Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2007
03/22/2007US20070066058 Defectivity and process control of electroless deposition in microelectronics applications
03/22/2007US20070066057 Defectivity and process control of electroless deposition in microelectronics applications
03/22/2007US20070066056 Method of removing a photoresist and method of manufacturing a semiconductor device using the same
03/22/2007US20070066055 Method of fabricating conductive layer
03/22/2007US20070066054 Method of forming contact layers on substrates
03/22/2007US20070066053 Method for producing substrate having carbon-doped titanium oxide layer
03/22/2007US20070066052 Semiconductor device having three-dimensional construction and method for manufacturing the same
03/22/2007US20070066051 Method for forming gate pattern for electronic device
03/22/2007US20070066050 Semiconductor device and a method of manufacturing the same
03/22/2007US20070066049 Method for patterning and etching a passivation layer
03/22/2007US20070066048 Method for creating electrically conductive elements for semiconductor device structures using laser ablation processes and methods of fabricating semiconductor device assemblies
03/22/2007US20070066047 Method of forming opening and contact
03/22/2007US20070066046 Method of electrically connecting a microelectronic component
03/22/2007US20070066045 Method for manufacturing substrate with cavity
03/22/2007US20070066044 Semiconductor manufacturing method
03/22/2007US20070066043 Semiconductor device and fabrication process thereof
03/22/2007US20070066042 Method of forming an electrical contact
03/22/2007US20070066041 Fabricating method for a metal oxide semiconductor transistor
03/22/2007US20070066040 Microfeature workpieces and methods of forming a redistribution layer on microfeature workpieces
03/22/2007US20070066039 Methods of processing semiconductor wafers having silicon carbide power devices thereon
03/22/2007US20070066038 Fast gas switching plasma processing apparatus
03/22/2007US20070066037 Method of manufacturing nitride semicondctor device
03/22/2007US20070066036 Epitaxially coated silicon wafer and method for producing epitaxially coated silicon wafers
03/22/2007US20070066035 Cleaved silicon substrate active device
03/22/2007US20070066034 Semiconductor substrate with islands of diamond and resulting devices
03/22/2007US20070066033 Process for producing high-resistance silicon wafers and process for producing epitaxial wafers and soi wafers (as amended)
03/22/2007US20070066032 Nanopowder coating for scribing and structures formed thereby
03/22/2007US20070066031 Method of manufacturing semiconductor stucture
03/22/2007US20070066030 Method of manufacturing an isolation layer of a flash memory
03/22/2007US20070066029 Method for fabrication of semiconductor device
03/22/2007US20070066028 Method for creating narrow trenches in dielectric materials
03/22/2007US20070066027 Method of fabricating microphone device and thermal oxide layer and low-stress structural layer thereof
03/22/2007US20070066026 Method of preventing a peeling issue of a high stressed thin film
03/22/2007US20070066025 Pattern forming method, computer program thereof, and semiconductor device manufacturing method using the computer program
03/22/2007US20070066024 Phosphorus Activated NMOS Using SiC Process
03/22/2007US20070066023 Method to form a device on a soi substrate
03/22/2007US20070066022 Method of fabricating silicon nitride layer and method of fabricating semiconductor device
03/22/2007US20070066021 Formation of gate dielectrics with uniform nitrogen distribution
03/22/2007US20070066020 III-nitride current control device and method of manufacture
03/22/2007US20070066019 Surround gate access transistors with grown ultra-thin bodies
03/22/2007US20070066018 Methods of fabricating vertical channel field effect transistors having insulating layers thereon
03/22/2007US20070066017 Horizontal memory devices with vertical gates
03/22/2007US20070066016 Dynamic random access memory of semiconductor device and method for manufacturing the same
03/22/2007US20070066015 Capacitor, method of forming the same, semiconductor device having the capacitor and method of manufacturing the same
03/22/2007US20070066014 Nonvolatile memory device and method of fabricating the same
03/22/2007US20070066013 Method for fabricating semiconductor device
03/22/2007US20070066012 Semiconductor device and method for fabricating the same
