Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2007
03/27/2007US7195990 Process for producing a photoelectric conversion device that includes using a gettering process
03/27/2007US7195989 Electrochemical fabrication methods using transfer plating of masks
03/27/2007US7195988 Semiconductor wafer and method of manufacturing a semiconductor device using a separation portion on a peripheral area of the semiconductor wafer
03/27/2007US7195987 Methods of forming CMOS integrated circuit devices and substrates having buried silicon germanium layers therein
03/27/2007US7195986 Microfluidic device with controlled substrate conductivity
03/27/2007US7195985 CMOS transistor junction regions formed by a CVD etching and deposition sequence
03/27/2007US7195984 Reduce 1/f noise in NPN transistors without degrading the properties of PNP transistors in integrated circuit technologies
03/27/2007US7195983 Programming, erasing, and reading structure for an NVM cell
03/27/2007US7195982 Method for manufacturing anti-punch through semiconductor device
03/27/2007US7195981 Method of forming an integrated circuit employable with a power converter
03/27/2007US7195980 Semiconductor device exhibiting a high breakdown voltage and the method of manufacturing the same
03/27/2007US7195979 Method of driving a dual gated MOSFET
03/27/2007US7195978 Method for the production of a memory cell, memory cell and memory cell arrangement
03/27/2007US7195977 Method for fabricating a semiconductor device
03/27/2007US7195976 Non-volatile semiconductor memory and method of making same, and semiconductor device and method of making device
03/27/2007US7195975 Method of forming bit line contact via
03/27/2007US7195974 Method of manufacturing ferroelectric film capacitor
03/27/2007US7195973 Method for fabricating a trench capacitor with an insulation collar and corresponding trench capacitor
03/27/2007US7195972 Trench capacitor DRAM cell using buried oxide as array top oxide
03/27/2007US7195971 Method of manufacturing an intralevel decoupling capacitor
03/27/2007US7195970 Metal-insulator-metal capacitors
03/27/2007US7195969 Strained channel CMOS device with fully silicided gate electrode
03/27/2007US7195968 Method of fabricating semiconductor device
03/27/2007US7195967 Nonvolatile semiconductor memory device and manufacturing method thereof
03/27/2007US7195966 Methods of fabricating semiconductor devices including polysilicon resistors and related devices
03/27/2007US7195965 Premature breakdown in submicron device geometries
03/27/2007US7195964 Fabrication of dielectric on a gate surface to insulate the gate from another element of an integrated circuit
03/27/2007US7195963 Method for making a semiconductor structure using silicon germanium
03/27/2007US7195962 Ultra short channel field effect transistor and method of fabricating the same
03/27/2007US7195961 SOI structure comprising substrate contacts on both sides of the box, and method for the production of such a structure
03/27/2007US7195960 Thin film transistor, manufacturing method thereof, and circuit and liquid crystal display device using the thin film transistor
03/27/2007US7195959 Thyristor-based semiconductor device and method of fabrication
03/27/2007US7195958 Methods of fabricating ESD protection structures
03/27/2007US7195957 Packaged microelectronic components
03/27/2007US7195956 Method for balancing molding flow during the assembly of semiconductor packages with defective carrying units
03/27/2007US7195955 Technique for protecting photonic devices in optoelectronic packages with clear overmolding
03/27/2007US7195954 Low capacitance coupling wire bonded semiconductor device
03/27/2007US7195953 Method of manufacturing a semiconductor package using a lead frame having through holes or hollows therein
03/27/2007US7195952 Schottky diode device with aluminum pickup of backside cathode
03/27/2007US7195951 Carbon-carbon and/or metal-carbon fiber composite heat spreaders
03/27/2007US7195950 Forming a plurality of thin-film devices
03/27/2007US7195948 Method for fabricating semiconductor device
03/27/2007US7195947 Photodiode with self-aligned implants for high quantum efficiency and method of formation
03/27/2007US7195946 Process for fabricating a semiconductor device having a suspended micro-system and resultant device
03/27/2007US7195945 Minimizing the effect of 1/ƒ noise with a MEMS flux concentrator
03/27/2007US7195944 Systems and methods for producing white-light emitting diodes
03/27/2007US7195943 Cold cathode field emission device and process for the production thereof, and cold cathode field emission display and process for the production thereof
03/27/2007US7195942 Radiation emitting semiconductor device
03/27/2007US7195941 Optical devices and methods to construct the same
03/27/2007US7195940 Methods for packaging image sensitive electronic devices
03/27/2007US7195939 Structure and method for electrical isolation of optoelectronic integrated circuits
