Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2013
11/20/2013CN103400776A Packaging-prior-to-etching type three-dimensional system-level chip-flipped packaging structure and process method thereof
11/20/2013CN103400775A Packaging-prior-to-etching type three-dimensional system-level chip-flipped bump packaging structure and process method thereof
11/20/2013CN103400774A Packaging-prior-to-etching chip-normally-bonded bump type three-dimensional system-level metal circuit board and process method thereof
11/20/2013CN103400773A Packaging-prior-to-etching passive device type three-dimensional system-level metal circuit board structure and process method thereof
11/20/2013CN103400772A Packaging-prior-to-etching chip-normally-bonded type three-dimensional system-level metal circuit board structure and process method thereof
11/20/2013CN103400771A Packaging-prior-to-etching chip-flipped type three-dimensional system-level metal circuit board structure and process method thereof
11/20/2013CN103400770A Packaging-prior-to-etching chip-flipped bump type three-dimensional system-level metal circuit board and process method thereof
11/20/2013CN103400769A Packaging-prior-to-etching type three-dimensional system-level chip-flipped bump packaging structure and process method thereof
11/20/2013CN103400768A Packaging-prior-to-etching type three-dimensional system-level chip-normally-bonded packaging structure and process method thereof
11/20/2013CN103400767A Packaging-prior-to-etching chip-flipped bump type three-dimensional system-level metal circuit board and process method thereof
11/20/2013CN103400766A Simple buckling device for flexible substrate packaging
11/20/2013CN103400765A Manufacturing method of oxide thin-film transistor
11/20/2013CN103400764A Forming method for bipolar transistor
11/20/2013CN103400763A Sintering device applied to oxygen sensor chip
11/20/2013CN103400762A Method for forming semiconductor structure
11/20/2013CN103400761A Substrate processing method
11/20/2013CN103400760A Method and device for growing bismuth selenide single crystal film on silicon substrate
11/20/2013CN103400759A Grinding method of indium phosphide-based plane light wave light path waveguide chip and clamp applied to same
11/20/2013CN103400758A Method for manufacturing grid lines with high uniformity through double exposure
11/20/2013CN103400757A Method for manufacturing grid lines with high uniformity through double exposure
11/20/2013CN103400756A Method for manufacturing grid lines with high uniformity through double exposure
11/20/2013CN103400755A Method for manufacturing grid lines with high uniformity through double exposure
11/20/2013CN103400754A Method for manufacturing grid lines with high uniformity through double exposure
11/20/2013CN103400753A Method for manufacturing grid lines with high uniformity through double exposure
11/20/2013CN103400752A Application of ion implantation technology in CCD fabrication and CCD fabrication technology
11/20/2013CN103400751A Manufacturing method of laminate structure including oxide semiconductor thin film layer
11/20/2013CN103400750A Method for coating photoresist on surface of silicon substrate
11/20/2013CN103400749A Failure analysis method for MIM capacitor
11/20/2013CN103399596A Heating control device for achieving package equipment by using Omron temperature control module
11/20/2013CN103399549A Semiconductor encapsulation testing fine feeding control method based on constrained minimum spanning tree
11/20/2013CN103399425A Glass substrate supporting device and liquid crystal display panel processing technology
11/20/2013CN103397307A Method to prepare silicon-containing film
11/20/2013CN103397247A Metal substrate and device with crystallographic texture, cell and photovoltaic module comprising device and method for depositing fine layers
11/20/2013CN103396765A Polishing agent and method for polishing substrate using polshing agent
11/20/2013CN103394855A Fixing tool structure and electrode welding method
11/20/2013CN103394842A Arrangement device for CCGA (ceramic column grid array) packaging welding columns and pins
11/20/2013CN103394484A Cleaning technology after polycrystalline silicon solar cell silicon wafer acid texturing
11/20/2013CN102776405B Preparation method of bonded gold-silver alloy wire
11/20/2013CN102674333B Method for preparing structured graphene based on reaction of Cl2 and Ni film annealing
11/20/2013CN102637629B Mask assembly of IC (integrated circuit) device with laminated contact layers for reducing number, as well as method thereof
11/20/2013CN102548231B Method for manufacturing PCB (Printed Circuit Board)
11/20/2013CN102479746B Method for reducing parasitic capacitance between metal gate electrode and contact hole
11/20/2013CN102471878B Film formation apparatus
11/20/2013CN102403197B Method for activating dopant atoms
