Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2007
03/08/2007US20070054462 Semiconductor device including direct contact between capacitor electrode and contact plug and method of manufacturing the same
03/08/2007US20070054461 Trench capacitor and method for manufacturing the same
03/08/2007US20070054460 System and method for providing a nanoscale, highly selective, and thermally resilient silicon, germanium, or silicon-germanium etch-stop
03/08/2007US20070054459 SOI wafer and method for producing the same
03/08/2007US20070054458 Method of fabricating spacers and cleaning method of post-etching and semiconductor device
03/08/2007US20070054457 Method of fabricating MOS transistor having epitaxial region
03/08/2007US20070054456 Semiconductor device and method for fabricating the same
03/08/2007US20070054455 Method to obtain uniform nitrogen profile in gate dielectrics
03/08/2007US20070054454 Semiconductor device and programming method therefor
03/08/2007US20070054453 Methods of forming integrated circuit memory devices having a charge storing layer formed by plasma doping
03/08/2007US20070054452 Source side injection storage device with spacer gates and method therefor
03/08/2007US20070054451 Semiconductor device and method for manufacturing the same
03/08/2007US20070054450 Structure and fabrication of an MRAM cell
03/08/2007US20070054449 Methods of forming charge-trapping dielectric layers for semiconductor memory devices
03/08/2007US20070054448 Nonvolatile memory device having multi-bit storage and method of manufacturing the same
03/08/2007US20070054447 Multistep etching method
03/08/2007US20070054446 Work function control of metals
03/08/2007US20070054445 Method of manufacturing nano scale semiconductor device using nano particles
03/08/2007US20070054444 Manufacturing method of a semiconductor device
03/08/2007US20070054443 Method for manufacturing semiconductor device
03/08/2007US20070054442 Method for manufacturing thin film transistor, thin film transistor and pixel structure
03/08/2007US20070054441 Thin film transistor and manufacturing process thereof
03/08/2007US20070054440 Method for fabricating a device with flexible substrate and method for stripping flexible-substrate
03/08/2007US20070054439 Multi-chip stack structure
03/08/2007US20070054438 Carrier-free semiconductor package with stand-off member and fabrication method thereof
03/08/2007US20070054437 Optical element and its manufacturing method
03/08/2007US20070054436 Method of manufacturing optical film
03/08/2007US20070054435 Process for preparation of absorption layer of solar cell
03/08/2007US20070054434 Methods of fabricating an image sensor
03/08/2007US20070054433 High temperature microelectromechanical (MEM) devices and fabrication method
03/08/2007US20070054432 Method for producing a structure with a low aspect ratio
03/08/2007US20070054431 Nitride semiconductor laser element and method for manufacturing the same
03/08/2007US20070054430 Method of fabricating organic electroluminescent devices
03/08/2007US20070054429 Back panel manufacturing process
03/08/2007US20070054428 Light-emitting device and manufacturing method thereof
03/08/2007US20070054427 Terahertz radiating device based on semiconductor coupled quantum wells
03/08/2007US20070054426 A method for preparing an optical active layer with 1~10 nm distributed silicon quantum dots
03/08/2007US20070054425 Apparatus for measuring semiconductor physical characteristics
03/08/2007US20070054424 Semiconductor heating heater holder and semiconductor manufacturing apparatus
03/08/2007US20070054423 Method for controlling thickness distribution of a film
03/08/2007US20070054422 Test structure for electrically verifying the depths of trench-etching in an soi wafer, and associated working methods
03/08/2007US20070054421 Production process of structured material
03/08/2007US20070054420 Substrate structure and method for wideband power decoupling
03/08/2007US20070054419 Wafer level chip size package for CMOS image sensor module and manufacturing method thereof
03/08/2007US20070054203 Mask, method of producing mask, and method of producing semiconductor device
03/08/2007US20070054202 Prevents a drop in pattern alignment accuracy due to the internal stress of the membrane and able to align patterns including complementary patterns at a high accuracy; stencil mask having lattice-shaped struts which are connected to other struts or the silicon wafer around the membrane frame
03/08/2007US20070054200 Binary photomask having a compensation layer and method of manufacturing the same
03/08/2007US20070054198 Photomask for double exposure and double exposure method using the same
03/08/2007US20070054196 Depositing a thin Cr, Ta, or W film as an absorber layer on a Si substrate covered with a multi-layered thin film and capping layer; applying electric field between cantilever tip and multi-layered structure using an atomic force microscope to form oxide structures with fixed height and width; etching
