Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2013
11/13/2013EP2661516A2 Chuck for chemical vapor deposition systems and related methods therefor
11/13/2013EP2611950B1 Process for electrodeposition of copper chip to chip chip to wafer and wafer to wafer interconnects in through-silicon vias (tsv), with heated substrate and cooled electrolyte
11/13/2013DE202013008929U1 Behandlungsvorrichtung für Objekte Treatment device for objects
11/13/2013CN203288632U Electric cutting device for solar battery pieces
11/13/2013CN203288631U Solar-energy silicon-wafer vacuum suction pen
11/13/2013CN203288601U Thin film transistor pixel structure, array substrate and display device
11/13/2013CN203288579U Wafer encapsulation structure
11/13/2013CN203288574U Wafer fixing device
11/13/2013CN203288573U A carrier plate for bearing silicon chips
11/13/2013CN203288572U Wafer rotation release device
11/13/2013CN203288571U General COB clamp structure for die bonder of LED packaging device
11/13/2013CN203288570U Quartz boat positioning device and quartz boat conveyer
11/13/2013CN203288569U Turnover storage box for storing thin wafer
11/13/2013CN203288568U Device for placing silicon slices in semiconductor manufacturing LPCVD (low pressure chemical vapour deposition) process
11/13/2013CN203288567U Wafer box
11/13/2013CN203288566U Crystal grain separating device
11/13/2013CN203288565U Ring assembly in semiconductor manufacturing chamber
11/13/2013CN203282328U Polishing device and base plate processing device
11/13/2013CN203281548U Solar silicon wafer ultrasonic cleaning groove
11/13/2013CN203281518U Crystal grain selection equipment
11/13/2013CN103392387A Film forming method and film forming device
11/13/2013CN103392234A Silicon nanotube MOSFET
11/13/2013CN103392233A Array column integrator
11/13/2013CN103392232A Memory with extended charge trapping layer
11/13/2013CN103392231A Non-volatile storage element having dual work-function electrodes
11/13/2013CN103392228A Boat for supporting substrate and support unit using same
11/13/2013CN103392227A Mobile, transportable electrostatic substrate retaining arrangement
11/13/2013CN103392226A Vacuum treatment apparatus
11/13/2013CN103392225A 氮化物半导体装置 The nitride semiconductor device
11/13/2013CN103392224A Semiconductor device and method for producing same
11/13/2013CN103392223A Method of manufacturing silicon substrate and silicon substrate
11/13/2013CN103392222A 成膜方法及成膜装置 Film forming method and film forming apparatus
11/13/2013CN103392221A Curable composition for nanoimprinting, nanoimprinting compact, and pattern forming method
11/13/2013CN103392216A Electron gun and electron beam device
11/13/2013CN103392198A Electrode substrate and display device and touch panel comprising same
11/13/2013CN103392150A Exposure device and microlens array structure
11/13/2013CN103391992A Water-soluble working fluid for fixed abrasive grain wire saw
11/13/2013CN103391973A Electrically conductive composition
11/13/2013CN103391819A Liquid-application device and liquid-application method
11/13/2013CN103390697A Photovoltaic device and method forming same, and plasma enhanced chemical vapor deposition (OECVD) system
11/13/2013CN103390674A Copper zinc tin sulfide (CZTS) flexible solar cell and preparation method thereof
11/13/2013CN103390654A Multi-groove terminal Schottky device and preparation method thereof
11/13/2013CN103390653A Groove structure schottky device and manufacture method thereof
11/13/2013CN103390652A Groove charge compensation schottky semiconductor device and manufacture method thereof
11/13/2013CN103390651A Groove schottky semiconductor device and manufacturing method thereof
11/13/2013CN103390650A Semiconductor device with passive metal schottky and manufacturing method thereof
11/13/2013CN103390649A Device and method for high-k and metal gate stack
11/13/2013CN103390648A Semiconductor structure and method of forming the same
11/13/2013CN103390646A 半导体元件及其制造方法 Semiconductor device and manufacturing method
11/13/2013CN103390645A LDMOS transistor and manufacturing method thereof
11/13/2013CN103390644A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
11/13/2013CN103390642A IGBT (insulated gate bipolar translator) device and packaging method for whole-wafer IGBT chip
