Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2007
03/08/2007US20070052022 Thin film transistor, method of fabricating the same, and a display device including the thin film transistor
03/08/2007US20070052021 Transistor, and display device, electronic device, and semiconductor device using the same
03/08/2007US20070052019 Transistor device wiwth metallic electrodes and a method for use in forming such a device
03/08/2007US20070052016 Semiconductor device and manufacturing method thereof
03/08/2007US20070052014 Trench semiconductor device of improved voltage strength, and method of fabrication
03/08/2007US20070052012 Vertical tunneling nano-wire transistor
03/08/2007US20070052011 Scalable multi-functional and multi-level nano-crystal non-volatile memory device
03/08/2007US20070052010 Memory cell and method for manufacturing the same
03/08/2007US20070052008 Memory structure with high coupling ratio
03/08/2007US20070052003 Method for producing a memory with high coupling ratio
03/08/2007US20070051997 Semiconductor memory device
03/08/2007US20070051991 CMOS image sensor and method for fabricating the same
03/08/2007US20070051982 Dense non-volatile memory array and method of fabrication
03/08/2007US20070051980 SILICON GERMANIUM (SiGe) HETEROJUNCTION BIPOLAR TRANSISTOR (HBT)
03/08/2007US20070051977 Nitride semiconductor device
03/08/2007US20070051969 Group III-V nitride-based semiconductor substrate and method of making same
03/08/2007US20070051968 Nitride-based semiconductor light-emitting device and method of manufacturing the same
03/08/2007US20070051964 High density led array
03/08/2007US20070051963 Semiconductor light source
03/08/2007US20070051961 Nitride semiconductor light-emitting device
03/08/2007US20070051958 Display device and method for manufacturing the same, and television receiver
03/08/2007US20070051957 Semiconductor device and its manufacturing method
03/08/2007US20070051955 Thin film transistor array substrate and manufacturing method of the same
03/08/2007US20070051952 Liquid crystal display device and method for manufacturing the same, and liquid crystal television receiver
03/08/2007US20070051950 Method for generating test patterns utilized in manufacturing semiconductor device
03/08/2007US20070051942 Etch masks based on template-assembled nanoclusters
03/08/2007US20070051918 aqueous acid suspension of individualized colloidal silica particles not linked to each other by siloxane bonds, and a surfactant; for mechanical chemical polishing
03/08/2007US20070051874 Method of manufacturing solid state imaging device, solid state imaging device, and camera using solid state imaging device
03/08/2007US20070051818 Semiconductor processing temperature control
03/08/2007US20070051698 Photoresist trimming process
03/08/2007US20070051696 Method for reducing critical dimension and semiconductor etching method
03/08/2007US20070051639 Work piece wetted with a low-conductivity fluid is contacted with a first side of a charge-selective ion-conducting membrane,the second side of which contacts a conductive electrolyte solution in electrical contact with a cathode; can be used for both pure metals and alloys
03/08/2007US20070051638 Electropolishing liquid, electropolishing method, and method for fabricating semiconductor device
03/08/2007US20070051632 Polishing method, polishing apparatus, plating method, and plating apparatus
03/08/2007US20070051619 Apparatus adapted for membrane-mediated electropolishing
03/08/2007US20070051472 Ring-shaped component for use in a plasma processing, plasma processing apparatus and outer ring-shaped member
03/08/2007US20070051470 Plasma processing apparatus and method
03/08/2007US20070051312 Perimeter partition-valve with protected seals and associated small size process chambers and multiple chamber systems
03/08/2007US20070051306 Spatially-arranged chemical processing station
