Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2013
11/06/2013CN103384910A Semiconductor device manufacturing method
11/06/2013CN103384904A Anisotropic electroconductive film
11/06/2013CN103384850A Positive photoresist composition, coating film thereof, and novolac phenol resin
11/06/2013CN103384822A Inspecting apparatus and method for manufacturing semiconductor device
11/06/2013CN103384731A Sulfuric acid electrolysis method and sulfuric acid electrolysis device
11/06/2013CN103384706A Dicing die-bonding film
11/06/2013CN103384637A Substrate processing apparatus
11/06/2013CN103384063A Surge protection circuit and production method thereof
11/06/2013CN103383991A Method for manufacturing light-emitting device
11/06/2013CN103383969A Schottky device and manufacturing method thereof
11/06/2013CN103383968A Interface charge compensation Schottky semiconductor device and manufacturing method for same
11/06/2013CN103383967A Charge compensation semiconductor device and preparing method thereof
11/06/2013CN103383966A Semiconductor device with improved robustness
11/06/2013CN103383963A 半导体结构及其制造方法 The semiconductor structure and a method of manufacturing
11/06/2013CN103383962A 半导体结构及其制造方法 The semiconductor structure and a method of manufacturing
11/06/2013CN103383961A FinFET结构及其制造方法 FinFET structure and manufacturing method
11/06/2013CN103383960A Semiconductor device and method of manufacturing the same
11/06/2013CN103383959A Crosswise overgrowth one-dimensional electron gas GaN-base high electron mobility transistor (HEMT) device and manufacturing method thereof
11/06/2013CN103383958A Reverse conducting (RC)-insulated gate bipolar transistor (IGBT) device and manufacturing method thereof
11/06/2013CN103383955A Semiconductor device and method of manufacturing the same
11/06/2013CN103383954A Passive super-junction semiconductor device and manufacturing method for same
11/06/2013CN103383953A Passive super-junction groove MOS device and manufacturing method for same
11/06/2013CN103383950A Self-luminous two-dimensional displayer and manufacturing method thereof
11/06/2013CN103383946A Array substrate, display device and preparation method of array substrate
11/06/2013CN103383945A Array substrate, display device and manufacturing method of array substrate
11/06/2013CN103383943A Semiconductor device and method of manufacturing the same
11/06/2013CN103383940A Semiconductor package and method for manufacturing same
11/06/2013CN103383939A Chip embedded packages and methods for forming a chip embedded package
11/06/2013CN103383938A Groove type power metal oxide semiconductor (MOS) device contact hole resistance detection structure
11/06/2013CN103383937A Via-free interconnect structure with self-aligned metal line interconnections
11/06/2013CN103383935A Semiconductor devices and methods of manufacturing the same
11/06/2013CN103383934A Semiconductor interconnect structure
11/06/2013CN103383933A Semiconductor device and method of fabricating
11/06/2013CN103383927A Semiconductor encapsulation and forming method thereof
11/06/2013CN103383926A Increased transistor performance by implementing an additional cleaning process in a stress liner approach
11/06/2013CN103383925A Display device, signal substrate of naked eye 3D function panel and manufacturing method of signal substrate
11/06/2013CN103383924A Array substrate and method of fabricating the same
11/06/2013CN103383923A Thin 3d fan-out embedded wafer level package (ewlb) for application processor and memory integration
11/06/2013CN103383922A Low-K dielectric barrier layer and forming method thereof
11/06/2013CN103383921A Semiconductor package and methods of formation thereof
11/06/2013CN103383920A Passivation for wafer level - chip-scale package devices
11/06/2013CN103383919A Methods for manufacturing a chip package
11/06/2013CN103383918A Semiconductor structure provided with metal grid electrode and manufacturing method of semiconductor structure
11/06/2013CN103383917A Low-voltage diode and manufacturing method thereof
11/06/2013CN103383916A Method for metalizing reverse side of P type silicon device chip used for eutectic bonding
11/06/2013CN103383915A Apparatus for the removal of a metal oxide from a substrate and methods therefor
11/06/2013CN103383914A 半导体结构及其制造方法 The semiconductor structure and a method of manufacturing
11/06/2013CN103383913A Ion beam dimension control for ion implantation process and apparatus, and advanced process control
11/06/2013CN103383912A Multiple edge enabled patterning
