Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2013
11/21/2013US20130306990 Wafer precursor prepared for group iii nitride epitaxial growth on a composite substrate having diamond and silicon carbide layers, and semiconductor laser formed thereon
11/21/2013US20130306989 Diamond and diamond composite material
11/21/2013US20130306988 Diamond and diamond composite material
11/21/2013US20130306985 Semiconductor device and production method thereof
11/21/2013US20130306982 Semiconductor device and method for producing same
11/21/2013US20130306979 Semiconductor substrate and semiconductor device, and manufacturing method of semiconductor substrate
11/21/2013US20130306978 Passivation of group iii-nitride heterojunction devices
11/21/2013US20130306977 Compound semiconductor substrate and manufacturing method of the same
11/21/2013US20130306970 Positive photosensitive resin composition and uses thereof
11/21/2013US20130306965 Thin film transistor and thin film transistor array panel including the same
11/21/2013US20130306948 Peeling method and method for manufacturing display device using the peeling method
11/21/2013US20130306937 3d nano-electro-mechanical multiple-state carbon nanotube device structures and methods of fabrication
11/21/2013US20130306927 Atomic layer deposition of a metal chalcogenide material and related memory cells and methods of forming memory cells
11/21/2013US20130306593 Electrostatic chuck and manufacturing method thereof
11/21/2013US20130306242 Device and method for the application of a sheet-like jointing means onto a contact area of a wafer
11/21/2013US20130306240 System and Method for Controlling Plasma With an Adjustable Coupling to Ground Circuit
11/21/2013US20130306239 Plasma chamber top piece assembly
11/21/2013US20130306116 Substrate cleaning apparatus
11/21/2013US20130306102 Method of manufacturing semiconductor device and method of cleaning semiconductor substrate
11/21/2013US20130305992 Rotating and holding apparatus for semiconductor substrate and conveying apparatus of rotating and holding apparatus for semiconductor substrate
11/21/2013US20130305991 Substrate processing apparatus
11/21/2013DE19964626B4 Leistungshalbleiterbauelement mit halbisolierendem polykristallinem Silicium Power semiconductor component with a semi-insulating polycrystalline silicon
11/21/2013DE112012000962T5 Selektives epitaxiales Anwachsen von Silicium bei niedriger Temperatur zur Integration von Einheiten Selective epitaxial growth of silicon at low temperature for the integration of units
11/21/2013DE112012000724T5 Konditionierer für ein Poliertuch und Herstellungsverfahren hierfür A conditioner for a polishing cloth and manufacturing method thereof
11/21/2013DE112012000579T5 Anlage, Verfahren und Reaktionskammer System, method and reaction chamber
11/21/2013DE112012000575T5 Polierzusammensetzung, Polierverfahren unter Verwendung derselben und Substrat-Herstellungsverfahren Polishing composition, the polishing method using the same and substrate manufacturing method
11/21/2013DE102013209110A1 Verfahren zur Herstellung von FinFET-Vorrichtungen mit alternativen Kanalmaterialien Process for the preparation of FinFET devices with alternative channel materials
11/21/2013DE102013208835A1 Haftbandbefestigungsverfahren Adhesive tape fastening method
11/21/2013DE102013208833A1 Laserstrahlbearbeitungsverfahren für Wafer Laser beam machining method for wafer
11/21/2013DE102013208818A1 Zuverlässige Bereichsverbindungsstellen für Leistungshalbleiter Reliable field joints for power semiconductors
11/21/2013DE102013105136A1 Dichtungsringe in elektrochemischen Prozessvorrichtungen Seals in electrochemical process devices
11/21/2013DE102013105110A1 Halbleitervorrichtung und Verfahren zum Herstellen einer Halbleitervorrichtung A semiconductor device and method of manufacturing a semiconductor device
11/21/2013DE102013105060A1 Halbleitervorrichtungen mit Superjunction-Struktur und Verfahren zur Herstellung Semiconductor devices with super junction structure and methods for preparing
11/21/2013DE102013105057A1 Halbleiterstruktur, halbleiterbauelement mit einer halbleiterstruktur und verfahren zur herstellung einer halbleiterstruktur A semiconductor structure semiconductor device with a semiconductor structure and method of manufacturing a semiconductor structure
11/21/2013DE102013105009A1 Halbleitervorrichtung mit einer Silikatglasstruktur und Verfahren zum Herstellen einer Halbleitervorrichtung A semiconductor device comprising a silicate glass structure and method of manufacturing a semiconductor device
11/21/2013DE102013104742A1 Verdrahtungselement und Halbleitermodul mit demselben Wiring member and the semiconductor module with the same
11/21/2013DE102013103916A1 Housing comprises chip formed in first region, molding composition formed in second region, first- and second polymer layers, several connecting structures formed between polymer layers, metal-insulator-metal capacitor, and metal bump
11/21/2013DE102013101031A1 Echtzeit- kalibrierung von lampenmodulen in einer wafer-verarbeitungskammer Real-time calibration of lamp modules in a wafer processing chamber
11/21/2013DE102013008100A1 Vorrichtung zur Veränderung von Abständen zwischen einzelnen Substraten Means for modifying the distances between individual substrates
11/21/2013DE102012208251A1 Elektrische Kontaktierung für Halbleiter The electrical contact for semiconductor
11/21/2013DE102012112758A1 Semiconductor package for use as wafer level package, has contact whose surface contacts portion of distribution lines at different level than surface of casting mass under distribution lines that extend over borders of semiconductor die
