Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2007
03/22/2007US20070065955 Perpendicular magnetic recording medium, manufacturing method therefor, and magnetic read/write apparatus using the same
03/22/2007US20070065822 Substrates for spatially selective micron and nanometer scale deposition and combinatorial modification and fabrication
03/22/2007US20070065760 Substrate processing apparatus and substrate processing method
03/22/2007US20070065748 Resin for photoresist composition, photoresist composition and method for forming resist pattern
03/22/2007US20070065734 Exposure method, exposure mask, and exposure apparatus
03/22/2007US20070065730 Photomask and pattern formation method and mask data generation method using the same
03/22/2007US20070065678 Electro-static chuck with non-sintered aln and a method of preparing the same
03/22/2007US20070065671 Two layer lto temperature oxide backside seal for a wafer
03/22/2007US20070065653 Substrate sheet material for a semiconductor device and a manufacturing method thereof, a molding method using a substrate sheet material, a manufacturing method of semiconductor devices
03/22/2007US20070065647 Hot pressing ceramic distortion control
03/22/2007US20070065599 Method and apparatus for chemical vapor deposition capable of preventing contamination and enhancing film growth rate
03/22/2007US20070065581 Substrate processing system and method
03/22/2007US20070065575 Method for in situ photoresist thickness characterization
03/22/2007US20070065145 Development apparatus and development method
03/22/2007US20070064997 Mask defect inspecting method, mask defect inspecting apparatus, and semiconductor device manufacturing method
03/22/2007US20070064498 Flash memory devices including multiple dummy cell array regions
03/22/2007US20070064476 Semicoductor circuit, inverter circuit, semiconductor apparatus, and manufacturing method thereof
03/22/2007US20070064399 Flip chip heat sink package and method
03/22/2007US20070064395 Cooling system for a semiconductor device and method of fabricating same
03/22/2007US20070064223 Pattern inspection apparatus
03/22/2007US20070063740 Nanotube-based switching elements and logic circuits
03/22/2007US20070063725 Inspection method and inspection apparatus for inspecting electrical characteristics of inspection object
03/22/2007US20070063646 Electro-optical device and electronic device
03/22/2007US20070063645 Laminated structure, display device, and display unit empolying same
03/22/2007US20070063590 Process system and device for transporting substrates
03/22/2007US20070063453 Vacuum chuck and suction board
03/22/2007US20070063356 Method of fabricating SRAM device
03/22/2007US20070063350 Semiconductor device and method for designing same
03/22/2007US20070063349 Interconnect structure and method of manufacturing the same
03/22/2007US20070063348 Method and structure of forming an interconnect including a dielectric cap having a tensile stress
03/22/2007US20070063346 Display device and manufacturing method of the same
03/22/2007US20070063344 Chip package structure and bumping process
03/22/2007US20070063343 Substrate for semiconductor device and semiconductor device
03/22/2007US20070063335 Packaged microelectronic devices with interconnecting units and methods for manufacturing and using the interconnecting units
03/22/2007US20070063328 Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
03/22/2007US20070063327 Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
03/22/2007US20070063326 Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
03/22/2007US20070063325 Chip package structure and bumping process
03/22/2007US20070063319 Film stack and method for fabricating the same
03/22/2007US20070063317 Overlay key, method of forming the overlay key, semiconductor device including the overlay key and method of manufacturing the semiconductor device
03/22/2007US20070063315 Semiconductor integrated circuit device and process for manufacturing the same
03/22/2007US20070063308 Integrated circuit with partly silicidated silicon layer
03/22/2007US20070063294 Semiconductor Device Having a Fully Silicided Gate Electrode and Method of Manufacture Therefor
03/22/2007US20070063291 Semiconductor device with dummy electrode
03/22/2007US20070063290 Metal oxide semiconductor transistor
03/22/2007US20070063289 Semiconductor circuit device and display data line driver
03/22/2007US20070063283 Thin film transistor, liquid crystal display using thin film transistor, and method of manufacturing thin film transistor
03/22/2007US20070063282 SOI-like structures in a bulk semiconductor substrate
03/22/2007US20070063281 Semiconductor device and manufacturing method thereof, SOI substrate and display device using the same, and manufacturing method of the SOI substrate
