Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2013
11/07/2013US20130292057 Capacitively coupled plasma source with rf coupled grounded electrode
11/07/2013US20130292056 Edge ring assembly with dielectric spacer ring
11/07/2013US20130292048 Film adhesive for semiconductor vacuum processing apparatus
11/07/2013US20130291905 Substrate treatment apparatus
11/07/2013US20130291891 Method for cleaning silicon wafer and apparatus for cleaning silicon wafer
11/07/2013DE112012000658T5 Substrat mit leitendem Film, Substrat mit Mehrschicht-Reflexionsfilm und Reflexionsmaskenrohling für eine EUV-Lithographie Substrate with conductive film substrate with multilayer reflective film and reflective mask blank for EUV lithography
11/07/2013DE112012000648T5 Schottky-Barrieren-Diode, Verfahren zum Bilden der Diode und Entwurfsstruktur für die Diode Schottky barrier diode, method for forming the diode and design structure for the diode
11/07/2013DE112011104773T5 Verfahren zur Herstellung eines Nitrid-Halbleiterelements A method for producing a nitride semiconductor element
11/07/2013DE112007003616B4 Veraschungsvorrichtung Ashing device
11/07/2013DE112007000697B4 Leistungshalbleitervorrichtung Power semiconductor device
11/07/2013DE102013207698A1 Halbleitervorrichtung Semiconductor device
11/07/2013DE102013206664A1 Verbessertes Transistorleistungsvermögen durch Ausbildung eines zusätzlichen Reinigungsprozesses in einer Verspannungsschicht-Vorgehensweise Improved transistor performance by forming an additional purification process in a strain-layer approach
11/07/2013DE102013104487A1 Verfahren zum Herstellen eines Chipgehäuses A method of manufacturing a chip housing
11/07/2013DE102013104469A1 Device for large-scale electrical/thermal contact of metal electrode with flat surface of wafer, has metal plate connected with sealing unit so that the sealing unit is moved with its side on flat side of frame, on application of force
11/07/2013DE102013104463A1 Chip-Einbettungsgehäuse und Verfahren zum Bilden eines Chip-Einbettungsgehäuses Chip embedding housing and method of forming a chip embedding housing
11/07/2013DE102013104337A1 Halbleitergehäuse und Verfahren zu seiner Herstellung Semiconductor package and method for its preparation
11/07/2013DE102013007442A1 Device, used to process planar workpieces e.g. mono-or polycrystalline semiconductor ingot, comprises processing unit having processing laser, optical detection unit, and control and/or regulating unit, where laser passes to workpiece
11/07/2013DE102012224356A1 Semiconductor device has terminals having planar portions that are extended in direction from interior of semiconductor device to outer side of device
11/07/2013DE102012219568B3 Power semiconductor module manufacturing method, involves connecting semiconductor components with two conductors, respectively, and breaking insulant body along recesses that extend between connection and utilizable regions
11/07/2013DE102012207560A1 Method for manufacturing semiconductor module, involves preparing electrically conductive bonded connection between metallization layer and end of terminal element by arc welding and by generating electric arc
11/07/2013DE102012207519A1 Verfahren zum herstellen eines bauelementträgers, einer elektronischen anordnung und einer strahlungsanordnung und bauelementträger, elektronische anordnung und strahlungsanordnung Method of manufacturing a component-carrier, an electronic arrangement and a radiation arrangement and component-makers, electronic assembly and radiation arrangement
11/07/2013DE102012207475A1 Substrate supporting carrier of substrate receiving device used in substrate coating device, has anti-twist plate that is designed and arranged such that rotation of substrate arranged on support surface is inhibited
11/07/2013DE102012207324A1 Verfahren und Vorrichtung zum Herstellen von mehreren optoelektronischen Bauelementen Method and apparatus for producing a plurality of optoelectronic devices
11/07/2013DE102012206587A1 Lotmaterial, Verfahren zu dessen Herstellung und seine Verwendung zum drucklosen Fügen metallischer Substrate Solder material, process for its preparation and its use for joining metallic substrates unpressurized
11/07/2013DE102012206405B4 Verfahren zur Erzielung erhöhter Bauteilzuverlässigkeit eines Halbleiterbauelements durch Bereitstellen günstigerer Prozessbedingungen beim Aufwachsen einer Schicht mit großem ε Method of achieving increased component reliability of a semiconductor device by providing favorable process conditions during the growth of a layer with large ε
11/07/2013DE102012103893A1 Modul zum Austauschen einer Schnittstelleneinheit in einem Testsystem zum Testen von Halbleiterelementen und Testsystem mit einem solchen Modul Module for exchanging an interface unit in a test system for testing semiconductor devices and test system with such a module
11/07/2013DE102012103430A1 Verfahren zum Heften von Chips auf ein Substrat Method for stitching of chips on a substrate
11/07/2013DE102012102251B4 Verfahren und Vorrichtung zur Behandlung von Schadgasen Method and apparatus for treatment of noxious gases
11/07/2013DE102012001769B4 Gebondete gestapelte wafer Bonded wafer stacked
11/07/2013DE102011079389B4 Verfahren und Vorrichtung zum überstandsfreien Verfüllen eines Spalts zwischen einem Träger und einem darauf aufgebrachten Bauteil Method and apparatus for supernatant free filling a gap between a carrier and applied thereto a component
11/07/2013DE102009010556B4 Verfahren zur Herstellung von epitaxierten Siliciumscheiben Process for producing epitaxially coated silicon wafers
