Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2007
03/15/2007US20070059742 Process of stripping a microarray for reuse
03/15/2007US20070059727 microtuble (MT) growth is initiated by contacting the immobilized MT nucleation complex with an MT growth composition comprising GTP, alpha and beta tubulin and a MT stabilizing agent; one or more MT capture complexes are attached to one or more substrates at one or more sites or to a nanoscale
03/15/2007US20070059651 Photolithography microelectronic fabrication; minimizing precipitation of developing reactant; involves rinsing polymer layer with an additional charge of developer fluid to minimize a sudden change in pH; and then rinsing said polymer layer with a rinse fluid of different chemistry than developer
03/15/2007US20070059648 Method for forming a capacitor
03/15/2007US20070059647 Capacitor for a semiconductor device
03/15/2007US20070059644 Micropattern formation material and method of micropattern formation
03/15/2007US20070059497 Reversal imprint technique
03/15/2007US20070059449 Plating method of metal film on the surface of polymer
03/15/2007US20070059447 Method of fabricating lanthanum oxide layer and method of fabricating MOSFET and capacitor using the same
03/15/2007US20070059151 Drum stand
03/15/2007US20070059150 Process for producing silicon wafer
03/15/2007US20070059145 System for transporting substrate carriers
03/15/2007US20070059131 Article transport facility
03/15/2007US20070059130 Method and apparatus to support a cleanspace fabricator
03/15/2007US20070059129 Movable transfer chamber and substrate-treating apparatus including the same
03/15/2007US20070059128 Batch deposition tool and compressed boat
03/15/2007US20070059127 Vacuum processing and transfer system
03/15/2007US20070058443 Method for operating an electrical writable and erasable memory cell and a memory device for electrical memories
03/15/2007US20070058433 Nonvolatile semiconductor memory having plural data storage portions for a bit line connected to memory cells
03/15/2007US20070058418 Semiconductor memory device having memory cells requiring no refresh operation
03/15/2007US20070058325 Gapped-plate capacitor
03/15/2007US20070058323 Electroactive polymers for lithography
03/15/2007US20070058147 Apparatus for and method of processing substrate subjected to exposure process
03/15/2007US20070058146 Exposure apparatus, exposure method, position control method, and method for producing device
03/15/2007US20070058145 Lithographic apparatus, programmable patterning structure, device manufacturing method, and device manufactured thereby
03/15/2007US20070058121 Liquid crystal display device and method of manufacturing the same
03/15/2007US20070058068 Solid state imaging device, manufacturing method of the same, and substrate for solid state imaging device
03/15/2007US20070057873 Pixel circuit, display unit, and pixel circuit drive method
03/15/2007US20070057624 Patterns of electrically conducting polymers and their application as electrodes or electrical contacts
03/15/2007US20070057383 Semiconductor chip having bond pads and multi-chip package
03/15/2007US20070057376 Semiconductor device and method for fabricating the same
03/15/2007US20070057374 Embedded barrier for dielectric encapsulation
03/15/2007US20070057369 Wiring board and method for manufacturing the same, and semiconductor device
03/15/2007US20070057367 Semiconductor chip having bond pads and multi-chip package
03/15/2007US20070057363 Multilayered wiring substrate and method of manufacturing the same
03/15/2007US20070057361 integrated circuit package and method of manufacture thereof
03/15/2007US20070057358 Multi-level semiconductor module
03/15/2007US20070057355 Method for forming buried cavities within a semiconductor body, and semiconductor body thus made
03/15/2007US20070057354 Multi-part lead frame with dissimilar materials
03/15/2007US20070057353 Multi-part lead frame with dissimilar materials
03/15/2007US20070057348 Microstructure and manufacturing method thereof
03/15/2007US20070057345 Resistance dividing circuit and manufacturing method thereof
03/15/2007US20070057342 Semiconductor fuse box and method for fabricating the same
03/15/2007US20070057334 Mosfet with high angle sidewall gate and contacts for reduced miller capacitance
03/15/2007US20070057333 MOS transistor and method of manufacturing the same
03/15/2007US20070057332 Thin film transistor and fabrication method thereof
03/15/2007US20070057329 Semiconductor device having a p-MOS transistor with source-drain extension counter-doping
03/15/2007US20070057328 Semiconductor device and its manufacture
03/15/2007US20070057325 Semiconductor FinFET structures with encapsulated gate electrodes and methods for forming such semiconductor FinFET structures
03/15/2007US20070057324 Strained semiconductor device and method of making the same
03/15/2007US20070057321 Semiconductor device
03/15/2007US20070057318 Semiconductor memory device and method of production
03/15/2007US20070057316 Semiconductor device and manufacturing method thereof
03/15/2007US20070057315 Nonvolatile semiconductor memory device having element isolating region of trench type
03/15/2007US20070057312 Transistor of semiconductor memory device and method for manufacturing the same
03/15/2007US20070057310 Nonvolatile semiconductor memory device having element isolating region of trench type
