Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2007
03/15/2007US20070059948 Atomic layer deposition (ALD); tetrakis(diethylamido)hafnium; hafium oxides/nitrides; capacitors
03/15/2007US20070059947 Method of manufacturing carbon nanotube semiconductor device
03/15/2007US20070059946 Method for compensating film height modulations in spin coating of a resist film layer
03/15/2007US20070059945 Atomic layer deposition with nitridation and oxidation
03/15/2007US20070059944 Plasma processing method and computer storage medium
03/15/2007US20070059943 Ion-assisted oxidation methods and the resulting structures
03/15/2007US20070059942 Plasma cvd process for manufacturing multilayer anti-reflection coatings
03/15/2007US20070059941 Methods of forming patterns and capacitors for semiconductor devices using the same
03/15/2007US20070059940 Photosensitizer, semiconductor electrode, and photoelectric conversion device
03/15/2007US20070059939 Method of producing a conductive layer on a substrate
03/15/2007US20070059938 Method and system for etching silicon oxide and silicon nitride with high selectivity relative to silicon
03/15/2007US20070059937 Semiconductor device and method for manufacturing the same
03/15/2007US20070059936 Electronic sensing circuit
03/15/2007US20070059934 Methods of forming fine patterns, and methods of forming trench isolation layers using the same
03/15/2007US20070059933 Plasma ashing method
03/15/2007US20070059932 Methods of forming films in semiconductor devices with solid state reactants
03/15/2007US20070059931 Contact structure having silicide layers, semiconductor device employing the same, and methods of fabricating the contact structure and semiconductor device
03/15/2007US20070059930 Method of forming conductive metal silicides by reaction of metal with silicon
03/15/2007US20070059929 Method of forming a tantalum carbon nitride layer and method of manufacturing a semiconductor device using the same
03/15/2007US20070059928 Methods for synthesis of metal nanowires
03/15/2007US20070059927 Method of fabricating semiconductor device including resist flow process and film coating process
03/15/2007US20070059926 Method for fabricating semiconductor device including resist flow process and film coating process
03/15/2007US20070059925 Method of forming metal wiring layer of semiconductor device
03/15/2007US20070059924 Method of manufacturing semiconductor device
03/15/2007US20070059923 Methods of fabricating damascene interconnection line in semiconductor devices and semiconductor devices fabricated using such methods
03/15/2007US20070059922 Post-etch removal of fluorocarbon-based residues from a hybrid dielectric structure
03/15/2007US20070059921 Semiconductor device interconnection contact and fabrication method
03/15/2007US20070059920 Method of fabricating copper damascene and dual damascene interconnect wiring
03/15/2007US20070059919 Method of manufacturing semiconductor device
03/15/2007US20070059918 Rigid-flexible printed circuit board for package on package and manufacturing method
03/15/2007US20070059917 Printed circuit board having fine pattern and manufacturing method thereof
03/15/2007US20070059916 Manufacturing method of semiconductor device
03/15/2007US20070059915 Method of forming an electrical contact
03/15/2007US20070059914 Method of forming micro patterns in semiconductor devices
03/15/2007US20070059913 Capping layer to reduce amine poisoning of photoresist layers
03/15/2007US20070059912 Method of forming metal silicide layer and related method of fabricating semiconductor devices
03/15/2007US20070059911 Semiconductor fabrication process including silicide stringer removal processing
03/15/2007US20070059910 Semiconductor structure and method for manufacturing the same
03/15/2007US20070059909 Method for manufacturing semiconductor device
03/15/2007US20070059908 Transistor design self-aligned to contact
03/15/2007US20070059907 Implantation process in semiconductor fabrication
03/15/2007US20070059906 Semiconductor device having a spacer layer doped with slower diffusing atoms than substrate
03/15/2007US20070059904 Method of manufacturing silicon wafer
03/15/2007US20070059903 Pressure-sensitive adhesive sheet and method of processing articles
03/15/2007US20070059902 Method for manufacturing semiconductor device
03/15/2007US20070059901 Metal and electronically conductive polymer transfer
03/15/2007US20070059900 Multi-step depositing process
03/15/2007US20070059899 Sub-micron space liner and filler process
03/15/2007US20070059898 Semiconductor devices including trench isolation structures and methods of forming the same
