Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2013
11/07/2013US20130295746 Combination of a substrate and a wafer
11/07/2013US20130295740 Forming cmos with close proximity stressors
11/07/2013US20130295739 Method of manufacturing semiconductor device
11/07/2013US20130295738 Semiconductor process
11/07/2013US20130295736 Fabrication method of trench power semiconductor structure
11/07/2013US20130295735 Semiconductor process
11/07/2013US20130295730 Semiconductor substrate with transistors having different threshold voltages
11/07/2013US20130295727 Programmable Semiconductor Interposer for Electronic Package and Method of Forming
11/07/2013US20130295726 Integrated Memory Arrays, And Methods Of Forming Memory Arrays
11/07/2013US20130295725 Semiconductor package and method of forming the same
11/07/2013US20130295723 Package 3D Interconnection and Method of Making Same
11/07/2013US20130295721 Apparatus to fabricate flip-chip packages and method of fabricating flip-chip packages using the same
11/07/2013US20130295720 Methods for manufacturing a chip package
11/07/2013US20130295718 Thin-film transistor, method of fabricating the thin-film transistor, and display substrate using the thin-film transistor
11/07/2013US20130295708 Methods for forming semiconductor materials by atomic layer deposition using halide precursors
11/07/2013US20130295705 Method for forming deposition film, and method for producing display device
11/07/2013US20130295700 Method for integrated circuit diagnosis
11/07/2013US20130295699 Method for testing through-silicon-via (tsv) structures
11/07/2013US20130295698 Lithographic targets for uniformity control
11/07/2013US20130295697 Tj TEMPERATURE CALIBRATION, MEASUREMENT AND CONTROL OF SEMICONDUCTOR DEVICES
11/07/2013US20130295696 Method for transferring a layer from a donor substrate onto a handle substrate
11/07/2013US20130295695 System and Method for Rejuvenating an Imaging Sensor Degraded by Exposure to Extreme Ultraviolet or Deep Ultraviolet Light
11/07/2013US20130295694 Circuit protection device and method of manufacturing the same
11/07/2013US20130295314 Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor device
11/07/2013US20130294877 Vacuum Robot Adapted to Grip and Transport a Substrate and Method Thereof
11/07/2013US20130294871 Efficient material handling in semiconductor wafer processing
11/07/2013US20130294756 Apparatus for substrate treatment and heating apparatus
11/07/2013US20130294678 Auto-sequencing multi-directional inline processing method
11/07/2013US20130294152 Apparatuses and methods including memory access in cross point memory
11/07/2013US20130294146 Resistive memory device and method of fabricating the same
11/07/2013US20130294038 Electronic device for radiofrequency or power applications and process for manufacturing such a device
11/07/2013US20130294004 Substrate for a display device and method of manufacturing the same
11/07/2013US20130293872 Monitoring apparatus and method particularly useful in photolithographically processing substrates
11/07/2013US20130293860 Exposure apparatus, exposure method, and method for producing device
11/07/2013US20130293856 Coating and developing apparatus, coating film forming method, and storage medium storing program for performing the method
11/07/2013US20130293855 Exposure apparatus and device manufacturing method
11/07/2013US20130293286 Tunable reference circuit
11/07/2013US20130293031 Diode, Use Thereof, And A Method For Producing The Same
11/07/2013US20130292854 Stacked microelectronic devices and methods for manufacturing stacked microelectronic devices
11/07/2013US20130292852 Chip embedded packages and methods for forming a chip embedded package
11/07/2013US20130292845 Stacked semiconductor package and method for manufacturing the same
11/07/2013US20130292841 Semiconductor interconnect structure
11/07/2013US20130292839 Porous silicon material
11/07/2013US20130292838 Package-on-package interconnect stiffener
11/07/2013US20130292837 Passivation for wafer level - chip-scale package devices
11/07/2013US20130292836 Via-free interconnect structure with self-aligned metal line interconnections
11/07/2013US20130292835 Conformal low temperature hermetic dielectric diffusion barriers
11/07/2013US20130292834 Microelectronic assembly with joined bond elements having lowered inductance
11/07/2013US20130292832 Semiconductor package and fabrication method thereof
11/07/2013US20130292831 Methods and Apparatus for Package on Package Devices
11/07/2013US20130292829 Semiconductor Package with Embedded Die
