Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2013
11/28/2013US20130313578 Method of driving a light emitting device
11/28/2013US20130313577 Laminate substrate and method of fabricating the same
11/28/2013US20130313576 Semiconductor power device and method for producing same
11/28/2013US20130313575 Semi-insulating silicon carbide monocrystal and method of growing the same
11/28/2013US20130313568 Silicon carbide semiconductor device and method for manufacturing the same
11/28/2013US20130313567 Base substrate, gallium nitride crystal multi-layer substrate and production process therefor
11/28/2013US20130313566 GaN Epitaxy With Migration Enhancement and Surface Energy Modification
11/28/2013US20130313565 Compound semiconductor device
11/28/2013US20130313561 Group iii-nitride transistor with charge-inducing layer
11/28/2013US20130313560 Non-uniform two dimensional electron gas profile in iii-nitride hemt devices
11/28/2013US20130313552 Heterojunction bipolar transistors with thin epitaxial contacts
11/28/2013US20130313551 Heterojunction bipolar transistors with intrinsic interlayers
11/28/2013US20130313523 Graphene electronic device and method of fabricating the same
11/28/2013US20130313522 Graphene-based semiconductor device
11/28/2013US20130313513 Semiconductor devices having modulated nanowire counts
11/28/2013US20130313504 Resistive memory device and fabrication method thereof
11/28/2013US20130313502 High density variable resistive memory and method of fabricating the same
11/28/2013US20130313414 Semiconductor photomultiplier and readout method
11/28/2013US20130313309 Conductive bonding material, method of manufacturing the same, and method of manufacturing electronic device
11/28/2013US20130312913 Arrangement for depositing bevel protective film
11/28/2013US20130312835 Method and apparatus for rapid pump-down of a high-vacuum loadlock
11/28/2013US20130312831 Techniques for Forming a Chalcogenide Thin Film Using Additive to a Liquid-Based Chalcogenide Precursor
11/28/2013US20130312790 Substrate cleaning method
11/28/2013US20130312789 Ultrasonic cleaning method and ultrasonic cleaning apparatus
11/28/2013US20130312788 Ultrasonic cleaning method and ultrasonic cleaning apparatus
11/28/2013US20130312787 Ultrasonic cleaning apparatus and ultrasonic cleaning method
11/28/2013US20130312785 Ultrasonic cleaning method and ultrasonic cleaning apparatus
11/28/2013DE112012000727T5 Mehrschicht-Zwischenverbindungs-Erstintegrationsmethode für eine Integration auf der Grundlage von Transistoren mit Nanoröhren aus Graphen und Kohlenstoff Multi-layer interconnect Erstintegrationsmethode for integration on the basis of transistors with graphene and carbon nanotubes
11/28/2013DE112007000966B4 Dielektrischer Abstandhalter für metallische Verbinder und Verfahren, um dieselben zu bilden A dielectric spacer for metallic connector and method to form the same
11/28/2013DE10252835B4 Leichtbauträger für Stossfänger Lightweight support for bumper
11/28/2013DE102013211086A1 Method for polishing substrate with foamed polishing cloth, involves providing polishing cloth with blind holes whose positions correspond with outlet openings such that polishing agent passes through polishing cloth
11/28/2013DE102013209513A1 Abtrennen unter Verwendung von Teilbereichen einer Stressorschicht Separation using portions of a Stressorschicht
11/28/2013DE102013209479A1 Verfahren zur Verarbeitung eines Wafers an unmaskierten Bereichen und zuvor maskierten Bereichen zur Reduzierung einer Waferdicke A method of processing a wafer to previously masked regions and unmasked regions to reduce a thickness of wafer
11/28/2013DE102013209313A1 Geladener Teilschenstrahl-Lithographie-Vorrichtung und geladener Teilschenstrahl-Musterschreibverfahren Invited part's beam lithography apparatus and charged part's beam pattern writing process
11/28/2013DE102013208429A1 Oberflächenmorphologieerzeugung und Übertragung mittels Abtrennen Surface morphology generation and transmission by separating
