Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2007
03/14/2007CN1305127C Quick method for implementing noise optimization of integrated circuit supply network using decoupling capacitor
03/14/2007CN1305126C Stacking metal-insulator-metal capacitor and anufacturing method thereof
03/14/2007CN1305125C Production method for semiconductor device
03/14/2007CN1305124C Circular container for rotary support frame
03/14/2007CN1305123C Device for locating apparatus on substrate with no need of welding
03/14/2007CN1305122C Method for fabricating a power semiconductor device having a floating island voltage sustaining layer
03/14/2007CN1305121C Schottky diode with high field breakdown and low reverse leakage current and manufacturing method
03/14/2007CN1305120C Metal pattern formation
03/14/2007CN1305119C Method and apparatus for forming film
03/14/2007CN1305118C Structural reinforcement porous and low k dielectric films by ILD posts
03/14/2007CN1305117C Selective metal oxide removal
03/14/2007CN1305116C Cutter and manufacturing method of semiconductor device
03/14/2007CN1305115C Magma flow control method and system utilizing compound control mode
03/14/2007CN1305114C Manufacturing method of semiconductor device
03/14/2007CN1305113C Gasifier and gasifying supply device
03/14/2007CN1305112C Method for fabricating semiconductor device
03/14/2007CN1305111C Non-lithographic printing method for producing self-alignment mask, produced products and compsns, for such products
03/14/2007CN1305110C Direct bonding method for silicon sheet at low temperature
03/14/2007CN1305109C Metal element, semiconductor device, electronic device and electronic equipment and its manufacturing method
03/14/2007CN1305108C Bonding of light emitting diodes having shaped substrates and collets for bonding of light emitting diodes having shaped substrates
03/14/2007CN1305107C Semiconductor circuit and its manufacturing method
03/14/2007CN1305100C Method of measuring performance of scanning electron microscope
03/14/2007CN1305094C Manufacturing method of electronic source substrate
03/14/2007CN1304994C Performable two-layer/three-layer exchanger and router chip and establishment method
03/14/2007CN1304904C Method of using an amorphous carbon layer for reticle fabrication
03/14/2007CN1304896C Fabrication method of thin film transistor liquid crystal display panel
03/14/2007CN1304886C Thin film semiconductor device, electrooptical device, its mfg. method and electronic device
03/14/2007CN1304647C Silicon single crystal wafer and epitaxial wafer, and method for producing silicon single crystal
03/14/2007CN1304517C Adhesive composition, circuit connection material, joint stucture of circuit parts and semiconductor device
03/14/2007CN1304509C Adhesive sheet for dicing
03/14/2007CN1304254C Protective shipper
03/14/2007CN1304253C System for preventing improper insertion of foup door into foup
03/14/2007CN1304247C Substrate accommodating tray pallet and substrate transfer system
03/14/2007CN1304127C Electro-optical component including a fluorinated poly (phenylene ether ketone) protective coating and related methods
03/13/2007USRE39518 Run to run control process for controlling critical dimensions
03/13/2007US7191421 Integrated circuit design apparatus, method and program evaluating condition of functional blocks, assigned to virtual placement regions in each of lower-and higher-rank mounting blocks
03/13/2007US7191420 Net/wiring selection method, net selection method, wiring selection method, and delay improvement method
03/13/2007US7191082 Method of inspecting substrate processing apparatus, and storage medium storing inspection program for executing the method
03/13/2007US7190889 Non-contact heater and method for non-contact heating of a substrate for material deposition
03/13/2007US7190877 forming a silicon oxide layer on silicon substrates, then forming a germanium oxide layer on the silicon oxide layer and altering the germanium oxide layer into a germanium dioxide layer and/or germanium nanostructure agglomerates; semiconductors
03/13/2007US7190862 Methods and apparatus for optical switching using electrically movable optical fibers
03/13/2007US7190760 Method for adjusting gap between two objects and exposure method using the same, gap adjusting apparatus, and exposure apparatus
03/13/2007US7190627 Semiconductor device
03/13/2007US7190623 Non-volatile memory cell and method of operating the same
03/13/2007US7190613 Magnetic random access memory device having thermal agitation property and high write efficiency
03/13/2007US7190610 Latch-up prevention for memory cells