11/13/2013CN103390641A Insulated gate bipolar transistor and self-alignment manufacturing method thereof
11/13/2013CN103390640A Silicon schottky junction taking Bi2Se3 film as contact layer and preparation method
11/13/2013CN103390639A Group 13 nitride semiconductor device and method of its manufacture
11/13/2013CN103390638A Semiconductor device and fabricating method thereof
11/13/2013CN103390637A FinFET及其制造方法 And a method of manufacturing FinFET
11/13/2013CN103390635A Semiconductor device with passive metal PN knot and manufacturing method thereof
11/13/2013CN103390634A SiC MOSFET结构及其制造方法 SiC MOSFET structure and manufacturing method
11/13/2013CN103390623A Method of manufacturing detection device, detection device, and detection system
11/13/2013CN103390621A Memory device and method for manufacturing memory device
11/13/2013CN103390620A Semiconductor structure and fabrication method thereof
11/13/2013CN103390619A Integrated circuit with directional light sensor
11/13/2013CN103390612A Semiconductor device, semiconductor device module and method of fabricating semiconductor device
11/13/2013CN103390610A Electronic component module and method for manufacturing same
11/13/2013CN103390609A Semiconductor device and forming method thereof
11/13/2013CN103390608A Conductive structure and method for forming the same
11/13/2013CN103390607A 铜互连结构及其形成方法 Copper interconnect structure and method of forming
11/13/2013CN103390604A Semiconductor device manufacturing method and semiconductor device
11/13/2013CN103390601A Chip package and method for forming the same
11/13/2013CN103390600A Semiconductor package and fabrication method thereof
11/13/2013CN103390598A Semiconductor package and fabrication method thereof
11/13/2013CN103390596A Insulation packaging device of semiconductor and manufacturing method of insulation packaging device
11/13/2013CN103390595A Ruggedized photonic crystal sensor packaging
11/13/2013CN103390594A Multichip flip-chip encapsulation module and related manufacturing method
11/13/2013CN103390593A Semiconductor substrate and manufacturing method thereof
11/13/2013CN103390592A Preparation method of array substrate, array substrate and display device
11/13/2013CN103390591A Method for preparing silicon-based high-mobility CMOS (complementary metal-oxide-semiconductor) provided with III-V/Ge channel
11/13/2013CN103390590A Storage manufacturing method based on P-type ZnSe/ N-type Si core shell nanowire heterojunction
11/13/2013CN103390589A NOR structure flash memory and manufacturing method thereof
11/13/2013CN103390588A Method for manufacturing MROM based on OTP memorizer
11/13/2013CN103390587A Method for manufacturing CMOS (complementary metal oxide semiconductor) device
11/13/2013CN103390586A A method of forming a semiconductor device having a raised source and drain regions, and the corresponding semiconductor device
11/13/2013CN103390585A Strained-channel semiconductor device fabrication
11/13/2013CN103390584A Method for manufacturing semiconductor device
11/13/2013CN103390583A 半导体集成器件及其制作方法 The semiconductor integrated device and manufacturing method thereof
11/13/2013CN103390582A High voltage light emitting diode and fabricating method thereof
11/13/2013CN103390581A Through-silicon-via etching method
11/13/2013CN103390580A Back exposing method of TSV (through silicon via)
11/13/2013CN103390579A Layout design with via routing structure
11/13/2013CN103390578A Manufacturing method for metal fuse
11/13/2013CN103390577A Low K dielectric barrier layer and forming method thereof
11/13/2013CN103390576A 铜互连结构及其形成方法 Copper interconnect structure and method of forming
11/13/2013CN103390575A Manufacture method of full isolation structure
11/13/2013CN103390574A Manufacturing method for shallow trench isolation and manufacturing method for complementary metal-oxide-semiconductor transistor (CMOS)
11/13/2013CN103390573A Holding table
11/13/2013CN103390572A 石英舟 Quartz boat
11/13/2013CN103390571A Substrate storage condition inspecting apparatus and substrate storage facility having same
11/13/2013CN103390570A Capacitance-voltage test preprocessing method
11/13/2013CN103390569A Method for measuring shape of TSV (through silicon via) with high aspect ratio
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