Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2007
03/22/2007WO2007032897A2 Semiconductor device having a p-mos transistor with source-drain extension counter-doping
03/22/2007WO2007032802A2 Nanorod arrays formed by ion beam implantation
03/22/2007WO2007032674A1 Method and device for cleaning electronic components processed with a laser beam
03/22/2007WO2007032615A1 Plasma treatment apparatus and method using dual frequencies
03/22/2007WO2007032598A1 Methods for fabricating zno nanostructure and devices thereof
03/22/2007WO2007032563A1 Wiring structure and semiconductor device and production methods thereof
03/22/2007WO2007032530A1 Carrying mechanism, carrying device, and vacuum treatment device
03/22/2007WO2007032519A1 Polishing method and polishing apparatus, and program for controlling polishing apparatus
03/22/2007WO2007032517A1 Polishing platen and polishing apparatus
03/22/2007WO2007032456A1 Semiconductor devices and method of testing same
03/22/2007WO2007032414A1 Cleaning member, substrate cleaning apparatus and substrate processing apparatus
03/22/2007WO2007032379A1 Method and apparatus for manufacturing magnetoresistive device
03/22/2007WO2007032372A1 Substrate-processing apparatus, substrate-processing method, substrate-processing program, and computer-readable recording medium recorded with such program
03/22/2007WO2007032370A1 Substrate-processing apparatus, substrate-processing method, substrate-processing program, and computer-readable recording medium recorded with such program
03/22/2007WO2007032369A1 Substrate-processing apparatus, substrate-processing method, substrate-processing program, and computer-readable recording medium recorded with such program
03/22/2007WO2007032322A1 Laser annealing method and device
03/22/2007WO2007032282A1 Nonvolatile semiconductor memory element having excellent charge retention properties and process for producing the same
03/22/2007WO2007032261A1 Method for forming porous insulating film and semiconductor device
03/22/2007WO2007032257A1 Magnetic random access memory waveform shaping circuit
03/22/2007WO2007032241A1 Microparticle-protein complex, method for production of the complex, semiconductor device, and fluorescent labeling method
03/22/2007WO2007032214A1 Process for producing silicon carbide semiconductor device
03/22/2007WO2007032195A1 Pattern forming material, pattern forming apparatus and pattern forming process
03/22/2007WO2007032184A1 Semiconductor device, semiconductor chip, method for testing wiring between chips and method for switching wiring between chips
03/22/2007WO2007032181A1 Negative resist composition and method of resist pattern formation
03/22/2007WO2007032180A1 Process for producing epitaxial wafer and epitaxial wafer produced therefrom
03/22/2007WO2007032166A1 Deposition preventing plate for film forming apparatus, and film forming apparatus
03/22/2007WO2007032165A1 Semiconductor device and fabrication method thereof
03/22/2007WO2007032151A1 Aluminum paste composition and solar cell element making use of the same
03/22/2007WO2007032149A1 High-frequency device using magnetic multi-layer film dot
03/22/2007WO2007032146A1 Fluid controller
03/22/2007WO2007032128A1 Thin film transistor
03/22/2007WO2007032086A1 Apparatus for producing electronic device such as display device, process for producing electronic device such as display device, and electronic device such as display device
03/22/2007WO2007032067A1 Semiconductor device and its fabrication method
03/22/2007WO2007032061A1 Manufacturing system, manufacturing method, management device, managing method, and program
03/22/2007WO2007032057A1 Process for producing semiconductor device and semiconductor producing apparatus
03/22/2007WO2007032053A1 Reaction gas supply apparatus and semiconductor production apparatus
03/22/2007WO2007031920A1 A method of and an apparatus for processing a substrate
03/22/2007WO2007031778A1 A method of etching a feature in a silicone substrate
03/22/2007WO2007031644A1 Device for encapsulating a plurality of electronic identification tags
03/22/2007WO2007031395A1 Integration of a mim capacitor over a metal gate or silicide with high-k dielectric materials
03/22/2007WO2007031298A1 Flip-chip module and method for the production thereof
03/22/2007WO2007031209A1 Method for recrystallising layer structures of by zone melting, device for carrying out said mehtod and the use thereof
03/22/2007WO2007031105A1 Alignment method with compensation of non linear errors
03/22/2007WO2007030941A1 Repeatable heat-treating methods and apparatus
03/22/2007WO2007030918A1 High sensitivity electron beam resist processing
03/22/2007WO2007015474A8 Magnetic memory
03/22/2007WO2007008901A3 Method of plasma etching transition metals and their compounds
03/22/2007WO2007001977A3 Systems and methods for roll-to-roll patterning
03/22/2007WO2006127463A3 Method to increase tensile stress of silicon nitride films by using a post pecvd deposition uv cure
03/22/2007WO2006124683A3 Modular terminal for high-throughput amhs