03/08/2007US20070051302 Method of producing crystalline semiconductor material and method of fabricating semiconductor device
03/08/2007US20070051299 Non-contact etch annealing of strained layers
03/08/2007DE19947117B4 Ferroelektrischer Transistor und dessen Verwendung in einer Speicherzellenanordnung Ferroelectric transistor and its use in a memory cell arrangement
03/08/2007DE19924212B4 Verfahren zum Bonden von Leitern, insbesondere Beam Leads A method for bonding conductors, in particular Beam leads
03/08/2007DE19823069B4 Halbleiterbauelement Semiconductor device
03/08/2007DE19807739B4 Kombinierter Integrierter Speicher- und Logikschaltkreis und Testverfahren hierfür Combined Integrated memory and logic circuit and test method therefor
03/08/2007DE19800633B4 Verfahren und Vorrichtung unter Verwendung eines ArF Photoresists Method and apparatus using an ArF photoresists
03/08/2007DE19702110B4 Siliziumkarbid-Halbleiterbauelement und Verfahren zu dessen Herstellung Silicon carbide semiconductor device and process for its preparation
03/08/2007DE112005001008T5 Verfahren und Vorrichtung zum Wortleitungsschutz in Flash-Speichereinrichtungen Method and apparatus for wordline protection in flash memory devices
03/08/2007DE112004000727T9 Bandverbindung Band connection
03/08/2007DE10362018B4 Anordnung und Verfahren zur Herstellung von vertikalen Transistorzellen und transistorgesteuerten Speicherzellen Arrangement and method for the production of vertical transistor cells and transistor-controlled memory cells
03/08/2007DE10341046B4 Vakuumsaugvorrichtung und Betriebsverfahren hierfür Vacuum suction device and operating method therefor
03/08/2007DE10330003B4 Vorrichtung, Verfahren und Computerprogramm zur Wafer-Inspektion Apparatus, method and computer program for wafer inspection
03/08/2007DE10318078B4 Verfahren zum Schutz einer Umverdrahtung auf Wafern/Chips A method of protecting a rewiring on wafers / chips
03/08/2007DE10303683B4 Verfahren zum Verringern der durch Kontamination hervorgerufenen Prozessfluktuationen während des Ionenimplantierens A method of reducing the contamination caused by process fluctuations during the ion implanting
03/08/2007DE10248205B4 Ohmsche Kontaktanordnung und Herstellverfahren Ohmic contact assembly and manufacturing
03/08/2007DE10238024B4 Verfahren zur Integration von Luft als Dielektrikum in Halbleitervorrichtungen A process for integration of air as a dielectric in semiconductor devices
03/08/2007DE10205077B4 Halbleiterspeicherzelle mit einem Graben und einem planaren Auswahltransistor und Verfahren zu ihrer Herstellung A semiconductor memory cell having a trench and a planar select transistor and processes for their preparation
03/08/2007DE102006039733A1 Kreuzgekoppeltes Induktorpaar, das in einer integrierten Schaltung gebildet ist Cross-coupled inductor pair formed in an integrated circuit
03/08/2007DE102006033919A1 Polierzusammensetzung und Polierverfahren Polishing composition and polishing method
03/08/2007DE102006004396B3 Removing deposition layer from low-density refractory metal during semiconductor device manufacture, using high-concentration ozonized sulfuric acid
03/08/2007DE102005042524A1 Verfahren zur Herstellung von Stapelkondensatoren für dynamische Speicherzellen Process for the preparation of stacked capacitors for dynamic memory cells
03/08/2007DE102005042074A1 Verfahren zur Erzeugung von Durchkontaktierungen in Halbleiterwafern A process for producing through-contacts in semiconductor wafers
03/08/2007DE102005042071A1 Verfahren zum Herstellen einer Halbleiterstruktur A method of fabricating a semiconductor structure
03/08/2007DE102005041879A1 Fabrication method for IGBT, has insulation layer between body-zone and drift zone
03/08/2007DE102005041877A1 Verfahren zur Herstellung siliziumhaltiger Oberflächen und optoelektronische Bauelemente Process for the preparation of silicon surfaces and optoelectronic devices