11/21/2013DE102012107496A1 Metallgatter-FINFET-Bauelement und Verfahren zu seiner Herstellung Metal-gate FinFET device and process for its preparation
11/21/2013DE102012009746A1 Method for checking thermal coupling between semiconductor component and heat-conductive associated cooling element, involves passing measurement current through semiconductor material heated by load current during measuring phase
11/21/2013DE102011080841B4 Verfahren zur Fertigung einer Siliciumcarbid-Halbleitervorrichtung A method for manufacturing a silicon carbide semiconductor device
11/21/2013DE102011054372B4 Verfahren zur Herstellung einer Halbleitertransistorstruktur A method of manufacturing a semiconductor transistor structure
11/21/2013DE102011050228B9 Halbleiter-Package und Verfahren zur Herstellung eines Halbleiter-Packages mit Induktionsspule The semiconductor package and method for manufacturing a semiconductor package with inductor
11/21/2013DE102011005528B4 Herstellungsverfahren für eine organische lichtemittierende Anzeigevorrichtung Manufacturing method for an organic light emitting display device
11/20/2013EP2665101A1 Method of producing a high-voltage LDMOS transistor
11/20/2013EP2665091A2 Equipment for substrate surface treatment
11/20/2013EP2665090A1 Laser processing method
11/20/2013EP2665089A1 COMPOSITION FOR FORMING p-TYPE DIFFUSION LAYER, METHOD OF PRODUCING SILICON SUBSTRATE HAVING p-TYPE DIFFUSION LAYER, METHOD FOR PRODUCING PHOTOVOLTAIC CELL , AND PHOTOVOLTAIC CELL
11/20/2013EP2665088A2 Layered bonded structures formed from reactive bonding of zinc metal and zinc peroxide
11/20/2013EP2665087A2 Method for manufacturing graphene using light and graphene manufactured using the same
11/20/2013EP2665086A1 Method for producing a substrate with various active areas and planar and three-dimensional transistors
11/20/2013EP2664696A2 Process for growth of low dislocation density gan
11/20/2013EP2664636A1 Active energy ray-curable resin composition, microrelief structure, and method for producing microrelief structure
11/20/2013EP2664628A1 Resin composition for photoimprinting, patterning method and etching mask
11/20/2013EP2664430A1 Method for producing mold for fine pattern transfer, method for producing diffraction grating using same, and method for manufacturing organic el element which comprises the diffraction grating
11/20/2013EP2664427A1 Temperature adjusting device, and imprinting device using same
11/20/2013EP2664224A1 Method of transferring and electrically joining a high density multilevel thin film to a circuitized and flexible organic substrate and associated devices
11/20/2013EP2664010A2 High power laser photo-conversion assemblies, apparatuses and methods of use
11/20/2013EP2664001A1 Standard cell architecture using double poly patterning for multi vt devices
11/20/2013EP2663998A2 Methods and systems of object based metrology for advanced wafer surface nanotopography
11/20/2013EP2663997A1 Methods for vacuum assisted underfilling
11/20/2013EP2663849A1 Micromechanical pressure sensor and method for producing same
11/20/2013EP2663419A2 Laser removal of conductive seed layers
11/20/2013EP2455512B1 Masking jig, substrate heating apparatus, and film formation method
11/20/2013EP2411558B1 Method for applying a zn(s, o) buffer layer to a semiconductor substrate by chemical bath deposition
11/20/2013EP2229692B1 Electrode tuning method
11/20/2013EP2204245B1 Method for assembling heat sink
11/20/2013EP2201601B1 Non-volatile semiconductor storage device and method of manufacturing the same
11/20/2013EP2186128B1 Nano-interconnects for atomic and molecular scale circuits
11/20/2013EP2048267B1 Process for producing single-crystal substrate with off angle
11/20/2013EP1992012B1 Novel structure and method for metal integration
11/20/2013EP1949435B1 Structure and method to increase strain enhancement with spacerless fet and dual liner process
11/20/2013EP1943672B1 Methods and apparatus for flip-chip-on-lead semiconductor package
11/20/2013EP1917678B1 Magnetic devices and techniques for formation thereof
11/20/2013EP1732122B1 Process of making a device having at least an element made of germanium
11/20/2013EP1551768B1 Process for manufacturing a gallium rich gallium nitride film
11/20/2013EP1533834B1 Vapor phase epitaxial apparatus and vapor phase epitaxial method
11/20/2013CN203300651U OLED (organic light-emitting diode) display
11/20/2013CN203300642U Three-dimensionally packaged DDR1 SDRAM memory
11/20/2013CN203300641U To-be-plated sample reducing surface over plating of silicon through-hole after copper plating
11/20/2013CN203300635U A triode lead frame
11/20/2013CN203300624U Film field effect transistor, array substrate and display device
11/20/2013CN203300623U Base plate and integrated circuit binding device
11/20/2013CN203300622U Substrate adsorption device
11/20/2013CN203300621U Heating seat and heating device for a wire bond process
11/20/2013CN203300620U Feeding apparatus with non-contact sucker
11/20/2013CN203300619U Mobile carry tool for semiconductor elements
11/20/2013CN203300618U Automatic conveying system for wafer testing
11/20/2013CN203300617U Flower basket for 3 inch nickel-plated silicon wafer
11/20/2013CN203300616U Graphite mold
11/20/2013CN203300615U BE plastic mold
11/20/2013CN203300614U Graphite sheet clamping point cleaning equipment
11/20/2013CN203300613U Substrate overturning equipment
11/20/2013CN203300612U Inflatable seat of reticle SMIF pod
11/20/2013CN203300611U Dry etching device lower electrode and dry etching device
11/20/2013CN1881062B Active matrix substrate production method and film component production method
11/20/2013CN1870261B 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
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