Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2013
11/20/2013CN103403896A Light-reflective anisotropic conductive adhesive and light-emitting device
11/20/2013CN103403893A Resin application device and resin application method
11/20/2013CN103403886A Nitride semiconductor structure, nitride semiconductor light-emitting element, nitride semiconductor transistor element, method for manufacturing nitride semiconductor structure, and method for manufacturing nitride semiconductor element
11/20/2013CN103403875A Method for the wet-chemical etching back of a solar cell emitter
11/20/2013CN103403873A Offset electrode TFT structure
11/20/2013CN103403870A Trench MOS barrier schottky (TMBS) having multiple floating gates
11/20/2013CN103403868A Multilayer dielectric memory device
11/20/2013CN103403864A Semiconductor packages with agglomerate terminals
11/20/2013CN103403861A Charge storage apparatus, systems and methods
11/20/2013CN103403860A Semiconductor device, and method for manufacturing semiconductor device
11/20/2013CN103403859A Semiconductor device
11/20/2013CN103403858A Large-grain, low-resistivity tungsten on conductive compound
11/20/2013CN103403857A Thin heated substrate support
11/20/2013CN103403856A Boat for supporting substrate and support unit using same
11/20/2013CN103403855A Wafer bonding system and method for bonding and debonding thereof
11/20/2013CN103403854A Observation device, inspection device, method for manufacturing semiconductor device, and substrate support member
11/20/2013CN103403853A Methods and apparatus for a multi-zone pedestal heater
11/20/2013CN103403852A Abatement and strip process chamber in a dual loadlock configuration
11/20/2013CN103403851A Method for producing the pentanary compound semiconductor CZTSSe, and thin-film solar cell
11/20/2013CN103403850A Thin-film transistor and method for manufacturing same, and display device
11/20/2013CN103403849A Semiconductor device and process of producing same, and display device
11/20/2013CN103403848A 半导体器件 Semiconductor devices
11/20/2013CN103403847A Silicon nitride film deposition method, organic electronic device manufacturing method, and silicon nitride film deposition device
11/20/2013CN103403846A Glass composition for semiconductor junction protection, production method for semiconductor device, and semiconductor device
11/20/2013CN103403845A A method of forming a capacitor structure, and a silicon etching liquid used in this method
11/20/2013CN103403844A Conditioner for fragile pad and method for manufacturing same
11/20/2013CN103403843A Hybrid ceramic showerhead
11/20/2013CN103403842A Structure for growth of nitride semiconductor layer, stacked structure, nitride-based semiconductor element, light source, and manufacturing method for same
11/20/2013CN103403841A Gas phase growth device and gas phase growth method
11/20/2013CN103403840A Semiconductor element and method for producing same
11/20/2013CN103403839A Method for producing a thin-film semiconductor body, and thin-film semiconductor body
11/20/2013CN103403836A Semiconductor structure made using improved multiple ion implantation process
11/20/2013CN103403624A Alignment device and exposure device provided with same
11/20/2013CN103403503A Treatment liquid flow rate meter
11/20/2013CN103403216A Sputtering target and method for producing same, and method for producing thin film transistor
11/20/2013CN103403214A Al alloy film for display devices or semiconductor devices, display device or semiconductor device equipped with al alloy film, and sputtering target
11/20/2013CN103403123A Polishing composition, polishing method using same, and substrate production method
11/20/2013CN103402706A Polishing pad
11/20/2013CN103402299A Lower liner with integrated flow equalizer and improved conductance
11/20/2013CN103401438A Novel surface-mounted bridge-type rectifier and manufacturing method thereof
11/20/2013CN103400918A Transparent-electrode high-density flexible LED micro-display array device and manufacturing method
11/20/2013CN103400896A CuInGaSe flexible thin-film solar cell and preparation method thereof
11/20/2013CN103400859A Graphene-based tunneling field-effect transistor unit and array and forming method of array
11/20/2013CN103400858A Three-dimensional semiconductor device on insulator and forming method of three-dimensional semiconductor device
11/20/2013CN103400857A Semiconductor device and method for manufacturing same
11/20/2013CN103400856A One-dimensional electronic gas GaN-based HEMT (High Electron Mobility Transistor) device adopting selective area epitaxy and preparation method thereof
11/20/2013CN103400855A High-voltage device grate and manufacturing method thereof
11/20/2013CN103400853A Silicon carbide Schottky barrier diode and manufacturing method thereof
11/20/2013CN103400842A Metal oxide film transistor storage device and preparation method thereof
11/20/2013CN103400840A Super barrier rectifier and preparation method thereof
