Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2007
03/20/2007US7192241 Substrate conveyer robot
03/20/2007US7191930 Electrostatic methods and apparatus for mounting and demounting particles from a surface having an array of tacky and non-tacky areas
03/20/2007US7191929 Method of measuring thickness of bonded ball in wire bonding
03/20/2007US7191785 Substrate processing apparatus for resist film removal
03/20/2007CA2468615C A method for making self-registering non-lithographic transistors with ultrashort channel lengths
03/15/2007WO2007030824A2 Flow-formed chamber component having a textured surface
03/15/2007WO2007030806A2 Process of stripping a microarray for reuse
03/15/2007WO2007030709A2 METHOD FOR ENHANCING GROWTH OF SEMI-POLAR (Al, In,Ga,B)N VIA METALORGANIC CHEMICAL VAPOR DEPOSITION
03/15/2007WO2007030528A2 Photomask and method for forming a non-orthogonal feature on the same
03/15/2007WO2007030527A2 Photomask for the fabrication of a dual damascene structure and method for forming the same
03/15/2007WO2007030522A2 Selectivity etch of films with high dielectric constant with h2 addition
03/15/2007WO2007030516A1 Method of controlling solder deposition on heat spreader used for semiconductor package
03/15/2007WO2007030495A1 Methods for fabricating sub-resolution line space patterns
03/15/2007WO2007030483A2 Method and system of using nanotube fabrics as joule heating elements for memories and other applications
03/15/2007WO2007030368A2 Lattice-mismatched semiconductor structures on insulators and their fabrication methods
03/15/2007WO2007030346A2 Memory cell layout and process flow
03/15/2007WO2007030343A2 Silicided recessed silicon
03/15/2007WO2007030332A2 Methods of forming openings into dielectric material
03/15/2007WO2007030327A2 High temperature microelectromechanical (mem) devices and fabrication method
03/15/2007WO2007030274A2 Method for bonding titanium based mesh to a titanium based substrate
03/15/2007WO2007030258A2 Post deposition plasma treatment to increase tensile stress of a hdp-cvd si 02 layer
03/15/2007WO2007030231A2 Registration mark within an overlap of dopant regions
03/15/2007WO2007030081A1 Substrate structure and method for wideband power decoupling
03/15/2007WO2007029991A1 Multiple-valued sram
03/15/2007WO2007029971A1 Method of forming organic layer on semiconductor substrate
03/15/2007WO2007029949A1 Portable die cleaning apparatus and method thereof
03/15/2007WO2007029865A1 Compound semiconductor device
03/15/2007WO2007029842A1 Gallium nitride-based compound semiconductor light-emitting device and production method thereof
03/15/2007WO2007029829A1 Exposure apparatus, exposure method, and device production method
03/15/2007WO2007029828A1 Analysis method, exposure method, and method for manufacturing device
03/15/2007WO2007029826A1 Photomask blank and production method thereof, and photomask production method, and semiconductor device production method
03/15/2007WO2007029822A1 Material for protective film formation, and method for photoresist pattern formation using the same
03/15/2007WO2007029767A1 Washing agent for photolithography and method of forming photoresist pattern using the same
03/15/2007WO2007029766A1 Probe card for wafer test, wafer-testing device, and wafer-testing method
03/15/2007WO2007029765A1 Material for protective film formation and method for photoresist pattern formation using the same
03/15/2007WO2007029754A1 Alumina film substrate and its fabrication method
03/15/2007WO2007029744A1 Group iii/v nitride semiconductor, photocatalyst semiconductor element, photocatalytic redox reaction apparatus, and photoelectrochemical reaction execution method
03/15/2007WO2007029726A1 Method for the vaporization of liquid raw material which enables low-temperature vaporization of liquid raw material and vaporizer for the method
03/15/2007WO2007029711A1 Semiconductor light-emitting device and method for manufacturing same
03/15/2007WO2007029703A1 Method of cleaning and process for producing semiconductor device
03/15/2007WO2007029701A1 Resist composition and method of resist pattern formation
03/15/2007WO2007029637A1 Thin film manufacturing apparatus and thin film manufacturing method
03/15/2007WO2007029614A1 Positive photosensitive resin composition
03/15/2007WO2007029584A1 Semiconductor device
03/15/2007WO2007029580A1 Magnetron control method, magnetron service life judgment method, microwave generation device, magnetron service life judgment device, processing device, computer program, and storage medium
03/15/2007WO2007029561A1 Aligner
03/15/2007WO2007029551A1 Organic thin film transistor, base body for organic thin film transistor and method for manufacturing organic thin film transistor
03/15/2007WO2007029542A1 Film forming composition for nanoimprinting and method for pattern formation
03/15/2007WO2007029524A1 Method of microfabrication under controlled pressure and microfabrication apparatus