03/22/2007WO2006115812A3 Method and system for debugging using replicated logic and trigger logic
03/22/2007WO2006112949A3 Structure for stacking an integrated circuit on another integrated circuit
03/22/2007WO2006110511A3 GaN-BASED HIGH ELECTRON MOBILITY TRANSISTOR AND METHOD FOR MAKING THE SAME
03/22/2007WO2006087679A3 Embedded dram with increased capacitance and method of manufacturing same
03/22/2007WO2006065740A3 Self-cooling gas delivery apparatus under high vacuum for high density plasma applications
03/22/2007WO2006055346A3 Ultraviolet assisted pore sealing of porous low k dielectric films
03/22/2007WO2005083751A3 Semiconductor device and method using nanotube contacts
03/22/2007WO2005013331A3 Supercritical fluid-assisted deposition of materials on semiconductor substrates
03/22/2007WO2005008450A3 Method and apparatus for nanogap device and array
03/22/2007WO2005001922A9 Floating gate structures with vertical projections
03/22/2007US20070067752 Method for verifying optical proximity correction using layer versus layer comparison
03/22/2007US20070067601 Semiconductor device
03/22/2007US20070067131 Defect analyzer
03/22/2007US20070067064 Surface level control systems and material recycling systems for use with programmable material consolidation apparatus
03/22/2007US20070067056 Method for optimizing an industrial product, system for optimizing an industrial product and method for manufacturing an industrial product
03/22/2007US20070066741 High glass transition temperature thermoplastic articles
03/22/2007US20070066367 Method and arrangement for repairing memory chips using microlithography methods
03/22/2007US20070066200 Perforation and grooving for polishing articles
03/22/2007US20070066196 Method of forming a stacked polishing pad using laser ablation
03/22/2007US20070066189 Off-line tool for breaking in multiple pad conditioning disks used in a chemical mechanical polishing system
03/22/2007US20070066184 Surface-protecting sheet and semiconductor wafer lapping method
03/22/2007US20070066087 Method of manufacturing a semiconductor device
03/22/2007US20070066086 Method of forming silicon-containing insulation film having low dielectric constant and low film stress
03/22/2007US20070066085 Method of fabricating dielectric layer
03/22/2007US20070066084 Method and system for forming a layer with controllable spstial variation
03/22/2007US20070066083 Method of forming a silicon-rich nanocrystalline structure by an atomic layer deposition process and method of manufacturing a non-volatile semiconductor device using the same
03/22/2007US20070066082 Epitaxially coated silicon wafer and method for producing epitaxially coated silicon wafer
03/22/2007US20070066081 Catalytic activation technique for electroless metallization of interconnects
03/22/2007US20070066080 Method of producing a substrate having areas of different hydrophilicity and/or oleophilicity on the same surface
03/22/2007US20070066079 Sealing porous dielectrics with silane coupling reagents
03/22/2007US20070066078 Method of producing a substrate having areas of different hydrophilicity and/or oleophilicity on the same surface
03/22/2007US20070066077 Method for manufacturing semiconductor device
03/22/2007US20070066076 Substrate processing method and apparatus using a combustion flame
03/22/2007US20070066075 Semiconductor manufacturing method
03/22/2007US20070066074 Shallow trench isolation structures and a method for forming shallow trench isolation structures
03/22/2007US20070066073 Like integrated circuit devices with different depth
03/22/2007US20070066072 Method of fabricating semiconductor device
03/22/2007US20070066071 Novel organic remover for advanced reticle contamination cleaning
03/22/2007US20070066070 Apparatus for imprinting lithography and fabrication thereof
03/22/2007US20070066069 Radiation-Resistant Zone Plates and Methods of Manufacturing Thereof
03/22/2007US20070066068 Method of depositing a layer comprising silicon, carbon, and flourine onto a semiconductor substrate
03/22/2007US20070066067 Method for reducing foreign material concentrations in etch chambers
03/22/2007US20070066066 Polishing method for glass substrate, and glass substrate
03/22/2007US20070066065 Metal-polishing liquid and chemical-mechanical polishing method
03/22/2007US20070066064 Methods to avoid unstable plasma states during a process transition
03/22/2007US20070066063 Method for chemical mechanical planarization of a metal layer located over a photoresist layer and a method for manufacturing a micro pixel array using the same
03/22/2007US20070066062 Landing uniformity ring for etch chamber
03/22/2007US20070066061 Organic aluminum precursor and method of forming a metal wire using the same
03/22/2007US20070066060 Semiconductor devices and fabrication methods thereof
03/22/2007US20070066059 Defectivity and process control of electroless deposition in microelectronics applications
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