuck and production method for electrostatic chuck
11/14/2013WO2013168457A1 Surface position measurement device, surface position measurement method, exposure device, and device production method
11/14/2013WO2013168456A1 Surface position measurement device, exposure device, and device production method
11/14/2013WO2013168444A1 Circumferential polishing device for disc-shaped workpieces
11/14/2013WO2013168398A1 Substrate for semiconductor element and method for producing same, and semiconductor element, photoelectric conversion element, light-emitting element and electronic circuit
11/14/2013WO2013168372A1 Production method for semiconductor substrate
11/14/2013WO2013168371A1 Epitaxial substrate, semiconductor device, and semiconductor device manufacturing method
11/14/2013WO2013168360A1 Semiconductor-wafer evaluation method and semiconductor-wafer evaluation device
11/14/2013WO2013168354A1 Three-dimensional integrated circuit having stabilization structure for power supply voltage, and method for manufacturing same
11/14/2013WO2013168352A1 Mounting structure and method for manufacturing same
11/14/2013WO2013168314A1 Semiconductor device production method and semiconductor device
11/14/2013WO2013168278A1 Electronic-component supporting head, electronic-component detection method, and die feeding apparatus
11/14/2013WO2013168238A1 Glass composition for semiconductor junction protection, method for producing semiconductor device, and semiconductor device
11/14/2013WO2013168237A1 Glass composition for semiconductor junction protection, method for manufacturing semiconductor device, and semiconductor device
11/14/2013WO2013168236A1 Resin-sealed semiconductor device and production method for resin-sealed semiconductor device
11/14/2013WO2013168223A1 Semiconductor package and method for manufacturing same
11/14/2013WO2013168159A1 Composition and method for forming a dielectric layer
11/14/2013WO2013168047A1 Process for manufacture of semiconductor devices
11/14/2013WO2013167614A1 Aluminium coated copper ribbon
11/14/2013WO2013167569A1 Apparatus for moulding a housing structure for a plurality of electronic components, and a housing structure of this kind for a plurality of electronic components
11/14/2013WO2013167321A1 Two-step method for joining a semiconductor to a substrate with connecting material based on silver
11/14/2013WO2013166981A1 Nor structure flash memory and manufacturing method thereof