03/08/2007US20070054115 Method for cleaning particulate foreign matter from the surfaces of semiconductor wafers
03/08/2007US20070054112 Conductive layers and fabrication methods thereof
03/08/2007US20070054064 Microwave plasma processing method, microwave plasma processing apparatus, and its plasma head
03/08/2007US20070054049 Method of growing a thin film onto a substrate
03/08/2007US20070053582 Sample inspection apparatus, image alignment method, and program-recorded readable recording medium
03/08/2007US20070053581 Defect inspection system
03/08/2007US20070053579 Outer surface-inspecting method, master patterns used therefor, and outer surface-inspecting apparatus equipped with such a master pattern
03/08/2007US20070053033 Exposure apparatus
03/08/2007US20070052948 Test pattern, inspection method, and device manufacturing method
03/08/2007US20070052945 Method and apparatus for protecting a reticle used in chip production from contamination
03/08/2007US20070052944 Lithographic apparatus and device manufacturing method
03/08/2007US20070052942 Substrate transport apparatus and method, exposure apparatus and exposure method, and device fabricating method
03/08/2007US20070052941 Exposure apparatus and device manufacturing method
03/08/2007US20070052791 Methods and systems for thermal-based laser processing a multi-material device
03/08/2007US20070052787 Method for fixing functional material apparatus for fixing functional material, device fabrication method, electrooptical device, and electronic equipment
03/08/2007US20070052432 Probe card
03/08/2007US20070052112 Support with solder ball elements and a method for populating substrates with solder balls
03/08/2007US20070052109 Flip-chip packaging process
03/08/2007US20070052106 Semiconductor device and method for fabricating the same
03/08/2007US20070052098 Metal line for a semiconductor device and fabrication method thereof
03/08/2007US20070052097 Electronic device and method of manufacturing thereof
03/08/2007US20070052096 Semiconductor device and method for forming the same
03/08/2007US20070052095 Semiconductor device and manufacturing method thereof
03/08/2007US20070052094 Semiconductor wafer level chip package and method of manufacturing the same
03/08/2007US20070052091 Electronic device and method of manufacturing same
03/08/2007US20070052088 Integrated circuit device
03/08/2007US20070052087 Method and apparatus for decoupling conductive portions of a microelectronic device package
03/08/2007US20070052086 Electronic parts and method of manufacturing electronic parts packaging structure
03/08/2007US20070052084 High density interconnect assembly comprising stacked electronic module
03/08/2007US20070052083 Semiconductor package and manufacturing method thereof
03/08/2007US20070052081 Package-on-package semiconductor assembly
03/08/2007US20070052080 Three-dimensional interconnect interposer adapted for use in system in package and method of making the same
03/08/2007US20070052076 Partially Patterned Lead Frames and Methods of Making and Using the Same in Semiconductor Packaging
03/08/2007US20070052075 Semiconductor device and method of manufacturing the same
03/08/2007US20070052073 Semiconductor device, lead frame used in the semiconductor device and electronic equipment using the semiconductor device
03/08/2007US20070052067 Semiconductor device, method of manufacturing the same, circuit board, and method of manufacturing the same
03/08/2007US20070052066 Bipolar method and structure having improved BVCEO/RCS trade-off made with depletable collector columns
03/08/2007US20070052061 Semiconductor layer with laterally variable doping, and method for producing it
03/08/2007US20070052060 DMOS transistor with floating poly-filled trench for improved performance through 3-D field shaping
03/08/2007US20070052058 High blocking semiconductor component comprising a drift section
03/08/2007US20070052043 Multilayer gate electrode, semiconductor device having the same and method of fabricating the same
03/08/2007US20070052042 Semiconductor device and method for manufacturing the same
03/08/2007US20070052041 Semiconductor device and method of fabricating the same
03/08/2007US20070052040 Transistor with contoured channel and method for making the same
03/08/2007US20070052039 Semiconductor device and method for manufacturing the same
03/08/2007US20070052038 Semiconductor device and method for fabricating the same
03/08/2007US20070052035 Method and apparatus for reducing optical crosstalk in CMOS image sensors
03/08/2007US20070052028 Semiconductor memory device including an SOI substrate
03/08/2007US20070052026 Semiconductor device and method of manufacturing the same
03/08/2007US20070052024 Thin film transistor having a nano semiconductor sheet and method of manufacturing the same
03/08/2007US20070052023 Thin film transistor and method of fabricating the same
1 ... 3088 3089 3090 3091 3092 3093 3094 3095 3096 3097 3098 3099 3100 3101 3102 3103 3104 3105 3106 3107 3108 ... 6590