Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2007
03/15/2007DE102006038532A1 Halbleiter-Speicherzellenfeld mit selbstjustierenden rückgeätzten Gate-MOS-Transistoren und Verfahren zu dessen Herstellung Semiconductor memory cell array with self-aligned etched-back gate MOS transistors and a process for its preparation
03/15/2007DE102006030360A1 Verfahren und Vorrichtung zum selektiven Zugreifen auf und zum Konfigurieren von einzelnen Chips eines Halbleiterwafers Method and apparatus for selectively accessing and configuring individual chips of a semiconductor wafer
03/15/2007DE102006012772A1 Halbleiterspeicherbauelement mit dielektrischer Struktur und Verfahren zur Herstellung desselben The same semiconductor memory device having a dielectric structure and methods for preparing
03/15/2007DE102005063094A1 Metallleitung für eine Halbleiter-Vorrichtung und Herstellung derselben Metal line for a semiconductor device and manufacturing the same
03/15/2007DE102005052358A1 Verfahren zum lateralen Zertrennen eines Halbleiterwafers und optoelektronisches Bauelement A method for laterally dividing a semiconductor wafer and optoelectronic component
03/15/2007DE102005052357A1 Verfahren zum lateralen Zertrennen eines Halbleiterwafers und optoelektronisches Bauelement A method for laterally dividing a semiconductor wafer and optoelectronic component
03/15/2007DE102005048237B3 Precision positioner for head of instrument testing semiconductor components, includes arm swinging about axis, carrying head in holder turned about further axis
03/15/2007DE102005043910A1 Flip-chip module comprises a semiconductor chip having contact columns on a surface, a substrate with contact sites joined to the free ends of the contact columns and a rigid spacer arranged between the substrate and chip
03/15/2007DE102005043657A1 Chip module with encapsulated chip such as for chip cards encapsulated with a material having two polymer components resistant to different chemical bonds
03/15/2007DE102005043303A1 Verfahren zur Rekristallisierung von Schichtstrukturen mittels Zonenschmelzen, hierfür verwendete Vorrichtung und dessen Verwendung Method for recrystallization of layer structures by zone melting, used for this device and its use
03/15/2007DE102005043270A1 Device and production method for temperature monitoring of planar FET has ohmic measuring resistance and temperature sensor separated from substrate surface by an isolation layer
03/15/2007DE102005042769A1 Method for correcting the shape of a thinly polished wafer used during semiconductor manufacture comprises coating the water with a liquid after polishing, drying, hardening and applying tensile stress to the wafer by contraction
03/15/2007DE102005041464A1 Thermoden unit for joining and or electrically contacting many semiconductor elements with a common substrate or second element by warming adhesive under pressure has movable heating head and two heating plates
03/15/2007DE102005041358A1 Field plate trench transistor and production process has isolated field electrode structure connected to a voltage divider to set its potential between those of source and drain or gate and drain
03/15/2007DE102005041321A1 Trench semiconductor device has electrically isolated field electrode units in trench with different strength electrical coupling between adjacent pairs
03/15/2007DE102005041310B3 Technik zum Reduzieren von Siliziddefekten durch Verringern der nachteiligen Auswirkungen eines Teilchenbeschusses vor der Silizidierung Technique for reducing Siliziddefekten by reducing the adverse effects of particle bombardment prior to silicidation
03/15/2007DE102005040741A1 Bearbeitungsanlage modularen Aufbaus für flächige Substrate Processing plant modular structure for planar substrates
03/15/2007DE102005040494A1 Determining the damage to a component in a production step and integrated circuit arrangement has connected unit to assess the characteristics of integrated circuit after production stages
