Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2013
11/13/2013CN103390568A Method for monitoring MOS device threshold voltage drift
11/13/2013CN103390567A Convex point packaging structure and technique of horizontal chip of firstly-etched and then-packaged three-dimensional system level
11/13/2013CN103390566A Wafer-level bonding method for three-dimensional integrated packaging technology
11/13/2013CN103390565A Electric connecting structure comprising preferred oriented Cu6Sn5 grains and method for fabricating the same
11/13/2013CN103390564A Film based IC packaging method and packaged IC device
11/13/2013CN103390563A Metal circuit board structure and technique of flip chip of firstly-packaged and then-etched three-dimensional system level
11/13/2013CN103390562A Production method of cooler
11/13/2013CN103390561A Method and equipment for reflow soldering and leveling of solder ball protrusion blocks of flip chip substrate
11/13/2013CN103390560A Forming method of semiconductor device and semiconductor device
11/13/2013CN103390559A Method for manufacturing semiconductor device
11/13/2013CN103390558A Method for forming transistors
11/13/2013CN103390557A 半导体集成器件及其制作方法 The semiconductor integrated device and manufacturing method thereof
11/13/2013CN103390556A Semiconductor device manufacturing method
11/13/2013CN103390555A Method for manufacturing metal oxide semiconductor transistor
11/13/2013CN103390554A Method for improving breakdown voltage uniformity of Schottky diode
11/13/2013CN103390553A Rapid thermal annealing method
11/13/2013CN103390552A Annealing system
11/13/2013CN103390551A Method for manufacturing semiconductor device patterned structure
11/13/2013CN103390550A Workpiece dividing method
11/13/2013CN103390549A Semiconductor device manufacturing method
11/13/2013CN103390548A Method for preparing gate silicon oxide layers and method for processing semiconductor substrate
11/13/2013CN103390547A Method for forming semiconductor structure with metal gate electrode layers
11/13/2013CN103390546A Ion implantation method of polysilicon gate electrode
11/13/2013CN103390545A Method for increasing drain-source breakdown voltage of trench NMOS and structure of trench NMOS
11/13/2013CN103390544A Method for forming hard mask layer
11/13/2013CN103390543A Method for increasing surface area of inductor
11/13/2013CN103390542A Forming method of MIM (metal-insulator-metal) capacitor
11/13/2013CN103390541A Capacitor and method for fabricating the same
11/13/2013CN103390540A Method of removing residue during semiconductor device fabrication
11/13/2013CN103390539A Method for manufacturing thin silicon wafer
11/13/2013CN103390538A Real-time photoetching region machine platform allocation method and system
11/13/2013CN103389616A SiGe device manufacturing method improving emitter electrode window size uniformity
11/13/2013CN103388127A Etching cleaning method of high-density plasma chemical vapor deposition equipment cavity
11/13/2013CN103387796A Chemical mechanical polishing composition having chemical additive and method for using same
11/13/2013CN103387777A Diffusant composition and method for forming impurity diffusion layer
11/13/2013CN103386689A Conveying clamp and conveying holder
11/13/2013CN103386406A Double-side scrubbing equipment between wafer production processes
11/13/2013CN102884633B Circuit board and display device
11/13/2013CN102629577B TFT array substrate and manufacturing method thereof and display device
11/13/2013CN102509711B Method for detecting defect of shallow trench isolation
11/13/2013CN102485935B Vapor chamber and substrate processing equipment applied with the vapor chamber
11/13/2013CN102458042B Circuit substrate manufacturing process, circuit substrate and semiconductor manufacturing process
11/13/2013CN102456735B Semiconductor apparatus and manufacturing method for same
11/13/2013CN102437079B Disk clamping device
11/13/2013CN102421865B Adhesive agent, adhesive sheet, and process for production of electronic component
11/13/2013CN102420200B Transfer plate with metal vertical interconnection structure and manufacture method thereof
11/13/2013CN102412166B Surface nanofilm processing method prior to plastic packaging in semiconductor packaging
11/13/2013CN102403229B Manufacturing method of step-shaped silicon-germanium source/drain structure
11/13/2013CN102394228B Method for enhancing read-in speed of floating body effect storage unit and semiconductor device
11/13/2013CN102394217B Manufacturing method of metal- silicon nitride-metal capacitor
11/13/2013CN102393607B Positive photosensitive resin composition, and semiconductor device and display using same