03/15/2007US20070057307 Embedded flash memory devices on SOI substrates and methods of manufacture thereof
03/15/2007US20070057303 Method For Forming Trench Capacitor and Memory Cell
03/15/2007US20070057302 Trench metal-insulator-metal (mim) capacitors integrated with middle-of-line metal contacts, and method of fabricating same
03/15/2007US20070057299 Systems and methods having a metal-semiconductor-metal (msm) photodetector with buried oxide layer
03/15/2007US20070057298 Pixel with strained silicon layer for improving carrier mobility and blue response in imagers
03/15/2007US20070057289 Power semiconductor device and method therefor
03/15/2007US20070057288 Methods of Fabricating Semiconductor Devices with Enlarged Recessed Gate Electrodes
03/15/2007US20070057285 Wurtzite thin film, laminate containing wurtzite crystalline layer and their manufacturing methods
03/15/2007US20070057284 Double-sided package for power module
03/15/2007US20070057276 Nitride semiconductor growth method, nitride semiconductor substrate, and nitride semiconductor device
03/15/2007US20070057275 Vertical light-emitting diode and method for manufacturing the same
03/15/2007US20070057273 Diode having vertical structure and method of manufacturing the same
03/15/2007US20070057269 Phosphor, semiconductor light emitting device, and fabrication method thereof
03/15/2007US20070057258 Display device and method for manufacturing the same
03/15/2007US20070057255 Nanomaterials with tetrazole-based removable stabilizing agents
03/15/2007US20070057253 Antireflective hard mask compositions
03/15/2007US20070057248 Superlattice nano-device and method for making same
03/15/2007US20070057245 Artificial band gap
03/15/2007US20070056930 Polysilicon etching methods
03/15/2007US20070056929 Plasma etching apparatus and plasma etching method
03/15/2007US20070056928 Plasma processing method and plasma processing device
03/15/2007US20070056927 Process and system for etching doped silicon
03/15/2007US20070056926 Process and system for etching doped silicon using SF6-based chemistry
03/15/2007US20070056925 Selective etch of films with high dielectric constant with H2 addition
03/15/2007US20070056846 Silicon dot forming method and silicon dot forming apparatus
03/15/2007US20070056834 Methods and apparatus for transporting substrate carriers
03/15/2007US20070056829 Break-away positioning conveyor mount for accommodating conveyor belt bends
03/15/2007US20070056677 coating microstructure optical electromechanical systems comprising indium phosphide or indium gallium arsenide with surface binders comprising calcium and hexane, then insertion into ceramic substrates and firing
03/15/2007US20070056608 Spindle chuck cleaner
03/15/2007US20070056513 System for situ photoresist thickness characterizaton
03/15/2007US20070056150 Apparatus and methods for preventing rotational slippage between a vertical shaft and a support structure for a semiconductor wafer holder
03/15/2007DE19839086B4 Rückhaltering für eine chemisch-mechanische Poliervorrichtung und chemisch-mechanische Poliervorrichtung damit Retaining ring for a chemical mechanical polishing apparatus, and chemical-mechanical polishing apparatus so that
03/15/2007DE19814115B4 Halbleiteranordnung und Verfahren zu deren Herstellung A semiconductor device and process for their preparation
03/15/2007DE19807012B4 Arrayförmige nichtflüchtige Speichereinrichtung und Verfahren zu ihrer Herstellung Array-shaped non-volatile storage device and process for their preparation
03/15/2007DE112005000863T5 Verfahren zur Hitzebehandlung eines Siliziumhalbleitersubstrats und durch dieses Verfahren behandeltes Silizumhalbleitersubstrat A method for heat treating a silicon semiconductor substrate and treated by this method Silizumhalbleitersubstrat
03/15/2007DE112005000854T5 Verfahren zum Herstellen eines Halbleiterelements mit einer High-K-Gate-Dielektrischen Schicht und einer Gateelektrode aus Metall A method of manufacturing a semiconductor device with a high-k gate dielectric layer and a gate electrode made of metal
03/15/2007DE10393858T5 Integrierte Schaltkreisstruktur mit verbesserter LDMOS-Gestaltung Integrated circuit structure having an improved design of LDMOS
03/15/2007DE10339487B4 Verfahren zum Aufbringen eines Halbleiterchips auf einen Träger A method of applying a semiconductor chip to a carrier
03/15/2007DE10328072B4 Verfahren zur Herstellung von Halbleiterbauelementen als Stacked-Mehrfach-Gatter Process for the preparation of semiconductor devices as stacked multi-gate
03/15/2007DE10302377B4 Verfahren zur Herstellung einer Halbleitervorrichtung mit Metall-Isolator-Metall-Kondensatoren A process for producing a semiconductor device with a metal-insulator-metal capacitors
03/15/2007DE10244077B4 Verfahren zur Herstellung von Halbleiterbauteilen mit Durchkontaktierung A process for the production of semiconductor components with through-hole plating
03/15/2007DE10239862B4 Trench-Transistorzelle, Transistoranordnung und Verfahren zur Herstellung einer Transistoranordnung Trench-transistor cell transistor arrangement and method of manufacturing a transistor device
03/15/2007DE102006041805A1 Polymere Polieraufschlämmung zur Barriereentfernung Polymers polishing slurry for barrier removal
03/15/2007DE102006041546A1 Nicht-flüchtiges Speicher-Bauteil vom Aufgespaltenes-Gate-Typ und Verfahren zu seiner Herstellung Non-volatile memory device from the delaminated gate type and method of manufacture