03/15/2007DE102005040010A1 Verfahren und Vorrichtung zur Ermittlung von Produktionsfehlern in einem Halbleiterbau-element Method and apparatus for determining production defects in a Halbleiterbau element
03/15/2007DE102005037573A1 Thyristor mit Freiwerdeschutz in Form eines Thyristorsystems und Verfahren zur Herstellung des Thyristorsystems Thyristor with free Become protection in the form of a Thyristorsystems and method for producing the Thyristorsystems
03/15/2007DE102005036821A1 Verfahren zum Transferieren und Vorrichtung zum Handhaben von elektronischen Bauelementen A method for transferring and apparatus for handling of electronic components
03/15/2007DE102004022402B4 Verfahren zum anisotropen Ätzen von aluminiumhaltigen Substraten A method for anisotropic etching of aluminum-containing substrates
03/15/2007DE10134900B4 Haltevorrichtung mit Diffusionssperrschicht für Halbleitereinrichtungen Holding device with a diffusion barrier layer for semiconductor devices
03/15/2007DE10117923B4 Halbleiterwaferschneidmaschine Semiconductor wafer cutting machine
03/15/2007DE10116791B4 "Verfahren zur Herstellung einer großen Anzahl von Halbleiterchip s aus einem Halbleiterwafer" "A process for producing a large number of semiconductor chip S from a semiconductor wafer"
03/15/2007DE10050044B4 Verfahren zur Herstellung eines Wolframpolycidgates mit einer durch einen schnellen thermischen Prozess erzeugten Nitridsperrschicht A method for producing a Wolframpolycidgates with a generated by a rapid thermal process Nitridsperrschicht
03/15/2007DE10005460B4 Mehrwert-Masken-Nurlesespeicher Value-mask read-only memory
03/15/2007CA2621505A1 3-dimensional multi-layered modular computer architecture
03/15/2007CA2621397A1 Method and system of using nanotube fabrics as joule heating elements for memories and other applications
03/15/2007CA2621074A1 Method for bonding titanium based mesh to a titanium based substrate
03/14/2007EP1763093A1 Piezoelectric element, liquid jetting head, and method for manufacturing thereof
03/14/2007EP1763085A2 Thin Film transistor having a channel surrounding a crystallisation seed point
03/14/2007EP1763080A2 Non-volatile memory device
03/14/2007EP1763079A1 Stackable semiconductor chip layer comprising prefabricated trench interconnect vias
03/14/2007EP1763075A1 Method for precision integrated circuit DIE singulation using differential etch rates
03/14/2007EP1763074A2 Isolation for Semiconductor Devices
03/14/2007EP1763073A2 Strained Semiconductor Device and Method of Making the Same
03/14/2007EP1763072A1 Substrate cleaning method and computer readable recording medium
03/14/2007EP1763071A1 GaAs SUBSTRATE CLEANING METHOD, GaAs SUBSTRATE MANUFACTURING METHOD, EPITAXIAL SUBSTRATE MANUFACTURING METHOD AND GaAs WAFER
03/14/2007EP1763070A1 Adhesive sheet for both dicing and die bonding and semiconductor device manufacturing method using the adhesive sheet
03/14/2007EP1763069A1 Semiconductor heterostructure and method for forming a semiconductor heterostructure
03/14/2007EP1763043A1 Inductive structure
03/14/2007EP1762898A2 Lithographic apparatus and device manufacturing method
03/14/2007EP1762338A1 Abrasive member and method for the resurfacing of a lapping plate
03/14/2007EP1761960A1 Reflective positive electrode and gallium nitride-based compound semiconductor light-emitting device using the same
03/14/2007EP1761952A1 Using different gate dielectrics with nmos and pmos transistors of a complementary metal oxide semiconductor integrated circuit
03/14/2007EP1761951A2 Lead solder indicator and method
03/14/2007EP1761950A2 Methods and apparatus for attaching a die to a substrate
03/14/2007EP1761949A2 Method of forming a recessed structure employing a reverse tone process
03/14/2007EP1761948A1 Methods for forming semiconductor wires and resulting devices
03/14/2007EP1761947A1 Method and apparatus for reducing aspect ratio dependent etching in time division multiplexed etch processes
03/14/2007EP1761946A2 Fabrication of interconnect structures