11/20/2013CN103400839A High-voltage ESD (Electro-static Discharge) device layout structure and chip comprising same
11/20/2013CN103400837A Array substrate as well as preparation method and display device thereof
11/20/2013CN103400836A Proximity sensor packaging structure and manufacturing method thereof
11/20/2013CN103400831A All-crimping type insulated gate bipolar transistor (IGBT) module and assembling method thereof
11/20/2013CN103400830A Multilayer chip stacking structure and implementation method thereof
11/20/2013CN103400829A Semiconductor package and manufacture method thereof
11/20/2013CN103400828A Inductor and formation method thereof, and integrated passive device and formation method thereof
11/20/2013CN103400823A Fine spacing laminated packaging structure containing copper pillar and packaging method
11/20/2013CN103400821A Surface-mounted inductor and wafer-level manufacturing method thereof
11/20/2013CN103400819A Lead frame, preparation method of lead frame, and package structure adopting lead frame
11/20/2013CN103400817A Semi-conductor chip packaging module, packaging structure and packaging method of semi-conductor chip packaging module
11/20/2013CN103400816A Packaging part and manufacturing method thereof
11/20/2013CN103400814A Flexible substrate packaging structure and filling method thereof
11/20/2013CN103400813A Flexible substrate encapsulating structure and encapsulating and filling method thereof
11/20/2013CN103400812A FCQFN packaging part filled by underfill material and production process thereof
11/20/2013CN103400811A Frame based flat packaging part adopting special dispensing technology and manufacturing process thereof
11/20/2013CN103400810A Semiconductor chip laminating and packaging structure and manufacturing method thereof
11/20/2013CN103400809A Flexible substrate packaging structure and filling process thereof
11/20/2013CN103400808A Wafer-level packaging structure and packaging method of image sensor
11/20/2013CN103400807A Wafer-level packaging structure and packaging method of image sensor
11/20/2013CN103400806A Frame based flat package part manufacturing process adopting cutting channel optimization technology
11/20/2013CN103400805A Frame based flat package part manufacturing process adopting cutting device optimization technology
11/20/2013CN103400804A COG product preparation method
11/20/2013CN103400803A Formation method of flash memory storage unit
11/20/2013CN103400802A Array substrate, manufacturing method of array substrate and display device
11/20/2013CN103400801A Vacuum encapsulation CMOS (complementary metal-oxide-semiconductor transistor) and MEMS (micro electronic mechanical system) chip and processing method of vacuum encapsulation CMOS and MEMS chip
11/20/2013CN103400800A Bosch etching method
11/20/2013CN103400799A Contact hole etching method
11/20/2013CN103400798A Method for forming super thick insulating layer in through-silicon via through thermal oxidation
11/20/2013CN103400797A Preparation method of semiconductor substrate with cavity
11/20/2013CN103400796A Etching technology for dual depth shallow trench isolation groove
11/20/2013CN103400795A Shallow trench isolation technology
11/20/2013CN103400794A Self-aligned trench formation method
11/20/2013CN103400793A Isolation structure for integrated circuit and modular method of forming same
11/20/2013CN103400792A Electric device and manufacture method thereof
11/20/2013CN103400791A Protection device used for integrated circuit product before plastic package
11/20/2013CN103400790A Transmission device in wet chemical cleaning equipment
11/20/2013CN103400789A Equipment platform system and wafer transmission method thereof
11/20/2013CN103400788A Electrostatic elimination device, cassette bearing device, material handling system and material handling method
11/20/2013CN103400787A Semiconductor-packaged MOUSE product carrier
11/20/2013CN103400786A Cooling and cleaning device for photoresist removing equipment
11/20/2013CN103400785A Conduit for photoresist bottle
11/20/2013CN103400784A Multipurpose encapsulating equipment
11/20/2013CN103400783A Charging device and blanking device for encapsulating equipment and encapsulating equipment comprising same
11/20/2013CN103400782A Single crystal wet processing equipment cable concentration device
11/20/2013CN103400781A Chip taking arm for full-automatic LED (light emitting diode) chip developer
11/20/2013CN103400780A Polycrystalline silicon furnace tube growth thickness monitoring method
11/20/2013CN103400779A Manufacturing method of semiconductor display panel
11/20/2013CN103400778A Packaging-prior-to-etching passive device type three-dimensional system-level metal circuit board structure and process method thereof
11/20/2013CN103400777A Packaging-prior-to-etching chip-normally-bonded bump type three-dimensional system-level metal circuit board and process method thereof
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