Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2007
03/13/2007US7189600 Methods for fabricating stiffeners for flexible substrates
03/13/2007US7189599 Lead frame, semiconductor device using the same and method of producing the semiconductor device
03/13/2007US7189598 Wiring board, method of manufacturing the same, semiconductor device, and electronic instrument
03/13/2007US7189597 Semiconductor device and method for fabricating the same
03/13/2007US7189596 Process for forming a direct build-up layer on an encapsulated die packages utilizing intermediate structures
03/13/2007US7189595 Method of manufacture of silicon based package and devices manufactured thereby
03/13/2007US7189594 Wafer level packages and methods of fabrication
03/13/2007US7189593 Elimination of RDL using tape base flip chip on flex for die stacking
03/13/2007US7189591 Process for producing light-emitting semiconductor device
03/13/2007US7189590 Method of forming liquid crystal cell for liquid crystal display device
03/13/2007US7189589 Method of fabrication of a support structure for a semiconductor device
03/13/2007US7189588 Group III nitride semiconductor substrate and its manufacturing method
03/13/2007US7189587 Ink jet recording head and method for manufacturing the same
03/13/2007US7189586 Test key for monitoring gate conductor to deep trench misalignment
03/13/2007US7189585 Display panel, display panel inspection method, and display panel manufacturing method
03/13/2007US7189584 Fabrication alignment technique for light guide screen
03/13/2007US7189583 Method for production of MRAM elements
03/13/2007US7189499 Reducing the spacing between adjacent photoresist patterns, by heating to shrink the overcoatings, control pattern dimensions; semiconductors, photolithographic
03/13/2007US7189496 Method for the manufacture of an active matrix, corresponding electro-optical display devices and mask
03/13/2007US7189490 Photoresists containing sulfonamide component
03/13/2007US7189489 Oxime ester photoiniators having a combined structure
03/13/2007US7189435 Three dimensional multilayer nanostructure
03/13/2007US7189434 Semiconductor coating equiptment filling pipes for filling bottles with solenoid valves for photoresists
03/13/2007US7189432 Varying conductance out of a process region to control gas flux in an ALD reactor
03/13/2007US7189358 Integrated analysis chambers communicated to the micropumps; and integrated analysis devices to test said fluid in said analysis chambers for an analyte.
03/13/2007US7189317 Semiconductor manufacturing system for forming metallization layer
03/13/2007US7189305 Gas-assist systems for applying and moving ozonated resist stripper to resist-bearing surfaces of substrates
03/13/2007US7189304 Substrate layer cutting device and method
03/13/2007US7189293 Method of producing annealed wafer and annealed wafer
03/13/2007US7189292 Electronic with an alloy of silver and beryllium, and a surface layer of beryllium oxide made by oxidizing the surface of said alloy that acts as a barrier layer; useful for back end of the line (BEOL) metallic conductors in microelectronics devices such as memory or logic devices
03/13/2007US7189291 Method for the removal of airborne molecular contaminants using oxygen gas mixtures
03/13/2007US7189155 Polishing body, polishing apparatus, semiconductor device, and semiconductor device manufacturing method
03/13/2007US7189146 Method for reduction of defects in wet processed layers
03/13/2007US7189141 Polishing pad with transparent window having reduced window leakage for a chemical mechanical polishing apparatus
03/13/2007US7189139 Polishing apparatus
03/13/2007US7189077 Lithographic type microelectronic spring structures with improved contours
03/13/2007US7188736 Structure for racking substrates
03/13/2007US7188661 Process for joining members of a heat transfer assembly and assembly formed thereby
03/13/2007US7188630 Method to passivate conductive surfaces during semiconductor processing
03/13/2007US7188418 Method of making split fin heat sink
03/13/2007US7188413 Method of making a microelectronic package
03/13/2007US7188411 Process for forming portions of a compound material inside a cavity
03/13/2007CA2404870C Robotic manipulation system utilizing patterned granular motion
03/13/2007CA2095594C Card comprising at least one electronic element and method of manufacture of such a card
03/08/2007WO2007028074A2 Workpiece transfer device
03/08/2007WO2007027994A2 Method for fabricating low resistance, low inductance interconnections in high current semiconductor devices
03/08/2007WO2007027924A1 Metal source/drain schottky barrier silicon-on-nothing mosfet device and method thereof
03/08/2007WO2007027902A2 Package-on-package semiconductor assembly
03/08/2007WO2007027798A2 Boron ion implantation using alternative fluorinated boron precursors, and formation of large boron hydrides for implantation