11/07/2013US20130292826 Method of making semiconductor assembly with built-in stiffener and semiconductor assembly manufactured thereby
11/07/2013US20130292825 Chip package and method for forming the same
11/07/2013US20130292824 Connection of a chip provided with through vias
11/07/2013US20130292823 Stack of semiconductor structures and corresponding manufacturing method
11/07/2013US20130292820 Electronic device packages including bump buffer spring pads and methods of manufacturing the same
11/07/2013US20130292817 Structure and method for monitoring stress induced failures in interlevel dielectric layers of solder bump integrated circuits
11/07/2013US20130292813 Multi-chip flip chip package and manufacturing method thereof
11/07/2013US20130292811 Leadframe having selective planishing
11/07/2013US20130292807 Semiconductor Device Dielectric Interface Layer
11/07/2013US20130292806 Methods For Manganese Nitride Integration
11/07/2013US20130292805 Methods of forming spacers on finfets and other semiconductor devices
11/07/2013US20130292802 Nitride crystal, nitride crystal substrate, epilayer-containing nitride crystal substrate, semiconductor device and method of manufacturing the same
11/07/2013US20130292799 Semiconductor device and method of manufacturing the same
11/07/2013US20130292797 Fully encapsulated conductive lines
11/07/2013US20130292794 Semiconductor device and method of fabricating
11/07/2013US20130292793 Localized strain relief for an integrated circuit
11/07/2013US20130292791 Semiconductor device and method for forming the same
11/07/2013US20130292781 Semiconductor structure and method of forming the same
11/07/2013US20130292779 Semiconductor device and semiconductor device production process
11/07/2013US20130292778 Techniques for the Fabrication of Thick Gate Dielectric
11/07/2013US20130292774 Method for forming a semiconductor device having raised drain and source regions and corresponding semiconductor device
11/07/2013US20130292773 Cross-coupling-based design using diffusion contact structures
11/07/2013US20130292772 Layout designs with via routing structures
11/07/2013US20130292767 Complementary metal-oxide-semiconductor (cmos) device and method
11/07/2013US20130292764 Semiconductor Device with Drain-End Drift Diminution
11/07/2013US20130292761 Trench power mosfet and fabrication method thereof
11/07/2013US20130292757 Semiconductor device and method of manufacturing the same
11/07/2013US20130292756 Method and apparatus for utilizing contact-sidewall capacitance in a single poly non-volatile memory cell
11/07/2013US20130292747 Semiconductor device and method for fabricating the same
11/07/2013US20130292745 Finfet compatible pc-bounded esd diode
11/07/2013US20130292744 Integrated circuit and method for fabricating the same having a replacement gate structure
11/07/2013US20130292704 Silicon carbide structure and method of producing the same
11/07/2013US20130292703 Semiconductor device and method for manufacturing same
11/07/2013US20130292702 Semiconductor device and method for manufacturing same
11/07/2013US20130292701 Doped Core Trigate FET Structure and Method
11/07/2013US20130292700 Method for fabricating semiconductor device and the semiconductor device
11/07/2013US20130292696 Chamfered freestanding nitride semiconductor wafer and method of chamfering nitride semiconductor wafer
11/07/2013US20130292691 Techniques for forming optoelectronic devices
11/07/2013US20130292686 Method and system for planar regrowth in gan electronic devices
11/07/2013US20130292684 Semiconductor Package and Methods of Formation Thereof
11/07/2013US20130292683 Semiconductor Heterobarrier Electron Device And Method of Making
11/07/2013US20130292673 Semiconductor Device and Method of Forming Reconstituted Wafer with Larger Carrier to Achieve More EWLB Packages per Wafer with Encapsulant Deposited Under Temperature and Pressure
11/07/2013US20130292668 P-type transparent oxide semiconductor, transistor having the same, and manufacture method of the same
11/07/2013US20130292633 Etch bias homogenization
11/07/2013US20130292626 Resistive memory having confined filament formation
11/07/2013US20130292625 Memory cells having-multi-portion data storage region
11/07/2013US20130292370 Method and device for measuring temperature of substrate in vacuum processing apparatus
11/07/2013US20130292160 Multi-layer interconnection structure
11/07/2013US20130292062 Substrate inverting device, substrate inverting method, and peeling system
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