11/13/2013CN102386123B Method for preparing substrate with uniform-thickness device layer
11/13/2013CN102347273B Semiconductor device producing method
11/13/2013CN102310059B Method for removing high-melting-point adhesives
11/13/2013CN102286777B H3PO4 corrosive seed crystal for growing GaN (Gallium Nitride) single crystal by using HVPE (Hydride Vapor Phase Epitaxial) and preparation method thereof
11/13/2013CN102280407B Manufacturing method of component with patterned side wall
11/13/2013CN102280399B Online wafer conveying device
11/13/2013CN102280368B Patterned ultraviolet screening film preparation method
11/13/2013CN102264616B Selecting and supplying apparatus for molding tablet
11/13/2013CN102232043B Method and device for reversing the feeding of sputter coating systems in clean rooms
11/13/2013CN102224576B Confinement of foam delivered by a proximity head
11/13/2013CN102204420B Electronic device manufacturing method and electronic device
11/13/2013CN102203912B Improving the conformal doping in p3i chamber
11/13/2013CN102201387B OFN semiconductor package and fabrication method thereof
11/13/2013CN102201370B Semiconductor device and manufacturing method thereof
11/13/2013CN102160168B Substrate-transferring device, substrate-processing apparatus having same, and method of transferring substrate using substrate-transferring device
11/13/2013CN102159609B Two-pack urethane resin composite for use in an abrasive pad, polyurethane abrasive pad, and method for manufacturing a polyurethane abrasive pad
11/13/2013CN102124544B Cluster jet processing method, semiconductor element, microelectromechanical element, and optical component
11/13/2013CN102105981B Semiconductor package with integrated interference shielding and method of manufacture therof
11/13/2013CN102082109B Susceptor unit and apparatus for processing substrate by using the susceptor unit
11/13/2013CN102053617B On-line calibrating method for FRC (Flow Ratio Controller), system and plasma treatment equipment
11/13/2013CN102037557B Non-volatile semiconductor storage device and method of manufacturing the same
11/13/2013CN102007542B Method of making record in magnetic memory device
11/13/2013CN101978474B Tunable ground planes in plasma chambers
11/13/2013CN101971712B Methods and apparatus for a wide conductance kit
11/13/2013CN101964345B CMOSFETs apparatus structure for controlling characteristics of valve value voltage and manufacture method thereof
11/13/2013CN101952958B Systems and devices including fin transistors and methods of using, making, and operating the same
11/13/2013CN101910706B Gas transport delay resolution for short etch recipes
11/13/2013CN101877331B Flexible substrate for display panel and manufacturing method thereof
11/13/2013CN101840912B 半导体装置及其制造方法 Semiconductor device and manufacturing method
11/13/2013CN101833251B Microelectronic cleaning composition containing halogen oxygen acids, salts and derivatives thereof
11/13/2013CN101645448B Rectifier with pn clamp regions under trenches
11/13/2013CN101501862B Polymers with low band gaps and high charge mobility
11/13/2013CN101494151B Magnetic control cathode assembly for cleaning one-dimensional linear plasma with high efficiency
11/13/2013CN101361178B Semiconductor transistors with expanded top portions of gates
11/13/2013CN101200050B Grinding machine having grinder head and method of manufacturing semiconductor device by using the grinding machine
11/12/2013US8584054 Photomask manufacturing method and semiconductor device manufacturing method
11/12/2013US8583111 Switch circuit and method of switching radio frequency signals
11/12/2013US8582317 Method for manufacturing a semiconductor component and structure therefor
11/12/2013US8582122 Polishing monitoring method, polishing method, and polishing monitoring apparatus
11/12/2013US8581491 Method of manufacturing display device
11/12/2013US8581424 Information recording/reproducing device
11/12/2013US8581416 Method of forming a semiconductor device and leadframe therefor
11/12/2013US8581414 Method of manufacturing three-dimensional integrated circuit and three-dimensional integrated circuit apparatus
11/12/2013US8581400 Post-passivation interconnect structure
11/12/2013US8581396 Semiconductor device
11/12/2013US8581389 Uniformity control for IC passivation structure
11/12/2013US8581388 Multilayered wiring substrate
11/12/2013US8581376 Stacked dual chip package and method of fabrication
11/12/2013US8581375 Leadframe-based mold array package heat spreader and fabrication method therefor
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