Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2007
03/14/2007CN1930664A Polishing agent and polishing method
03/14/2007CN1930663A Method of manufacturing a semiconductor device and semiconductor device obtained with such a method
03/14/2007CN1930662A Low temperature epitaxial growth of silicon-containing films using UV radiation
03/14/2007CN1930661A Methods for deposition of semiconductor material
03/14/2007CN1930660A Wireless substrate-like sensor
03/14/2007CN1930659A Wireless substrate-like sensor
03/14/2007CN1930658A Wireless substrate-like sensor
03/14/2007CN1930657A Work piece transfer system for an ion beam implanter
03/14/2007CN1930629A Printed magnetic ROM-MPROM
03/14/2007CN1930522A Positive light-sensitive resin composition, relief pattern using the same, and solid imaging element
03/14/2007CN1930520A Method for supporting mask manufacture, method for providing mask blank and mask blank dealing system
03/14/2007CN1930482A Probe and probe manufacturing method
03/14/2007CN1930318A Indium oxide/cerium oxide sputtering target, transparent conductive film and process for producing transparent conductive film
03/14/2007CN1930263A Resin composition and semiconductor devices made by using the same
03/14/2007CN1930262A Heat-peelable pressure-sensitive adhesive sheet and method of processing adhered with the heat-peelable pressure-sensitive adhesive sheet
03/14/2007CN1930261A Heat-peelable pressure-sensitive adhesive sheet and method for processing adhered using the heat-peelable pressure-sensitive adhesive sheet
03/14/2007CN1930194A Resist polymer, resist composition, process for pattern formation, and starting compounds for production of the resist polymer
03/14/2007CN1929978A Method for forming vertical crack on brittle board and vertical crack forming apparatus
03/14/2007CN1929948A Repair soldering head having a supply channel for a heat transfer medium and a return channel for said heat transfer medium, and the use thereof
03/14/2007CN1929930A Circulation type gas-dissolved water supply device and method of operating such device
03/14/2007CN1929927A Thin film of condensed polycyclc aromatic compound, and method for preparing thin film of condensed polycyclc aromatic compound
03/14/2007CN1929713A Electrode assembly and plasma processing apparatus
03/14/2007CN1929161A Electrically rewritable non-volatile memory element and method of manufacturing the same
03/14/2007CN1929154A Molecular beam epitaxy accretion method for indium arsenic/gallium arsenic quantum dots
03/14/2007CN1929151A Thin film transistor, semiconductor device, display, crystallization method, and method of manufacturing thin film transistor
03/14/2007CN1929150A High-voltage field-effect transistor and method of making a high-voltage field-effect transistor
03/14/2007CN1929149A Source contact and metal scheme for high density trench MOSFET
03/14/2007CN1929148A Bipolar junction transistor and method for manufacturing same
03/14/2007CN1929146A Solid-state imaging device and method of manufacturing same
03/14/2007CN1929145A CMOS image sensor and method of fabricating the same
03/14/2007CN1929144A Image sensor and its packaging method
03/14/2007CN1929143A Split gate type non-volatile memory device and method of manufacturing the same
03/14/2007CN1929142A Canal type capacitor and method for manufacturing same
03/14/2007CN1929133A Optical coupling element, method for producing the optical coupling element, and electronic device equipped with the optical coupling element
03/14/2007CN1929129A Stack type chip packaging structure, chip packaging body and manufacturing method
03/14/2007CN1929125A Fuse and method for disconnecting the fuse
03/14/2007CN1929124A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
03/14/2007CN1929123A Multilayered wiring substrate and method of manufacturing the same
03/14/2007CN1929122A 半导体封装及其制造方法 Semiconductor package and its manufacturing method
03/14/2007CN1929121A Mounting arrangement for semiconductor parts and method for manufacturing mounting substrate
03/14/2007CN1929120A Stack type chip packaging structure, chip packaging body and manufacturing method
03/14/2007CN1929119A Heat spreader module and method of manufacturing same
03/14/2007CN1929115A Semiconductor memory device and method for manufacturing the same
03/14/2007CN1929114A Manufacturing method for semiconductor memory
03/14/2007CN1929113A Method for forming memory cell and peripherial circuit
03/14/2007CN1929112A Self-aligned photodiode for CMOS image sensor and method of making
03/14/2007CN1929111A Method and associated equipment of forming a wire using the carbon nano-tube
