Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2007
03/13/2007US7190032 Insulated gate transistor
03/13/2007US7190031 Semiconductor memory device and a method of manufacturing the same, a method of manufacturing a vertical MISFET and a vertical MISFET, and a method of manufacturing a semiconductor device and a semiconductor device
03/13/2007US7190029 Preventive treatment method for a multilayer semiconductor wafer
03/13/2007US7190028 Semiconductor-on-insulator constructions
03/13/2007US7190027 Semiconductor device having high withstand capacity and method for designing the same
03/13/2007US7190025 Array of pull-up transistors for high voltage output circuit
03/13/2007US7190024 Method of manufacturing a thin dielectric layer using a heat treatment and a semiconductor device formed using the method
03/13/2007US7190022 One transistor flash memory cell
03/13/2007US7190021 Non-volatile memory device having improved programming and erasing characteristics and method of fabricating the same
03/13/2007US7190019 Integrated circuits with openings that allow electrical contact to conductive features having self-aligned edges
03/13/2007US7190018 Bi-directional read/program non-volatile floating gate memory cell with independent controllable control gates, and array thereof, and method of formation
03/13/2007US7190017 Semiconductor device and method of manufacturing the same
03/13/2007US7190015 Semiconductor device and method of manufacturing the same
03/13/2007US7190013 ISFET using PbTiO3 as sensing film
03/13/2007US7190011 Semiconductor device and method for manufacturing same
03/13/2007US7190010 Semiconductor device
03/13/2007US7190008 Electro-optic displays, and components for use therein
03/13/2007US7190005 GaN LED with solderable backside metal
03/13/2007US7190003 Surface-mount type light emitting diode and method for manufacturing it
03/13/2007US7190002 Flip-chip nitride light emitting device and method of manufacturing thereof
03/13/2007US7190001 GaN based semiconductor light emitting device and method of making the same
03/13/2007US7190000 Thin film transistor array panel and manufacturing method thereof
03/13/2007US7189998 Thin film transistor array panel for a liquid crystal display
03/13/2007US7189997 Semiconductor device and method for manufacturing the same
03/13/2007US7189995 Organic electroluminescence display device and method for fabricating the same
03/13/2007US7189994 Semiconductor device and method for manufacturing the same
03/13/2007US7189993 Display device, method of production of the same, and projection type display device
03/13/2007US7189992 Transistor structures having a transparent channel
03/13/2007US7189987 Electrical detection of selected species
03/13/2007US7189979 Electron gun
03/13/2007US7189957 Methods to improve photonic performances of photo-sensitive integrated circuits
03/13/2007US7189946 Substrate heating device
03/13/2007US7189938 Process and system to package residual quantities of wafer level packages
03/13/2007US7189927 Electronic component with bump electrodes, and manufacturing method thereof
03/13/2007US7189783 Resist pattern thickening material, resist pattern and forming process thereof, and semiconductor device and manufacturing process thereof
03/13/2007US7189684 Polishing composition and method for forming wiring structure using the same
03/13/2007US7189672 Aluminum silicophosphate glasses
03/13/2007US7189665 Manufacturing method for crystalline semiconductor material and manufacturing method for semiconductor device
03/13/2007US7189664 Method for producing hydrogenated silicon-oxycarbide films
03/13/2007US7189663 Organic semiconductor device having an active dielectric layer comprising silsesquioxanes
03/13/2007US7189662 Methods of forming semiconductor constructions
03/13/2007US7189661 Method of forming silicon oxynitride layer in semiconductor device and apparatus of forming the same
03/13/2007US7189660 Method of producing insulator thin film, insulator thin film, method of manufacturing semiconductor device, and semiconductor device
03/13/2007US7189659 Method for fabricating a semiconductor device
03/13/2007US7189658 Strengthening the interface between dielectric layers and barrier layers with an oxide layer of varying composition profile
03/13/2007US7189657 Semiconductor substrate surface protection method
03/13/2007US7189656 Method for manufacturing ag-oxide-based electric contact material and product of the same
03/13/2007US7189655 Method of correcting amplitude defect in multilayer film of EUVL mask
03/13/2007US7189654 Manufacturing method for wiring
03/13/2007US7189653 Etching method and etching apparatus
03/13/2007US7189652 Selective oxidation of gate stack
03/13/2007US7189651 Stopper for chemical mechanical planarization, method for manufacturing same, and chemical mechanical planarization method