03/14/2007EP1761945A1 Fabrication of crystalline materials over substrates
03/14/2007EP1761831A2 Gate driver output stage with bias circuit for high and wide operating voltage range
03/14/2007EP1761823A1 Method of forming plated product using negative photoresist composition and photosensitive composition used therein
03/14/2007EP1761734A1 Capacitance sensing for substrate cooling
03/14/2007EP1761471A1 Process for polishing glass substrate
03/14/2007EP1711907A4 Method of automatically generating the structures from mask layout
03/14/2007EP1644968A4 Method of forming freestanding semiconductor layer
03/14/2007EP1518262A4 Reflection mirror apparatus, exposure apparatus and device manufacturing method
03/14/2007EP1451825B1 A matrix-addressable array of integrated transistor/memory structures
03/14/2007EP1434719A4 Disposable syringe dispenser system
03/14/2007EP1433196B1 Apparatus to prevent lateral oxidation in a transistor utilizing an ultra thin oxygen-diffusion barrier
03/14/2007EP1364221B1 Planarizing interposer
03/14/2007EP1360711B1 Semiconductor arrangement and method for etching a layer of said semiconductor arrangement using an etching mask containing silicon
03/14/2007EP1344245B1 Method for producing a solid body comprising a microstructure
03/14/2007EP1340251B1 Method of inspecting an anisotropic etch in a microstructure
03/14/2007EP1307916B1 A method of forming a backside contact for integrated circuits
03/14/2007EP1307320B1 Apparatus and method for chemical mechanical polishing of substrates
03/14/2007EP1295316B1 Integrated electronic hardware for wafer processing control and diagnostic
03/14/2007EP1287188B1 Epitaxial silicon wafer free from autodoping and backside halo
03/14/2007EP1243017B1 Linear drive system for use in a plasma processing system
03/14/2007EP1181720B1 Methods and apparatus for fabricating a multiple modular assembly
03/14/2007EP1163552B2 Method of forming a masking pattern on a surface
03/14/2007EP1069608B1 Wire bonding method, semiconductor device and wire bonding device
03/14/2007CN2879421Y Wafer carrying device and front-open wafer box
03/14/2007CN2879416Y Scanning type ion gun
03/14/2007CN2879196Y chip testing modular
03/14/2007CN1930928A Partially etched dielectric film with conductive features
03/14/2007CN1930927A A method of creating solder bar connections on electronic packages
03/14/2007CN1930689A Trench-gate transistors and their manufacture
03/14/2007CN1930688A Trench field effect transistor and method of making it
03/14/2007CN1930686A Semiconductor constructions having a buried bit line, and methods of forming same
03/14/2007CN1930685A Method of making a semiconductor device, and semiconductor device made thereby
03/14/2007CN1930683A Conductive material compositions, apparatus, systems, and methods
03/14/2007CN1930682A Various structure/height bumps for wafer level-chip scale package
03/14/2007CN1930678A 半导体器件 Semiconductor devices
03/14/2007CN1930677A Semiconductor integrated circuit device and switching power source device using the same
03/14/2007CN1930676A 半导体装置 Semiconductor device
03/14/2007CN1930675A Limited thermal budget formation of PMD layers
03/14/2007CN1930674A Heat treatment for improving the quality of a taken thin layer
03/14/2007CN1930673A Turning device for heavy object
03/14/2007CN1930672A Under bump metallization layer to enable use of high tin content solder bumps
03/14/2007CN1930671A Tri-gate transistors and methods to fabricate same
03/14/2007CN1930670A Method of depositing an amorphous carbon film for metal etch hardmask application
03/14/2007CN1930669A Plasma treatment to improve adhesion of low k dielectrics
03/14/2007CN1930668A Method of modifying insulating film
03/14/2007CN1930667A Substrate processing equipment
03/14/2007CN1930666A Two-fluid nozzle for cleaning substrates and substrate cleaning device
03/14/2007CN1930665A Semiconductor device cleaning member and manufacturing method thereof
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