Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2013
11/12/2013US8580621 Solder interconnect by addition of copper
11/12/2013US8580620 Method of manufacturing semiconductor device
11/12/2013US8580619 Method for producing semiconductor device
11/12/2013US8580616 Methods of forming fully embedded bumpless build-up layer packages and structures formed thereby
11/12/2013US8580615 Method and system for wafer level singulation
11/12/2013US8580614 Embedded wafer-level bonding approaches
11/12/2013US8580613 Semiconductor chip arrangement with sensor chip and manufacturing method
11/12/2013US8580612 Chip assembly
11/12/2013US8580611 Method for manufacturing wiring substrate
11/12/2013US8580609 Semiconductor device with embedded interconnect pad
11/12/2013US8580608 Fabrication method of package structure having embedded semiconductor component
11/12/2013US8580607 Microelectronic packages with nanoparticle joining
11/12/2013US8580606 Method of forming resistance variable memory device
11/12/2013US8580603 Method of fabricating solar cells with electrodeposited compound interface layers
11/12/2013US8580602 Polycrystalline CDTE thin film semiconductor photovoltaic cell structures for use in solar electricity generation
11/12/2013US8580601 Pixel sensor cell with a dual work function gate electrode
11/12/2013US8580599 Bypass diode for a solar cell
11/12/2013US8580598 Image sensor and method of manufacturing the same
11/12/2013US8580597 Making of a microelectronic device including a monocrystalline silicon NEMS component and a transistor the gate of which is made in the same layer as the mobile structure of this component
11/12/2013US8580596 Front end micro cavity
11/12/2013US8580595 Solid-state image sensing device and camera system the same
11/12/2013US8580594 Method of fabricating a semiconductor device having recessed bonding site
11/12/2013US8580592 Method for manufacturing semiconductor light emitting element, and semiconductor light emitting element
11/12/2013US8580591 Method of manufacturing vertical pin diodes
11/12/2013US8580590 Method for manufacturing polychromatic light emitting diode device having wavelength conversion layer made of semiconductor
11/12/2013US8580589 Wafer-level process for fabricating photoelectric modules
11/12/2013US8580586 Memory arrays using nanotube articles with reprogrammable resistance
11/12/2013US8580585 Method and system for controlled isotropic etching on a plurality of etch systems
11/12/2013US8580584 System and method for increasing productivity of organic light emitting diode material screening
11/12/2013US8580582 Semiconductor fabricating device and method for driving the same, and method for fabricating magnetic tunnel junction using the same
11/12/2013US8580581 Substrate for electronic device, stack for electronic device, electronice device, and method for manufacturing the same
11/12/2013US8580580 Magnetic element with varying areal extents
11/12/2013US8580466 Optically semitransmissive film, photomask blank and photomask, and method for designing optically semitransmissive film
11/12/2013US8580133 Methods of controlling the etching of silicon nitride relative to silicon dioxide
11/12/2013US8580127 Method of manufacturing RFID based thermal bubble type accelerometer
11/12/2013US8580078 Bevel etcher with vacuum chuck
11/12/2013US8580077 Plasma processing apparatus for performing accurate end point detection
11/12/2013US8580076 Plasma apparatus, gas distribution assembly for a plasma apparatus and processes therewith
11/12/2013US8580075 Method and system for introduction of an active material to a chemical process
11/12/2013US8580037 Method of depositing materials on a non-planar surface
11/12/2013US8579678 Grinding method for workpiece having a plurality of bumps
11/12/2013US8578879 Apparatus for VHF impedance match tuning
11/07/2013WO2013166516A1 Cmp conditioner pads with superabrasive grit enhancement
11/07/2013WO2013166515A1 Wafer container with door mounted shipping cushions
11/07/2013WO2013166514A1 Wafer container with door interface seal
11/07/2013WO2013166512A1 Replaceable wafer support backstop
11/07/2013WO2013166383A1 Efficient material handling in semiconductor wafer processing
11/07/2013WO2013166381A1 Techniques for forming optoelectronic devices
11/07/2013WO2013166375A1 Tool for use with dual-sided chemical mechanical planarization pad conditioner
11/07/2013WO2013166116A1 Apparatus and method for high throughput testing of 3d semiconductor devices