03/27/2007US7195938 Activation effect on carbon nanotubes
03/27/2007US7195937 Method for measuring withstand voltage of semiconductor epitaxial wafer and semiconductor epitaxial wafer
03/27/2007US7195936 Thin film processing method and system
03/27/2007US7195935 Selective packaging of tested semiconductor devices
03/27/2007US7195934 Method and system for deposition tuning in an epitaxial film growth apparatus
03/27/2007US7195933 Semiconductor device having a measuring pattern and a method of measuring the semiconductor device using the measuring pattern
03/27/2007US7195932 Enhancement of grain structure for tungsten contracts
03/27/2007US7195931 Split manufacturing method for advanced semiconductor circuits
03/27/2007US7195930 Cleaning method for use in an apparatus for manufacturing a semiconductor device
03/27/2007US7195929 MRAM including unit cell formed of one transistor and two magnetic tunnel junctions (MTJs) and method for fabricating the same
03/27/2007US7195928 Method of manufacturing ferroelectric substance thin film and ferroelectric memory using the ferroelectric substance thin film
03/27/2007US7195927 Process for making magnetic memory structures having different-sized memory cell layers
03/27/2007US7195863 Development defect preventing process and material
03/27/2007US7195858 Negative type photosensitive resin composition containing a phenol-biphenylene resin
03/27/2007US7195856 Positive resist composition and pattern formation method using the same
03/27/2007US7195846 Methods of manufacturing photomask blank and photomask
03/27/2007US7195845 Spin-coating method, determination method for spin-coating condition and mask blank
03/27/2007US7195734 Device and method in connection with the production of structures
03/27/2007US7195715 Forming a first resist layer on one surface of a quartz substrate, exposing first resist layer to light of a first amount of exposure to form a patterned first masking layer, forming a second resist layer on the other surface of quartz substrate, exposing second resist layer, etching
03/27/2007US7195714 Method and device for producing a system having a component applied to a predetermined location of a surface of a substrate
03/27/2007US7195700 Method of electroplating copper layers with flat topography
03/27/2007US7195696 Anodes; shaping plate; liquid electrolytes; electrical contactors; electroplating
03/27/2007US7195693 Lateral temperature equalizing system for large area surfaces during processing
03/27/2007US7195687 Device transferring method, and device arraying method and image display unit fabricating method using the same
03/27/2007US7195682 Method and apparatus for determining processing size of bonding material
03/27/2007US7195679 Versatile system for wafer edge remediation
03/27/2007US7195673 Plasma CVD apparatus, and method for forming film and method for forming semiconductor device using the same
03/27/2007US7195548 Method and apparatus for post-CMP cleaning of a semiconductor work piece
03/27/2007US7195546 Polishing apparatus and method of polishing work piece
03/27/2007US7195545 Chamfered freestanding nitride semiconductor wafer and method of chamfering nitride semiconductor wafer
03/27/2007US7195544 CMP porous pad with component-filled pores
03/27/2007US7195541 Endpoint detection system for wafer polishing
03/27/2007US7195536 Integrated endpoint detection system with optical and eddy current monitoring
03/27/2007US7195503 Electrical contactor, especially wafer level contactor, using fluid pressure
03/27/2007US7195479 Hot liner insertion/removal fixture
03/27/2007US7195407 Method of controlling a lithographic processing cell, device manufacturing method, lithographic apparatus, track unit, lithographic processing, cell and computer program
03/27/2007US7195335 Liquid member ejecting device and method therefor, electro-optic device and manufacturing method therefor
03/27/2007US7195024 Chemical supply system
03/27/2007US7195022 Subjecting gallium chloride gas generated through the circulation of hydrogen chloride gas over metallic gallium to vapor phase deposition through the reaction with ammonia gas; moving exhaust gas through piping made of a grounded electroconductive corrosion-resistant material
03/27/2007US7194801 Thin-film battery having ultra-thin electrolyte and associated method
03/27/2007CA2464082C A ferroelectric or electret memory circuit
03/27/2007CA2425056C Digitally controlled impedance for i/o of an integrated circuit device
03/27/2007CA2381403C Method for manufacturing aluminum nitride sintered body in which via hole is made
03/27/2007CA2240162C Conductive element with lateral oxidation barrier
03/22/2007WO2007033337A2 Transistor formed with self-aligned contacts
03/22/2007WO2007033229A1 Capacitor structure
03/22/2007WO2007033045A2 Stacked mosfets
03/22/2007WO2007033019A1 Creating a dielectric layer using ald to deposit multiple components
03/22/2007WO2007033003A1 Atomic layer deposition with nitridation and oxidation