03/15/2007US20070059897 Isolation for semiconductor devices
03/15/2007US20070059896 Nitrous oxide anneal of teos/ozone cvd for improved gapfill
03/15/2007US20070059895 Dielectric layer, method of manufacturing the dielectric layer and method of manufacturing capacitor using the same
03/15/2007US20070059894 Selective deposition of germanium spacers on nitride
03/15/2007US20070059893 Stacked capacitor and method for producing stacked capacitors for dynamic memory cells
03/15/2007US20070059892 Method for fabricating a semiconductor structure
03/15/2007US20070059891 Mandrel/trim alignment in SIT processing
03/15/2007US20070059890 Methods of manufacturing semiconductor thin film, electronic device and liquid crystal display device
03/15/2007US20070059889 Recessed gate electrode and method of forming the same and semiconductor device having the recessed gate electrode and method of manufacturing the same
03/15/2007US20070059888 Semiconductor integrated circuit device and manufacturing method thereof
03/15/2007US20070059887 Method for producing a trench transistor and trench transistor
03/15/2007US20070059886 System and method for automatically calculating parameters of an mosfet
03/15/2007US20070059885 Semiconductor device and method of manufacturing same
03/15/2007US20070059884 Method of manufacturing flash memory device
03/15/2007US20070059883 Method of fabricating trap nonvolatile memory device
03/15/2007US20070059882 Memory elements having patterned electrodes and method of forming the same
03/15/2007US20070059881 Atomic layer deposited zirconium aluminum oxide
03/15/2007US20070059880 Hsg process and process of fabricating large-area electrode
03/15/2007US20070059879 Pixel structure and fabricating method thereof
03/15/2007US20070059878 Salicide process
03/15/2007US20070059877 Spin transistor using spin-orbit coupling induced magnetic field
03/15/2007US20070059876 Method of fabricating a flash memory device
03/15/2007US20070059875 Semiconductor device and method of manufacturing the same, and semiconductor substrate and method of manufacturing the same
03/15/2007US20070059874 Dual Metal Gate and Method of Manufacture
03/15/2007US20070059873 Fabrication of single or multiple gate field plates
03/15/2007US20070059872 MOS Transistor Gates with Doped Silicide and Methods for Making the Same
03/15/2007US20070059871 Semiconductor device and manufacturing method thereof
03/15/2007US20070059870 Method of forming carbon-containing silicon nitride layer
03/15/2007US20070059869 Electrode for electric chemical capacitor, manufacturing method and apparatus thereof
03/15/2007US20070059868 Thin film transistor manufacturing method and substrate structure
03/15/2007US20070059867 Method of manufacturing an optical module
03/15/2007US20070059866 Fan out type wafer level package structure and method of the same
03/15/2007US20070059865 Semiconductor package with a support structure and fabrication method thereof
03/15/2007US20070059864 Method for manufacturing thermal interface material with carbon nanotubes
03/15/2007US20070059863 Method of manufacturing quad flat non-leaded semiconductor package
03/15/2007US20070059862 Multiple chip semiconductor package
03/15/2007US20070059861 Systems and methods for transferring small lot size substrate carriers between processing tools
03/15/2007US20070059860 Method for manufacturing semiconductor package
03/15/2007US20070059858 Microfabricated capacitive ultrasonic transducer for high frequency applications
03/15/2007US20070059857 Three-axis accelerometer
03/15/2007US20070059856 Method for manufacturing optical device
03/15/2007US20070059855 Method for manufacturing FFS mode LCD
03/15/2007US20070059854 Flexible pixel array substrate and method for fabricating the same
03/15/2007US20070059853 Method for Manufacturing Semiconductor Device
03/15/2007US20070059852 Semiconductor light-emitting device and fabrication method thereof
03/15/2007US20070059851 Multiple point gate oxide integrity test method and system for the manufacture of semiconductor integrated circuits
03/15/2007US20070059850 Method and system for derivation of breakdown voltage for MOS integrated circuit devices
03/15/2007US20070059849 Method and system for BARC optimization for high numerical aperture applications
03/15/2007US20070059848 Method of controlling impurity doping and impurity doping apparatus
03/15/2007US20070059847 Method and system for optimizing a BARC stack
03/15/2007US20070059846 Manufacturing method for semiconductor memory
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