03/22/2007US20070066011 Integrated circuitry production processes, methods, and systems
03/22/2007US20070066010 Method of manufacturing semiconductor device
03/22/2007US20070066009 Sidewall image transfer (sit) technologies
03/22/2007US20070066008 Method of fabricating non-volatile memory
03/22/2007US20070066007 Method to obtain fully silicided gate electrodes
03/22/2007US20070066006 Method and Structure for Electrostatic Discharge Protection of Photomasks
03/22/2007US20070066005 Semiconductor device and method of fabricating the same
03/22/2007US20070066004 Semiconductor device and its manufacture method
03/22/2007US20070066003 Methods of forming non-volatile memory devices having trenches
03/22/2007US20070066002 Source capacitor enhancement for improved dynamic IR drop prevention
03/22/2007US20070066001 Semiconductor device and manufacturing method thereof
03/22/2007US20070066000 Method of manufacturing a semiconductor device
03/22/2007US20070065999 Method for manufacturing semiconductor memory device using asymmetric junction ion implantation
03/22/2007US20070065998 Polysilicon thin film fabrication method
03/22/2007US20070065997 Fabricating method of an active-matrix organic electroluminescent display panel
03/22/2007US20070065996 Method for manufacturing a semiconductor device
03/22/2007US20070065995 Semiconductor device and method of manufacturing the same
03/22/2007US20070065994 Passivation Structure for Ferroelectric Thin-Film Devices
03/22/2007US20070065993 Fabricating method for flexible thin film transistor array substrate
03/22/2007US20070065992 Higher selectivity, method for passivating short circuit current paths in semiconductor devices
03/22/2007US20070065991 Thin film transistor array panel and method of manufacturing the same
03/22/2007US20070065990 Recursive spacer defined patterning
03/22/2007US20070065989 Method for manufacturing an adhesive substrate with a die-cavity sidewall
03/22/2007US20070065988 Method for manufacturing substrate with cavity
03/22/2007US20070065987 Stacked mass storage flash memory package
03/22/2007US20070065986 Method for manufacturing substrate with cavity
03/22/2007US20070065985 Bonding apparatus and method of bonding for a semiconductor chip
03/22/2007US20070065984 Thermal enhanced package for block mold assembly
03/22/2007US20070065983 Decoupling capacitor closely coupled with integrated circuit
03/22/2007US20070065982 Controlling overspray coating in semiconductor devices
03/22/2007US20070065981 Semiconductor system-in-package
03/22/2007US20070065980 Method of manufacturing semiconductor chip
03/22/2007US20070065979 Methods and systems for pack-size-oriented rounding
03/22/2007US20070065978 Method for manufacturing micro-machined switch using pull-up type contact pad
03/22/2007US20070065974 Method for producing a field effect semiconductor device
03/22/2007US20070065973 Pre-patterned thin film capacitor and method for embedding same in a package substrate
03/22/2007US20070065972 Image sensor and method of making same
03/22/2007US20070065971 Thin film transistor array substrate and fabricating method thereof
03/22/2007US20070065970 Method of fabricating a storage gate pixel design
03/22/2007US20070065969 CMOS image sensor and methods of manufacturing the same
03/22/2007US20070065968 Fabrication of silicon microphone
03/22/2007US20070065967 Micromachined structures using collimated DRIE
03/22/2007US20070065966 Process for single and multiple level metal-insulator-metal integration with a single mask
03/22/2007US20070065965 Manufacturing method and manufacturing apparatus for image display device
03/22/2007US20070065964 Integrated passive devices
03/22/2007US20070065963 Method of manufacturing a micro-mechanical element
03/22/2007US20070065962 Manufacturing of optoelectronic devices
03/22/2007US20070065961 Method of manufacturing amorphous NIO thin films and nonvolatile memory devices using the same
03/22/2007US20070065960 Method for producing a light emitting device
03/22/2007US20070065959 Method for manufacturing light-emitting diode
03/22/2007US20070065958 Method for attaching an optical filter to an encapsulated package
03/22/2007US20070065957 Method for manufacturing semiconductor device
03/22/2007US20070065956 Contact probe, measuring pad used for the contact probe, and method of manufacturing the contact probe
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