03/22/2007US20070063279 Insulation layer for silicon-on-insulator wafer
03/22/2007US20070063276 DENSE CHEVRON finFET AND METHOD OF MANUFACTURING SAME
03/22/2007US20070063275 Semiconductor device and method for fabricating the same
03/22/2007US20070063273 Semiconductor device and method for manufacturing the same
03/22/2007US20070063267 Self aligned 1 bit local SONOS memory cell
03/22/2007US20070063263 Non-volatile memory devices and method for forming the same
03/22/2007US20070063262 NAND memory arrays
03/22/2007US20070063261 Necked Finfet device
03/22/2007US20070063260 Floating gate and fabricating method thereof
03/22/2007US20070063259 Floating-gate memory cell
03/22/2007US20070063258 Isolation trenches for memory devices
03/22/2007US20070063257 Nonvolatile memory devices including high-voltage MOS transistors with floated drain-side auxiliary gates and methods of fabricating the same
03/22/2007US20070063256 Nonvolatile semiconductor memory device, semiconductor device and method of manufacturing nonvolatile semiconductor memory device
03/22/2007US20070063255 Non-volatile memory device and method of manufacturing the same
03/22/2007US20070063253 Semiconductor device and method of manufacturing the same
03/22/2007US20070063248 High write and erase efficiency embedded flash cell
03/22/2007US20070063246 Solid capacitor and manufacturing method thereof
03/22/2007US20070063245 Metal plating using seed film
03/22/2007US20070063244 Trench metal-insulator-metal (mim) capacitors and method of fabricating same
03/22/2007US20070063241 Semiconductor device and method for fabricating the same
03/22/2007US20070063234 Solid-state imaging device, production method thereof and camera
03/22/2007US20070063229 Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
03/22/2007US20070063227 Transistor and cvd apparatus used to deposit gate insulating film thereof
03/22/2007US20070063225 Semiconductor device, and method for manufacturing semiconductor device
03/22/2007US20070063223 Semiconductor device having pattern-dummy and method for manufacturing the same using pattern-dummy
03/22/2007US20070063222 Semiconductor device and method for manufacturing the same
03/22/2007US20070063219 Voltage tunable integrated infrared imager
03/22/2007US20070063215 Manufacturing method for nitride semiconductor device and nitride semiconductor light emitting device obtained with the same
03/22/2007US20070063211 Thin-film transistor and thin-film diode having amorphous-oxide semiconductor layer
03/22/2007US20070063203 Semiconductor integrated circuit device with protection capability for protection circuits from static electrical charge
03/22/2007US20070063201 Optical module having a lens formed without contacting a reflector and method of making the same
03/22/2007US20070063200 Sequential lateral solidification device and method of crystallizing silicon using the same
03/22/2007US20070063199 Semiconductor apparatus having semiconductor circuits made of semiconductor devices, and method of manufacture thereof
03/22/2007US20070063198 Semiconductor device
03/22/2007US20070063149 Positioning device and method of initializing a positioning device
03/22/2007US20070062910 Complex CMP process and fabricating methods of STI structure and interconnect structure
03/22/2007US20070062648 Electrostatic chuck, thin film manufacturing apparatus having the same, thin film manufacturing method, and substrate surface treatment method
03/22/2007US20070062647 Method and apparatus for isolative substrate edge area processing
03/22/2007US20070062646 Method and apparatus for processing substrates
03/22/2007US20070062645 Processing apparatus
03/22/2007US20070062637 Electromagnetic shielding of laminate packages
03/22/2007US20070062575 Solar Cell and Process for Producing the Same
03/22/2007US20070062511 Group encapsulated dicing chuck
03/22/2007US20070062465 Methods of operating a liquid vaporizer
03/22/2007US20070062454 Method for dechucking a substrate
03/22/2007US20070062453 Substrate processing method, computer readable recording medium and substrate processing apparatus
03/22/2007US20070062452 Coil and coil support for generating a plasma
03/22/2007US20070062437 Control of ice-crystal growth by non-proteinaceous substance
03/22/2007US20070062408 Composition comprising source of deposition ions selected from cobalt and nickel ions, reducing agent for reducing deposition ions onto substrate, and stabilizer comprising molybdenum oxide; for electrolessly depositing cobalt, nickel or alloys thereof onto substrate in manufacture of microelectronics
03/22/2007US20070062283 A method for fabricating a tuning fork gyroscope
03/22/2007US20070062280 Method for manufacturing a mass-spring system
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