11/07/2013WO2013166079A1 Integrated circuit design
11/07/2013WO2013166078A1 Semiconductor device
11/07/2013WO2013165952A1 Method of uniform selenization and sulferization in a tube furnace
11/07/2013WO2013165919A1 Methods and apparatus for isolating a running beam conveyor from a semiconductor substrate cleaning environment
11/07/2013WO2013165658A1 Improved densification for flowable films
11/07/2013WO2013165630A1 A method of fabricating tunnel transistors with abrupt junctions
11/07/2013WO2013165620A1 Growth of cubic crystalline phase structure on silicon substrates and devices comprising the cubic crystalline phase structure
11/07/2013WO2013165375A1 Device including active floating gate region area that is smaller than channel area
11/07/2013WO2013165323A2 Method and encapsulant for flip-chip assembly
11/07/2013WO2013165134A1 Method for fabricating p-type aluminum gallium nitride semiconductor
11/07/2013WO2013165010A1 Film-like thermosetting silicone sealing material
11/07/2013WO2013164741A1 Methods and apparatuses for positioning nano-objects with aspect ratios
11/07/2013WO2013164659A1 Methods for producing new silicon light source and devices
11/07/2013WO2013164248A1 Selenite precursor and ink for the manufacture of cigs photovoltaic cells
11/07/2013WO2013163791A1 Apparatus and method for detecting position of wafer
11/07/2013WO2013134054A4 3d packaging with low-force thermocompression bonding of oxidizable materials
11/07/2013US20130296658 Component with encapsulated active element and implantable medical advice incorporating such a component
11/07/2013US20130295826 Polishing pad for endpoint detection and related methods
11/07/2013US20130295780 Method for manufacturing semiconductor wafer
11/07/2013US20130295779 High temperature atomic layer deposition of silicon oxide thin films
11/07/2013US20130295778 Niobium and vanadium organometallic precursors for thin film deposition
11/07/2013US20130295777 Coating treatment method, computer storage medium, and coating treatment apparatus
11/07/2013US20130295776 Method for vapor condensation and recovery
11/07/2013US20130295775 Plasma processing apparatus
11/07/2013US20130295774 Plasma etching method
11/07/2013US20130295773 Method for Simultaneously Forming Features of Different Depths in a Semiconductor Substrate
11/07/2013US20130295772 Method of forming patterns
11/07/2013US20130295771 Methods and systems for polishing phase change materials
11/07/2013US20130295770 Methods for integrated circuit fabrication with protective coating for planarization
11/07/2013US20130295769 Methods of patterning small via pitch dimensions
11/07/2013US20130295768 Substrate processing apparatus and method of manufacturing semiconductor device
11/07/2013US20130295767 Increased transistor performance by implementing an additional cleaning process in a stress liner approach
11/07/2013US20130295766 Through-wafer interconnects for photoimager and memory wafers
11/07/2013US20130295765 Two-step silicide formation
11/07/2013US20130295764 Method for reducing dielectric overetch when making contact to conductive features
11/07/2013US20130295763 Low temperature thin wafer backside vacuum process with backgrinding tape
11/07/2013US20130295761 Three-Dimensional Semiconductor Device and Method for Fabricating the Same
11/07/2013US20130295760 Incorporating impurities using a mask
11/07/2013US20130295758 Method of manufacturing semiconductor device
11/07/2013US20130295757 Short gate-length high electron-mobility transistors with asymmetric recess and self-aligned ohmic electrodes
11/07/2013US20130295756 Methods of forming contacts for semiconductor devices using a local interconnect processing scheme
11/07/2013US20130295755 Methods for forming trenches
11/07/2013US20130295754 Doping of semiconductor substrate through carbonless phosphorous-containing layer
11/07/2013US20130295753 Ion beam dimension control for ion implantation process and apparatus, and advanced process control
11/07/2013US20130295752 Methods for chemical mechanical planarization of patterned wafers
11/07/2013US20130295751 Thin film forming device for solar cell and thin film forming method
11/07/2013US20130295750 High throughput epitaxial liftoff for releasing multiple semiconductor device layers from a single base substrate
11/07/2013US20130295749 Apparatus for vapor condensation and recovery
11/07/2013US20130295748 Method of uniform selenization and sulferization in a tube furnace
11/07/2013US20130295747 Adhesive composition for a wafer processing film