03/08/2007DE102005035728B3 Verfahren zum Reduzieren der Kontamination durch Entfernung eines Zwischenschichtdielektrikums von dem Substratrand A method for reducing the contamination by removal of one interlayer of the substrate edge
03/08/2007DE102005015502B4 Verfahren zum Ätzen von Vertiefungen in ein Siliziumsubstrat A method of etching depressions in a silicon substrate
03/08/2007DE102004041888B4 Herstellungsverfahren für eine Halbleitervorrichtung mit gestapelten Halbleiterbauelementen Manufacturing method of a semiconductor device with stacked semiconductor devices
03/08/2007DE102004023805B4 Herstellungsverfahren für eine Halbleiterstruktur mit integrierten Kondensatoren und entsprechende Halbleiterstruktur Manufacturing method of a semiconductor structure with integrated capacitors and corresponding semiconductor structure
03/08/2007DE10056645B4 Verfahren zur Herstellung von rißfreien, planaren Gruppe-III-N,Gruppe III-VN und Metall-Stickstoff Bauelementestrukturen auf Si-Substraten mittels epitaktischer Methoden A process for preparing crack-free, planar Group III-N, group III-VN, and metal-nitrogen device structures on Si substrates by means of epitaxial methods
03/08/2007DE10042123B4 Vorrichtung zur Durchführung von optischen Messungen an einer Probe in einer Vakuumkammer Device for carrying out optical measurements on a sample in a vacuum chamber
03/08/2007DE10027914B4 Bauelement mit einem Transistor Component having a transistor
03/07/2007EP1761116A2 Circuit board having electronic parts mounted thereon by using under-fill material and method for producing the same
03/07/2007EP1760889A2 High speed input circuit
03/07/2007EP1760797A1 Electrically programmable memory element with improved contacts
03/07/2007EP1760792A1 Nanodot memory and fabrication method thereof
03/07/2007EP1760786A2 Single-poly EEPROM cell with lightly doped MOS capacitors
03/07/2007EP1760782A2 Semiconductor device and method of manufacturing the same
03/07/2007EP1760779A1 Electronic part and method of manufacturing the same
03/07/2007EP1760777A2 Transistors and methods of manufacture thereof
03/07/2007EP1760776A2 Semiconductor device with flexible substrate and manufacturing method thereof
03/07/2007EP1760775A1 Semiconductor device with through electrode and method of manufacturing the same
03/07/2007EP1760774A1 Laminated body and semiconductor device
03/07/2007EP1760773A1 Sheet peeling device and method
03/07/2007EP1760772A1 Method of protecting a transistor gate and corresponding integrated circuit
03/07/2007EP1760771A1 Semiconductor device and method for fabricating the same
03/07/2007EP1760770A2 Complex oxide laminate, method of manufacturing complex oxide laminate, and device
03/07/2007EP1760769A1 Dry etching gases and method of dry etching
03/07/2007EP1760768A1 Insulating target material, method of manufacturing insulating target material, insulating complex oxide film, and devide
03/07/2007EP1760767A2 Method of producing a nitride semiconductor device and nitride semiconductor device
03/07/2007EP1760766A2 Antireflective film and exposure method
03/07/2007EP1760746A2 MEMS device having standoff bumps and folded component
03/07/2007EP1760736A1 Process of forming variable capacitor
03/07/2007EP1760598A2 Communication control apparatus, communication control method, exposure apparatus, and device manufacturing method
03/07/2007EP1760527A1 Photochemical method for manufacturing nanometrically surface-decorated substrates
03/07/2007EP1760519A2 High quality and ultra large screen liquid crystal display device and production method thereof
03/07/2007EP1760518A2 High quality and ultra large screen liquid crystal display device and production method thereof
03/07/2007EP1760127A2 Polishing method
03/07/2007EP1760058A1 Single crystal, material for nanowiring, electronic device, and process for producing material for nanowiring
03/07/2007EP1760036A1 MEMS device having contact and standoff bumps and related methods