03/13/2007US7190609 Semiconductor memory device with memory cells operated by boosted voltage
03/13/2007US7190593 Semiconductor integrated circuit device
03/13/2007US7190567 Capacitor and its manufacturing method, and semiconductor device
03/13/2007US7190458 Use of scanning beam for differential evaluation of adjacent regions for change in reflectivity
03/13/2007US7190456 Alignment method, alignment apparatus, exposure apparatus using the same, and device manufactured by using the same
03/13/2007US7190455 Alignment method and apparatus and exposure apparatus
03/13/2007US7190448 Surface inspecting apparatus
03/13/2007US7190447 Double sided optical inspection of thin film disks or wafers
03/13/2007US7190446 System for processing electronic devices
03/13/2007US7190438 Near-field exposure apparatus and near-field exposure photomask
03/13/2007US7190436 Illumination apparatus and exposure apparatus
03/13/2007US7190435 Pattern writing apparatus and pattern writing method
03/13/2007US7190434 Lithographic apparatus and device manufacturing method
03/13/2007US7190420 Display device
03/13/2007US7190419 Liquid crystal display device and method of fabricating the same
03/13/2007US7190400 Charge multiplier with logarithmic dynamic range compression implemented in charge domain
03/13/2007US7190338 Data signal line drive circuit, drive circuit, image display device incorporating the same, and electronic apparatus using the same
03/13/2007US7190250 Encapsulation with oxide bond to borosilicate mixture
03/13/2007US7190184 Systems for wafer level burn-in of electronic devices
03/13/2007US7190181 Probe station having multiple enclosures
03/13/2007US7190119 Methods and apparatus for optimizing a substrate in a plasma processing system
03/13/2007US7190115 Display device having sealing film
03/13/2007US7190103 Matching circuit for megasonic transducer device
03/13/2007US7190082 Low stress flip-chip package for low-K silicon technology
03/13/2007US7190081 Mold gates and tape substrates including the mold gates
03/13/2007US7190079 Selective capping of copper wiring
03/13/2007US7190076 Electrode for p-type Group III nitride compound semiconductor layer and method for producing the same
03/13/2007US7190075 Method of forming smooth polycrystalline silicon electrodes for molecular electronic devices
03/13/2007US7190074 Reconstructed semiconductor wafers including alignment droplets contacting alignment vias
03/13/2007US7190073 Circuit film with bump, film package using the same, and related fabrication methods
03/13/2007US7190072 RFID-chip having RFID-tag or magnifying electrode
03/13/2007US7190071 Semiconductor package and method for fabricating the same
03/13/2007US7190068 Bottom heat spreader
03/13/2007US7190067 Semiconductor package with exposed heat sink and the heat sink thereof
03/13/2007US7190065 Circuit substrate, semiconductor module and method of manufacturing circuit substrate
03/13/2007US7190064 Semiconductor device and method of manufacturing the same
03/13/2007US7190059 Electronic component with a stack of semiconductor chips and a method for producing the electronic component
03/13/2007US7190058 Spacer die structure and method for attaching
03/13/2007US7190056 Thermally enhanced component interposer: finger and net structures
03/13/2007US7190052 Semiconductor devices with oxide coatings selectively positioned over exposed features including semiconductor material
03/13/2007US7190051 Chip level hermetic and biocompatible electronics package using SOI wafers
03/13/2007US7190049 Coupling the self-assembly of copolymers, in thin films with subsequent chemical modification to remove one component of the copolymer; magnetic storage media, magnetoresistance devices
03/13/2007US7190047 Transistors and methods for making the same
03/13/2007US7190046 Bipolar transistor having reduced collector-base capacitance
03/13/2007US7190045 Semiconductor device and method for fabricating the same
03/13/2007US7190043 Techniques to create low K ILD for beol
03/13/2007US7190042 Self-aligned STI for narrow trenches
03/13/2007US7190041 Well for CMOS imager
03/13/2007US7190040 Semiconductor device and method of manufacturing same
03/13/2007US7190037 Integrated transistor devices
03/13/2007US7190036 Transistor mobility improvement by adjusting stress in shallow trench isolation
03/13/2007US7190035 Semiconductor device having elevated source/drain on source region and drain region
03/13/2007US7190034 Semiconductor device capable of avoiding latchup breakdown resulting from negative variation of floating offset voltage
03/13/2007US7190033 CMOS device and method of manufacture
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