03/15/2007WO2007029523A1 Process for producing etching material
03/15/2007WO2007029504A1 Epoxy resin composition and die bonding material comprising the composition
03/15/2007WO2007029488A1 Endpoint detection method, endpoint detection apparatus, and vapor-phase reactor comprising endpoint detection apparatus
03/15/2007WO2007029482A1 Semiconductor structure
03/15/2007WO2007029465A1 Polishing agent, method for polishing surface to be polished, and method for manufacturing semiconductor integrated circuit device
03/15/2007WO2007029462A1 Polymer, negative resist composition, and method of forming resist pattern
03/15/2007WO2007029444A2 Semiconductor device and method of manufacturing the same
03/15/2007WO2007029401A1 Work loading/unloading system and conveyance device
03/15/2007WO2007029394A1 Thin-film element, display device and memory cell using the thin-film element, and their fabrication method
03/15/2007WO2007029389A1 Semiconductor device, method for manufacturing same, and display
03/15/2007WO2007029385A1 Method of predicting behavior of internal gettering in silicon substrate and storage medium storing program for predicting of the behavior
03/15/2007WO2007029384A1 Semiconductor device
03/15/2007WO2007029375A1 Semiconductor device and method of fabricating semiconductor device
03/15/2007WO2007029320A1 Ferroelectric memory
03/15/2007WO2007029315A1 Pattern transfer mask, focus error measurement method and apparatus, and method of fabricating semiconductor device
03/15/2007WO2007029303A1 One-to-one x-ray exposure method and one-to-one x-ray exposure apparatus
03/15/2007WO2007029289A1 Ferroelectric memory device, process for producing the same, and process for producing semiconductor device
03/15/2007WO2007029282A1 Semiconductor device and method for manufacturing same
03/15/2007WO2007029178A2 Method of manufacturing a semiconductor device with an isolation region and a device manufactured by the method
03/15/2007WO2007029028A1 Laser ablation of electronic devices
03/15/2007WO2007028898A1 Mechanochemical polishing composition, method for preparing and using same
03/15/2007WO2007028800A1 Method for making a semiconductor-on-insulation heterostructure
03/15/2007WO2007028695A1 Method for cleaning particulate foreign matter from the surfaces of semiconductor wafers
03/15/2007WO2007028672A1 Cooling body for an electronic housing
03/15/2007WO2007008764A3 Chemical mixing apparatus, system and method
03/15/2007WO2007006764A3 Method of manufacturing a semiconductor power device
03/15/2007WO2007003639A3 Substrate, in particular made of silicon carbide, coated with a thin stoichiometric film of silicon nitride, for making electronic components, and method for obtaining such a film
03/15/2007WO2007002695A3 Layout modification to eliminate line bending caused by line material shrinkage
03/15/2007WO2007002426A3 Semiconductor device structures and methods of forming semiconductor structures
03/15/2007WO2007002117A3 Trench isolation transistor with grounded gate for a 4.5f2 dram cell and manufacturing method thereof
03/15/2007WO2007001598A3 Lead-free semiconductor package
03/15/2007WO2007001274A3 Patterning and aligning semiconducting nanoparticles
03/15/2007WO2007000407A3 Method and device for producing self-adhesive rfid transponders
03/15/2007WO2006135688A3 Polar surface preparation of nitride substrates
03/15/2007WO2006107897A3 Semiconductor device including a superlattice and adjacent semiconductor layer with doped regions defining a semiconductor junction
03/15/2007WO2006089296A3 Low cost, high volume lead frame production
03/15/2007WO2006023088A3 Light emitting device processes
03/15/2007WO2006020134A3 Method and system for characterizing porous materials
03/15/2007WO2005117144B1 Gate driver output stage with bias circuit for high and wide operating voltage range
03/15/2007WO2005102870A3 Wafer container door with particulate collecting structure
03/15/2007WO2005099310A3 Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices
03/15/2007WO2005098091A3 A method of plasma etch endpoint detection using a v-i probe diagnostics
03/15/2007US20070061768 Method of implementing polishing uniformity and modifying layout data
03/15/2007US20070061609 Holding system, exposure apparatus, and device manufacturing method
03/15/2007US20070061042 Substrate carrier handler that unloads substrate carriers directly from a moving conveyor
03/15/2007US20070061035 Method and computer-readable medium for in situ photoresist thickness characterization
03/15/2007US20070061034 Methods and apparatus for integrating large and small lot electronic device fabrication facilities
03/15/2007US20070061030 Reliability analysis system and method
03/15/2007US20070060683 Curable adhesives; semiconductors
03/15/2007US20070059984 Modular sockets using flexible interconnects
03/15/2007US20070059949 Laser irradiating apparatus and method of manufacturing semiconductor apparatus