11/28/2013DE102013206295A1 Höhere Stabilität für Transistoreigenschaften bei früh gebildetem High-k/Metallgate Higher stability of transistor characteristics in early formed high-k / metal gate
11/28/2013DE102013105232A1 Chipgehäuse und Verfahren zum Herstellen eines Chipgehäuses Chip package and method of making a chip package
11/28/2013DE102013105134A1 Abschlussanordnung für vertikalen MOSFET Termination assembly for vertical MOSFET
11/28/2013DE102013008512A1 Gruppe lll-Nitrid-Transistor mit Ladungs-Induzierschicht Group III-nitride transistor charge Induzierschicht
11/28/2013DE102012208900A1 Verfahren zum Herstellen optoelektronischer Bauelemente und Vorrichtung zum Herstellen optoelektronischer Bauelemente A method for producing optoelectronic devices and apparatus for producing optoelectronic devices
11/28/2013DE102012106892A1 Verfahren zum Ausbilden von Zwischenverbindungen für dreidimensionalen integrierten Schaltkreis A method of forming interconnections for the three-dimensional integrated circuit
11/28/2013DE102012104475A1 Device useful for depositing layer on substrate comprises processing chamber having susceptor heated by heating device for receiving substrate, gas inlet element, gas outlet element and gas-tight reactor housing which is outwardly arranged
11/28/2013DE102012104394A1 Test apparatus for handling semiconductor wafers, has inspection unit that is adapted to detect property of semiconductor wafer by wafer handler in association with respective adjustment parameters
11/28/2013DE102012010310A1 Wafer retainer used during inspection in processing station, has movement device that is provided to move movable receiving unit transversely to peripheral edge of wafer
11/28/2013DE102012010151A1 Holder, used to hold electrostatic substrate, includes identical layered structure that includes support and electrode and cover layers, where geometric ratio of support surface to thickness of layered structure has specified value
11/28/2013DE102010036743B4 Bipolares Halbleiterbauelement, Speed-Diode und Herstellungsverfahren A bipolar semiconductor device, speed and diode manufacturing process
11/28/2013DE102010011156B4 Vorrichtung zur thermischen Behandlung von Halbleitersubstraten Device for thermal treatment of semiconductor substrates
11/28/2013DE102009060575B9 Verfahren sowie Vorrichtung zum Vereinzeln von Wafern aus einem Ingot A method and apparatus for separating wafers from an ingot
11/28/2013DE102009046242B4 Verfahren zur Herstellung eines Halbleiterbauelements mit Kontaktdurchführungen mit unterschiedlicher Größe durch Aufteilen des Kontaktlochstrukturierungsprozesses A method for manufacturing a semiconductor device having vias with different size by dividing the contact hole patterning process
11/28/2013DE102009023378B4 Wiederherstellung einer hydrophoben Oberfläche empfindlicher dielektrischer Materialen mit kleinem ε in Mikrostrukturbauelementen Restoration of a hydrophobic surface sensitive dielectric materials with small ε in microstructure devices
11/28/2013DE102009023237B4 Verfahren zum Herstellen von Transistorelementen mit unterschiedlicher Verformung und Halbleiterbauelement A process for the manufacture of transistor elements having different deformation and semiconductor component
11/28/2013DE102009019684B4 Halbleitervorrichtung und Verfahren zu ihrer Herstellung Semiconductor device and process for their preparation
11/28/2013DE102009019030B4 Halbleiterbauelement mit einem Träger und einem strukturierten Dielektrikum A semiconductor device comprising a carrier and a structured dielectric
11/28/2013DE102008064796B3 Reduction of threshold voltage variation in transistors comprises forming layer of silicon-containing semiconductor alloy on silicon-containing crystalline semiconductor regions, and forming two gate electrode structures
11/28/2013DE102008034164B4 Modul mit Leistung-Halbleiterchip und Verfahren Module with a power semiconductor chip and method
11/28/2013DE102006017116B4 Vorrichtung und Verfahren zur Herstellung eines Gegenstands mittels Moldingtechnik insbesondere mittels eines Transfermoldingprozesses Apparatus and method for producing an article by means of a particular Molding technique Transfermoldingprozesses