03/14/2007CN1929110A Carbon nano tube/copper composite plating membrane and method for preparing electricity interconnecting line
03/14/2007CN1929109A Substrate positioning device and storing unit
03/14/2007CN1929108A Conveying chamber, substrate processing device, and substrate disorder detection method
03/14/2007CN1929107A Movable transfer chamber and substrate-treating apparatus including the same
03/14/2007CN1929106A Method for controlling parallelism between probe card and mounting table, inspection program, and inspection apparatus
03/14/2007CN1929105A Three-dimensional interconnection interpolator applied in system packaging and its producing method
03/14/2007CN1929104A Manufacturing method of electronic device
03/14/2007CN1929103A Producing process for digital camera module
03/14/2007CN1929102A Producing process for video sensing chip packaging and structure
03/14/2007CN1929101A Method for manufacturing thin film electricity crystal and method for changing non-crystal inlay to multi-crystal inlay or single-crystal inlay
03/14/2007CN1929100A Method for manufacturing thin film transistor, thin film transistor and picture element structure
03/14/2007CN1929099A Thin film transistor and method for manufacturing polycrystalline silicon layer of low-temperature polycrystalline silicon thin film transistor
03/14/2007CN1929098A Method for improving voltage distribution of component threshold value
03/14/2007CN1929097A Anisotropic conductive flame and flat panel display using the same, and method for manufacturing the same
03/14/2007CN1929096A 等离子体灰化方法 Plasma ashing method
03/14/2007CN1929095A Method for forming hatch
03/14/2007CN1929094A Method for reducing feature size and semi-conductor etching method
03/14/2007CN1929093A Projection producing process and its structure
03/14/2007CN1929092A Projection producing process and its structure
03/14/2007CN1929091A Preparation of ZnO base thin-magnetic semi-conductor film using electric-magnetic field restricted jigger coupling plasma sputtering sedimentation
03/14/2007CN1929090A Method of producing a nitride semiconductor device and nitride semiconductor device
03/14/2007CN1929089A Method for forming polycrystalline silicon thin film
03/14/2007CN1929088A Nitride semiconductor substrate, and method for working nitride semiconductor substrate
03/14/2007CN1929087A Appearance detection device
03/14/2007CN1929086A Method for manufacturing detecting magnetic field/pressure MOSFET on silicon SOI substrate
03/14/2007CN1929085A Wafer protection system for wafer cleaning device and wafer cleaning process
03/14/2007CN1929071A Method for making field transmitting triode
03/14/2007CN1928724A Photoresistance developer
03/14/2007CN1928723A Substrate processing system and method, certification program and computer-readable recording medium
03/14/2007CN1928722A Testing mark for detecting projection object lens image errors, mask and detection method
03/14/2007CN1928721A Moving phase grating mark and method for utilizing same in detecting image forming quality of photoetching machine
03/14/2007CN1928719A Application of polymers with polycyclic lipid structural unit in deep ultraviolet light-sensitive lacquer
03/14/2007CN1928683A Thin-film transistor array substrate and its making method
03/14/2007CN1928361A 泵环 Pump ring
03/14/2007CN1927977A Adhesive sheet and method of processing articles
03/14/2007CN1927975A Polishing slurry capable of removing polymer barrier layer
03/14/2007CN1927543A Abrasive member and method for the resurfacing of a lapping plate
03/14/2007CN1927540A Slice sticking method for hard brittle crystal thin substrate grinding and polishing
03/14/2007CN1927537A Cutting tool
03/14/2007CN1927520A 激光束加工机 Laser beam processing machine
03/14/2007CN1305360C Method and device for searching standard and method for detecting standard position
03/14/2007CN1305353C High-frequency power source and its control method, and plasma processor
03/14/2007CN1305193C Multi-beam semiconductor laser
03/14/2007CN1305181C Connecting component
03/14/2007CN1305140C Magnetic RAM and its data reading method
03/14/2007CN1305138C Semiconductor integrated circuit device
03/14/2007CN1305137C Semiconductor device
03/14/2007CN1305135C Semiconductor device and manufacture thereof, photoelectric device and electronic instrument
03/14/2007CN1305134C Semiconductor device with fuse and making method thereof
03/14/2007CN1305133C Semiconductor device and method of manufacturing the same
03/14/2007CN1305130C Non-volatile momery body and its operation method
03/14/2007CN1305129C Method for forming bottle type slot
03/14/2007CN1305128C Method for manufacturing photo semiconductor integrated circuit device
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