11/20/2013CN102386229B Gate controlled bipolar junction transistor on fin-like field effect transistor (finfet) structure
11/20/2013CN102376724B Antireflective layer for backside illuminated image sensor and method of manufacturing same
11/20/2013CN102365725B Bonding device, bonding sealer amplitude measurement method, and bonding sealer amplitude calibration method
11/20/2013CN102355982B Method for chamfering wafer
11/20/2013CN102346371B Photoresist compositions and methods of forming photolithographic patterns
11/20/2013CN102326233B Method of producing a component of a device, and the resulting components and devices
11/20/2013CN102315262B Semiconductor device and making method thereof
11/20/2013CN102299102B Power semiconductor assembly with drain voltage protection and manufacturing method thereof
11/20/2013CN102282659B Semiconductor substrate structure and semiconductor device
11/20/2013CN102270604B Structure of array substrate and manufacturing method thereof
11/20/2013CN102262998B Ion implantation device
11/20/2013CN102244038B Thin film transistor and manufacturing method thereof
11/20/2013CN102244014B Manufacturing method of stackable package structure
11/20/2013CN102237292B Static sucker with spacer
11/20/2013CN102227006B Semiconductor device manufacturing method and semiconductor device
11/20/2013CN102203919B Process kit having reduced erosion sensitivity
11/20/2013CN102203904B Methods of forming layers of semiconductor material having reduced lattice strain, semiconductor structures, devices and engineered substrates including same
11/20/2013CN102194688B Power semiconductor device and method of manufacturing the same
11/20/2013CN102174295B Alkaline silicon dioxide polishing solution suitable for fine atomization CMP
11/20/2013CN102169906B Semiconductor device
11/20/2013CN102157525B Semiconductor device and manufacturing method thereof
11/20/2013CN102150250B Bonding method, bonding device, and method of manufacturing the same
11/20/2013CN102142385B Etch tool process indicator method and apparatus
11/20/2013CN102136475B Semiconductor encapsulation structure and manufacturing method thereof
11/20/2013CN102110715B Transistor, display device, electronic device and fabrication method of transistor
11/20/2013CN102097346B Power semiconductor package
11/20/2013CN102057437B Semiconductor memory device
11/20/2013CN102057383B Subset selection of RFID tags using light
11/20/2013CN102017094B Endpoint detection in chemical mechanical polishing using multiple spectra
11/20/2013CN101969051B Semiconductor packaging part and manufacturing method thereof
11/20/2013CN101960584B Semiconductor device and method of manufacture thereof
11/20/2013CN101940068B Methods and apparatus for changing area ratio in a plasma processing system
11/20/2013CN101925985B Gas modulation to control edge exclusion in bevel edge etching plasma chamber
11/20/2013CN101901787B Oxide thin film transistor and method of fabricating the same
11/20/2013CN101784181B Apparatus for supplying electronic parts and chip mounter having the same
11/20/2013CN101680746B Moving body device, exposure device, pattern formation device, and device manufacturing method
11/20/2013CN101552244B 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
11/20/2013CN101540331B System for display images and fabrication method thereof
11/20/2013CN101276779B Method of forming buried wiring lines, and substrate and display device using the same
11/19/2013US8588950 Substrate processing apparatus
11/19/2013US8587861 Making a cross-linked polymer network
11/19/2013US8587763 Substrate processing method, substrate processing system, and computer-readable recording medium recording program thereon
11/19/2013US8587718 Image pickup unit and manufacturing method of image pickup unit
11/19/2013US8587390 MEMS vibrator, oscillator, and method for manufacturing MEMS vibrator
11/19/2013US8587224 Variable gate field-effect transistor and electrical and electronic apparatus including the same
11/19/2013US8587133 Semiconductor device
11/19/2013US8587131 Through-silicon via and fabrication method thereof
11/19/2013US8587130 Die-sorting sheet and method for transporting chips having adhesive layer
11/19/2013US8587125 Method of manufacturing layered chip package
11/19/2013US8587119 Conductive feature for semiconductor substrate and method of manufacture
11/19/2013US8587110 Semiconductor module having a semiconductor chip stack and method
11/19/2013US8587108 Package for semiconductor device including guide rings and manufacturing method of the same
11/19/2013US8587102 Vertical system integration
11/19/2013US8587098 Integrated circuit protruding pad package system and method for manufacturing thereof
11/19/2013US8587095 Method for establishing and closing a trench of a semiconductor component
11/19/2013US8587092 Semiconductor device and manufacturing method of the same
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