11/27/2013EP2667685A1 Encapsulated graphite heater and process
11/27/2013EP2667414A1 Method for producing silicon carbide semiconductor device
11/27/2013EP2667407A2 Device and method for releasing a semiconductor wafer from a carrier substrate with the use of a solvent and acoustic waves
11/27/2013EP2667406A1 Dual medium filter for ion and particle filtering during semiconductor processing
11/27/2013EP2667405A2 Electronic module and method for manufacturing electronic module
11/27/2013EP2667404A1 Manufacturing method for transistor, transistor, array substrate and display device
11/27/2013EP2667403A1 Process for manufacture of silicon carbide semiconductor device
11/27/2013EP2666877A1 Method for producing high-purity lanthanum, high-purity lanthanum, sputtering target formed from high-purity lanthanum, and metal gate film having high-purity lanthanum as main component
11/27/2013EP2666833A1 A process for the manufacture of semiconductor devices comprising the chemical mechanical polishing (cmp) of iii-v material in the presence of a cmp composition comprising a specific non-ionic surfactant
11/27/2013EP2666344A1 Chip carrier support systems
11/27/2013EP2666193A1 Led package comprising encapsulation
11/27/2013EP2666185A1 Method for separating a product substrate from a carrier substrate
11/27/2013EP2666184A1 Improved interface between a i-iii-vi2 material layer and a molybdenum substrate
11/27/2013EP2665848A2 Resistance heated sapphire single crystal ingot grower, method of manufacturing resistance heated sapphire sngle crystal ingot, sapphire sngle crystal ingot, and sapphire wafer
11/27/2013EP2665792A2 Silicon polishing compositions with improved psd performance
11/27/2013CN203312348U Solar photovoltaic silicon cell piece vacuum chuck
11/27/2013CN203312301U MOS super potential barrier rectifying device
11/27/2013CN203312295U Signal substrate of naked-eye 3D functional panel and display device
11/27/2013CN203312284U Intelligent power module
11/27/2013CN203312276U Semiconductor device for controlling warping in semiconductor packaging
11/27/2013CN203312275U Semiconductor device with formation of embedded SOP fan-out type packaging
11/27/2013CN203312272U LED support fixing clamp
11/27/2013CN203312271U Concentrating photovoltaic cell piece vacuum chuck
11/27/2013CN203312270U Concentrating photovoltaic cell piece anti-dust vacuum chuck
11/27/2013CN203312269U Automatic diode combing machine
11/27/2013CN203312268U Separation blade boat of furnace tube
11/27/2013CN203312267U Pin repair device of integrated circuit
11/27/2013CN203312266U Flexible substrate packaging device
11/27/2013CN203312265U Testing system
11/27/2013CN203312264U An acrylic box used for diode production
11/27/2013CN203312263U Tool for locking and attaching encapsulation transistor
11/27/2013CN203312262U Packaging device employing liquid resin
11/27/2013CN203311122U Low substrate positioning equipment and vacuum substrate laminating system
11/27/2013CN203304735U Flip chip welding detection control system
11/27/2013CN103415926A Oxide for semiconductor layer for thin film transistor, semiconductor layer for thin film transistor which comprises said oxide, and thin film transistor
11/27/2013CN103415924A Device mounting structure of semiconductor device
11/27/2013CN103415923A Semiconductor device, and process for manufacturing semiconductor device
11/27/2013CN103415922A Semiconductor device and method for manufacturing semiconductor device
11/27/2013CN103415921A Memory device and method for manufacturing the same
11/27/2013CN103415920A 半导体器件 Semiconductor devices
11/27/2013CN103415919A 工件对准装置 Workpiece alignment means
11/27/2013CN103415918A Electronic part and method of manufacturing electronic part
11/27/2013CN103415917A Pre- cut wafer applied underfill film
11/27/2013CN103415916A Semiconductor device and method for manufacturing semiconductor device
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