11/06/2013CN103383525A Lithography apparatus having dual reticle edge masking assemblies and method of use
11/06/2013CN103383188A Apparatus for substrate treatment and heating apparatus
11/06/2013CN103382551A Semiconductor film formation apparatus and process
11/06/2013CN102770944B Etching method and etching apparatus
11/06/2013CN102637642B Manufacture method of complementary metal-oxide-semiconductor transistor (CMOS) device
11/06/2013CN102569181B Method for manufacturing vertically interconnecting carbon nanotube bundle
11/06/2013CN102569149B Swirling flow non-contact gas claw clamping device
11/06/2013CN102566297B Photoetching system
11/06/2013CN102540749B Photoetching method
11/06/2013CN102509746B Diffusion process for crystalline silicon solar cell
11/06/2013CN102509695B Method for preparing patterning oxide conducting layer and etching table
11/06/2013CN102498586B Flexible capacitive micromachined ultrasonic transducer array with increased effective capacitance
11/06/2013CN102496618B 像素结构制作方法 Pixel structure production methods
11/06/2013CN102487010B Method for forming metal grid and MOS (Metal Oxide Semiconductor) transistor
11/06/2013CN102479693B Gate forming method
11/06/2013CN102468274B Shadow effect analyzing structure, and forming method and analyzing method thereof
11/06/2013CN102468268B Memory device and method of fabricating the same
11/06/2013CN102468167B Mos晶体管及其制作方法 Mos transistor and manufacturing method thereof
11/06/2013CN102456725B Monocrystal high K gate dielectric material and preparation method thereof
11/06/2013CN102456610B Method for controlling shape of cross section of back hole
11/06/2013CN102456537B Cluster semiconductor equipment oriented reaction chamber and transfer chamber function invoking method
11/06/2013CN102446901B Failure analysis structure, formation method of failure analysis structure and failure analysis method
11/06/2013CN102446817B Production method of interconnecting structure
11/06/2013CN102446802B Wafer platform
11/06/2013CN102412505B Method of manufacturing semiconductor laser
11/06/2013CN102403217B Preparation method for ultrathin chip
11/06/2013CN102376645B Forming method of CMOS (Complementary Metal-Oxide-Semiconductor Transistor) device stress film
11/06/2013CN102376627B Forming method of contact hole
11/06/2013CN102364690B Tunneling field effect transistor (TFET) and manufacturing method thereof
11/06/2013CN102354691B Quad flat non-lead (QFN) package with high density and manufacturing method
11/06/2013CN102347357B Metal-oxide-semiconductor field effect transistor (MOSFET) structure and manufacturing method thereof
11/06/2013CN102347233B Method and tray for improving thickness evenness of silicon wafer in process of backlining the silicon wafer
11/06/2013CN102341901B Systems, apparatus and methods for moving substrates
11/06/2013CN102339809B QFN (quad flat non-lead) package with multiple circles of pins and manufacturing method thereof
11/06/2013CN102334180B Techniques for independently controlling deflection, deceleration, and focus of an ion beam
11/06/2013CN102332448B Semiconductor structure and manufacture method thereof
11/06/2013CN102332423B Process for reducing chemical-mechanical polishing crack on buried layer cavity silicon-on-insulator (SOI) wafer
11/06/2013CN102317748B Substrate fitted with sensor and method for manufacturing substrate fitted with sensor
11/06/2013CN102301475B Photoelectric conversion apparatus and imaging system
11/06/2013CN102299056B Preparation method of III-nitride quantum dot structure
11/06/2013CN102292801B Field effect transistor and method for manufacturing same
11/06/2013CN102290435B Large-area perfect quantum dot and manufacturing method of array thereof
11/06/2013CN102290346B Method for planarization of substrates
11/06/2013CN102280394B LED, wafer inspection apparatus and inspection method of the same
11/06/2013CN102272933B Tunnel field effect transistor and method of manufacturing same
11/06/2013CN102272911B Wire bonding apparatus and wire bonding method
11/06/2013CN102260870B Preparation method of sub-micron-sized two-dimensional dielectric cylindrical photonic crystal
11/06/2013CN102244036B Method for manufacturing electrode insulation layer of liquid crystal display with wide viewing angle
11/06/2013CN102244031B Contact hole and semiconductor device as well as formation method of contact hole and semiconductor device
11/06/2013CN102244017B Encapsulation method for encapsulating surface glass of flake component
11/06/2013CN102237312B Method for fabricating a semiconductor device
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