03/08/2007WO2007027762A2 Metal interconnect structure for integrated ciruits and a design rule therefor
03/08/2007WO2007027757A2 Direct write nanolithography using heated tip
03/08/2007WO2007027740A2 Heat sink assembly and related methods for semiconductor vacuum processing systems
03/08/2007WO2007027707A1 Energy monitoring or control of individual vias formed during laser micromachining
03/08/2007WO2007027686A2 Mask patterns with spacers for pitch multiplication and methods of forming the same
03/08/2007WO2007027648A2 Flash memory with recessed floating gate
03/08/2007WO2007027607A2 Random access electrically programmable-e-fuse rom
03/08/2007WO2007027558A2 Method of forming pitch multipled contacts
03/08/2007WO2007027458A2 Batch deposition tool and compressed boat
03/08/2007WO2007027436A2 Processing thin wafers
03/08/2007WO2007027417A2 Microfeature assemblies including interconnect structures and methods for forming such interconnect structures
03/08/2007WO2007027416A1 Methods of forming field effect transistors on substrates
03/08/2007WO2007027399A1 Microelectronic devices having intermediate contacts for connection to interposer substrates, and associated methods of packaging microelectronic devices with intermediate contacts
03/08/2007WO2007027355A1 Semiconductor device having a metal gate electrode formed on an annealed high-k gate dielectric layer
03/08/2007WO2007027275A2 Interrupted deposition process for selective deposition of si-containing films
03/08/2007WO2007027169A2 Method of manufacturing silicon topological capacitors
03/08/2007WO2007027165A1 Ultraviolet curing process for spin-on dielectric materials used in pre-metal and/or shallow trench isolation applications
03/08/2007WO2007027068A1 Cerium oxide powder for one-component cmp slurry, preparation method thereof, one-component cmp slurry composition comprising the same, and method of shallow trench isolation using the slurry
03/08/2007WO2007026988A1 Assembly structure of probe card
03/08/2007WO2007026985A1 Method for fabricating probe needle tip of probe card
03/08/2007WO2007026937A1 Method for fabricating semiconductor layer and light-emitting diode
03/08/2007WO2007026931A1 Electrochemical machining method and electrochemical machining apparatus
03/08/2007WO2007026876A1 Thin layer formation equipment and process for formation of thin layers
03/08/2007WO2007026863A1 Polishing method
03/08/2007WO2007026862A1 Polishing composition
03/08/2007WO2007026861A1 Polishing composition
03/08/2007WO2007026852A1 Substrate processing unit, substrate transfer method, substrate cleansing process unit, and substrate plating apparatus
03/08/2007WO2007026816A1 Exposure apparatus, method and process for producing device
03/08/2007WO2007026781A1 Transistor, method for manufacturing same, and semiconductor device comprising such transistor
03/08/2007WO2007026778A1 Transistor, organic semiconductor device, and method for manufacture of the transistor or device
03/08/2007WO2007026774A1 Probe card
03/08/2007WO2007026762A1 Cleaning method
03/08/2007WO2007026760A1 Seal member
03/08/2007WO2007026739A1 Corrosion resistant member, treatment apparatus and sample treatment method using the member, and method for manufacture of corrosion resistant member
03/08/2007WO2007026727A1 Insulating liquid die-bonding agent and semiconductor device
03/08/2007WO2007026723A1 Projection mask, laser machining method, laser machining device, and thin film transistor element
03/08/2007WO2007026722A1 Projection mask, laser machining method, laser machining device, and thin film transistor element
03/08/2007WO2007026703A1 Method for organic material layer formation
03/08/2007WO2007026677A1 Semiconductor device manufacturing method
03/08/2007WO2007026652A1 Film-forming composition, method for pattern formation, and three-dimensional mold
03/08/2007WO2007026649A1 Vapor deposition head device and method of coating by vapor deposition
03/08/2007WO2007026616A1 Negative resistance field effect element and high-frequency oscillation element
03/08/2007WO2007026610A1 Laminate polishing pad
03/08/2007WO2007026608A1 Organic thin film transistor, and method for surface modification of gate insulating layer in organic thin film transistor
03/08/2007WO2007026605A1 Method of forming fine pattern
03/08/2007WO2007026573A1 Solution for immersion exposure and immersion exposure method
03/08/2007WO2007026569A1 Polishing pad
03/08/2007WO2007026556A1 Method and system for mirror-polishing semiconductor wafer
03/08/2007WO2007026541A1 Screen mask and semiconductor device fabrication method
03/08/2007WO2007026512A1 Method of improving nanotopography on surface of wafer and wire saw device
03/08/2007WO2007026497A1 Device and method for picking up semiconductor chip
1 ... 3086 3087 3088 3089 3090 3091 3092 3093 3094 3095 3096 3097 3098 3099 3100 3101 3102 3103 3104 3105 3106 ... 6590