03/13/2007US7189650 Method and apparatus for copper film quality enhancement with two-step deposition
03/13/2007US7189649 Method of forming a material film
03/13/2007US7189648 Method for reducing the contact resistance of the connection regions of a semiconductor device
03/13/2007US7189647 Sequential station tool for wet processing of semiconductor wafers
03/13/2007US7189646 Method of enhancing the adhesion between photoresist layer and substrate and bumping process
03/13/2007US7189645 Adjusting value of first deposition time period and value of second deposition time period to optimize said percentage of via fills in semiconductor wafer
03/13/2007US7189644 CMOS device integration for low external resistance
03/13/2007US7189643 Semiconductor device and method of fabricating the same
03/13/2007US7189642 Methods of fabricating interconnects including depositing a first material in the interconnect with a thickness of angstroms and a low temperature for semiconductor components
03/13/2007US7189641 Methods of fabricating tungsten contacts with tungsten nitride barrier layers in semiconductor devices, tungsten contacts with tungsten nitride barrier layers
03/13/2007US7189640 Providing a substrate comprising a dielectric layer, forming a gap filler into each via hole; forming anti-reflective coating (ARC) films on the dielectric layer, forming a photoresist pattern, etching
03/13/2007US7189639 Use of germanium dioxide and/or alloys of GeO2 with silicon dioxide for semiconductor dielectric applications
03/13/2007US7189638 Method for manufacturing metal structure using trench
03/13/2007US7189637 Method of manufacturing a semiconductor device having a multi-layered wiring structure
03/13/2007US7189636 Fabrication method of semiconductor integrated circuit device
03/13/2007US7189635 Reduction of a feature dimension in a nano-scale device
03/13/2007US7189634 Edge intensive antifuse
03/13/2007US7189632 Multifunctional metallic bonding
03/13/2007US7189631 Semiconductor device and manufacturing method thereof
03/13/2007US7189630 Layer sequence for producing a composite material for electromechanical components
03/13/2007US7189629 Method for isolating semiconductor devices
03/13/2007US7189628 Fabrication of trenches with multiple depths on the same substrate
03/13/2007US7189627 Method to improve SRAM performance and stability
03/13/2007US7189626 Electroless plating of metal caps for chalcogenide-based memory devices
03/13/2007US7189625 Micromachine and manufacturing method
03/13/2007US7189624 Fabrication method for a semiconductor device including a semiconductor substrate formed with a shallow impurity region
03/13/2007US7189623 Semiconductor processing method and field effect transistor
03/13/2007US7189622 Method for fabricating semiconductor device
03/13/2007US7189621 Semiconductor device and method for fabricating the same
03/13/2007US7189620 Semiconductor device including a channel stop structure and method of manufacturing the same
03/13/2007US7189619 Process for manufacturing vertically insulated structural components on SOI material of various thickness
03/13/2007US7189618 Method of manufacturing a transistor of a semiconductor device
03/13/2007US7189617 Manufacturing method for a recessed channel array transistor and corresponding recessed channel array transistor
03/13/2007US7189616 Semiconductor memory device with trench-type stacked cell capacitors and method for manufacturing the same
03/13/2007US7189615 Single mask MIM capacitor and resistor with in trench copper drift barrier
03/13/2007US7189614 Method for fabricating a trench structure which is electrically connected to a substrate on one side via a buried contact
03/13/2007US7189613 Method and structure for metal-insulator-metal capacitor based memory device
03/13/2007US7189612 Ferroelectric memory and method for manufacturing the same
03/13/2007US7189611 Metal plating using seed film
03/13/2007US7189610 Semiconductor diode and method therefor
03/13/2007US7189608 Semiconductor device having reduced gate charge and reduced on resistance and method
03/13/2007US7189607 Formation of standard voltage threshold and low voltage threshold MOSFET devices
03/13/2007US7189606 Method of forming fully-depleted (FD) SOI MOSFET access transistor
03/13/2007US7189605 Method for fabricating semiconductor device
03/13/2007US7189604 Wiring material and a semiconductor device having a wiring using the material, and the manufacturing method thereof
03/13/2007US7189603 Thin film transistor substrate and its manufacture
03/13/2007US7189602 Method and apparatus for reducing substrate bias voltage drop
03/13/2007US7189601 System and method for forming mold caps over integrated circuit devices
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