11/07/2013DE102005009974B4 Transistor mit flachem Germaniumimplantationsbereich im Kanalund Verfahren zur Herstellung Transistor with shallow germanium implantation region in Kanalund method for producing
11/07/2013CA2861322A1 Membrane-supported, thermoelectric compositions
11/06/2013EP2660870A1 Field-effect transistor and method for manufacturing same
11/06/2013EP2660869A1 Semiconductor device and method for manufacturing same
11/06/2013EP2660868A1 Laminate structure including oxide semiconductor thin film layer, and thin film transistor
11/06/2013EP2660867A2 Testing circuit, wafer, measuring apparatus, device manufacturing method and display device
11/06/2013EP2660866A2 Semiconductor device and method of manufacturing the same
11/06/2013EP2660861A1 Thin-film transistor array substrate, manufacturing method therefor, and electronic device
11/06/2013EP2660860A1 Work heating device and work treatment device
11/06/2013EP2660859A1 Contactless conveyance apparatus
11/06/2013EP2660858A1 Semiconductor module, mould device, and mould-forming method
11/06/2013EP2660857A1 Thin-film photovoltaic device
11/06/2013EP2660856A1 Method for manufacturing hexagonal semiconductor plate crystal
11/06/2013EP2660854A2 Projection optical system, exposure apparatus and exposure method
11/06/2013EP2660853A2 Projection optical system, exposure apparatus and exposure method
11/06/2013EP2660852A2 Projection optical system, exposure apparatus and exposure method
11/06/2013EP2660851A1 Device and method for releasing a wafer from a holder
11/06/2013EP2660655A1 Lithography system, method of clamping and wafer table
11/06/2013EP2660366A1 Silicon carbide substrate, semiconductor device, method for producing silicon carbide substrate, and method for producing semiconductor device
11/06/2013EP2660257A1 Aromatic hydrocarbon resin, composition for forming lithographic underlayer film, and method for forming multilayer resist pattern
11/06/2013EP2660195A1 Process for production of compound having chalcopyrite structure
11/06/2013EP2660190A1 Encapsulated component with active element and implantable medical device comprising said component
11/06/2013EP2659946A2 Apparatus for processing exhaust fluid
11/06/2013EP2659521A2 A method and apparatus for forming a thin lamina
11/06/2013EP2659518A2 Laser processing methods for photovoltaic solar cells
11/06/2013EP2659514A2 A method to reduce contact resistance of n-channel transistors by using a iii-v semiconductor interlayer in source and drain
11/06/2013EP2659511A2 Memory with extended charge trapping layer
11/06/2013EP2659507A1 Vacuum treatment apparatus
11/06/2013EP2659506A1 Vacuum treatment apparatus and a method for manufacturing
11/06/2013EP2659505A1 Method and device for bonding two wafers
11/06/2013EP2659504A1 Deposition systems and processes
11/06/2013EP2659032A1 Method of manufacturing annealed wafer
11/06/2013EP2659026A1 Wafer processing with carrier extension
11/06/2013EP1433199B1 Method for forming a cavity structure in an soi substrate and cavity structure formed in an soi substrate
11/06/2013CN203277484U A laying machine glass table
11/06/2013CN203277482U A solar silicon wafer overturning and adsorbing apparatus
11/06/2013CN203277478U Lifting platform for curved crystalline silicon photovoltaic cell
11/06/2013CN203277471U Photovoltaic cell panel tote cart
11/06/2013CN203277348U Sizing strip for diode production
11/06/2013CN203277347U Aluminum strip tray used for diode production
11/06/2013CN203277346U Photovoltaic cell piece pipette
11/06/2013CN203277345U Positioning fixture for DBC board package
11/06/2013CN203277344U Silicon slice box and corresponding fixed tray
11/06/2013CN203277343U Quartz loading stage for silicon slice thermal treatment
11/06/2013CN203277342U Graphite plate used for diode production
11/06/2013CN203277341U Photo mask box
11/06/2013CN203277340U Carrier structure for semiconductor package conveying system
11/06/2013CN203277339U Photovoltaic cell piece storage bench
11/06/2013CN203277338U Novel hollow plate
11/06/2013CN203277337U 热处理装置 Heat treatment device
11/06/2013CN203277336U Material-combing rack used for diode production
11/06/2013CN203277335U Lamination processing device of silicon chip automatic feeding device
11/06/2013CN203277334U Silicon chip cleaning etching groove
11/06/2013CN203277333U Conveyer with visual function
11/06/2013CN203277332U Detecting system of wafer edge cleaning technology
11/06/2013CN203277331U Leading wire support plate used for diode production
11/06/2013CN203277330U Welding and assembling apparatus for diode lead
11/06/2013CN203277329U Semiconductor device
11/06/2013CN203277328U Pickling plate used for diode production
11/06/2013CN203277327U Material-combing strip for diode production
11/06/2013CN203277326U Photovoltaic etching groove
11/06/2013CN203277325U Pickling rack used for diode production
11/06/2013CN203277324U Dropping sheet automatic detection and automatic sheet-correcting system of automatic feeding and blanking device
11/06/2013CN203266649U Mechanical arm device for carrying diodes integrally
11/06/2013CN203265122U Solar silicon wafer washing device
11/06/2013CN203264978U Rubber coating device for producing diode
11/06/2013CN103384917A Semiconductor substrate and method of producing same
11/06/2013CN103384912A Edge ring for a thermal processing chamber
11/06/2013CN103384911A Thin-film transistor device and method for manufacturing same, organic electroluminescent display elements and organic electroluminescent display device