Patents
Patents for G01R 1 - Details of instruments or arrangements of the types covered by groups  or (27,269)
08/1999
08/24/1999US5940965 Method of making multiple lead voltage probe
08/19/1999WO1999041812A1 Ic socket
08/19/1999DE19831600C1 Pressure sensor groups intactness assessment method
08/18/1999EP0936468A1 Probe with retractable tip
08/17/1999US5940679 Method of checking electric circuits of semiconductor device and conductive adhesive for checking usage
08/17/1999US5940278 Backing plate for gate arrays or the like carries auxiliary components and provides probe access to electrical test points
08/17/1999US5939893 Contact probe arrangement for functional electrical testing
08/17/1999US5939892 Circuit board testing fixture
08/17/1999US5939890 Tweezer probe and arm therefor
08/17/1999US5939875 Universal probe interface
08/17/1999US5939711 Electro-optic voltage sensor head
08/12/1999DE19838586A1 Interchangeable oscilloscope probe tip with high-frequency cable-loss compensation network
08/11/1999CN1225724A Wafer-level burn-in and test
08/11/1999CN1044643C Testing apparatus
08/10/1999US5936876 Semiconductor integrated circuit core probing for failure analysis
08/10/1999US5936849 Text fixture retainer for an integrated circuit package
08/10/1999US5936845 IC package and IC probe card with organic substrate
08/10/1999US5936420 Semiconductor inspecting apparatus
08/10/1999US5936415 Method and apparatus for a pin-configurable integrated circuit tester board
08/10/1999US5936243 Conductive micro-probe and memory device
08/10/1999US5934914 Microelectronic contacts with asperities and methods of making same
08/05/1999WO1999039215A1 Multi-probe test head
08/05/1999CA2281932A1 Multi-probe test head
08/04/1999CN2331972Y Anti-theft instrument
08/04/1999CN1225230A Connection base
08/04/1999CN1224846A Contact-making apparatus affording ease of servicing
08/04/1999CN1044518C Printed circuit board test fixture and method
08/03/1999US5933309 Apparatus and method for monitoring the effects of contact resistance
08/03/1999US5933019 Circuit board testing switch
08/03/1999US5933018 Liquid crystal display panel inspection device and method for manufacturing same
08/03/1999US5933017 Prober interface card for shortening the settling time
08/03/1999US5932323 Method and apparatus for mounting, inspecting and adjusting probe card needles
08/03/1999US5931685 Interconnect for making temporary electrical connections with bumped semiconductor components
08/03/1999US5931311 Module handling apparatus and method with rapid switchover capability
08/03/1999US5931048 Manipulator for automatic test equipment test head
07/1999
07/29/1999WO1999038232A1 Small contactor for test probes, chip packaging and the like
07/28/1999CN1044405C Arrangement of circuit for processing of analogous current and voltage signals
07/27/1999US5929651 Semiconductor wafer test and burn-in
07/27/1999US5929649 Method and apparatus for electrical parasitic measurement of pin grid array
07/27/1999US5929647 Method and apparatus for testing semiconductor dice
07/27/1999US5929646 Interposer and module test card assembly
07/27/1999US5929643 Scanning probe microscope for measuring the electrical properties of the surface of an electrically conductive sample
07/27/1999US5929626 System for measuring low current with contact making and breaking device
07/27/1999US5928022 Mechanically-assited clip device for use in testing electrical equipment
07/27/1999US5926951 Method of stacking electronic components
07/22/1999WO1999037001A1 Ic socket and method for manufacturing ic
07/22/1999WO1999036790A2 Test probe interface unit and method of manufacturing the same
07/21/1999EP0929819A1 Membrane probing system with local contact scrub
07/21/1999CN2329970Y High-voltage prevention device for electric power meter
07/20/1999US5926029 Ultra fine probe contacts
07/20/1999US5926028 Probe card having separated upper and lower probe needle groups
07/20/1999US5926027 Apparatus and method for testing a device
07/20/1999US5926014 Magnetic shield for plastic molded electricity meter frames
07/15/1999WO1999035719A1 Connector
07/15/1999WO1999035715A1 Coaxial contact assembly apparatus
07/15/1999WO1999035547A2 Power contact for testing a power source
07/15/1999WO1999035505A2 Method for removing accumulated solder from probe card probing features
07/15/1999DE19836557A1 Holder for manipulator for modular integrated circuit for use in quality control testing
07/14/1999EP0928422A1 Grid array package test contactor
07/14/1999CN1222976A Reusable die carrier for burn-in and burn-in process
07/13/1999US5923181 Methods and apparatus for burn-in stressing and simultaneous testing of semiconductor device chips in a multichip module
07/13/1999US5923180 Compliant wafer prober docking adapter
07/13/1999US5923179 Thermal enhancing test/burn in socket for C4 and tab packaging
07/13/1999US5923178 Probe assembly and method for switchable multi-DUT testing of integrated circuit wafers
07/13/1999US5923177 Portable wedge probe for perusing signals on the pins of an IC
07/13/1999US5923176 Of a board-mounted integrated circuit chip
07/13/1999US5923175 Apparatus for contactless measurement of the electrical resistance of a conductor
07/13/1999US5921786 Flexible shielded laminated beam for electrical contacts and the like and method of contact operation
07/08/1999WO1999034228A1 Kelvin contact-type testing device
07/08/1999WO1999034227A1 Device and method for testing an electronic chip sensitive element
07/08/1999WO1999034225A1 Compound switching matrix for probing and interconnecting devices under test to measurement equipment
07/07/1999EP0707743B1 Lead frame including an inductor or other such magnetic component
07/06/1999US5920200 Apparatus and method for precise alignment of a ceramic module to a test apparatus
07/06/1999US5920196 Rapid low voltage testing apparatus
07/06/1999US5920188 Voltage measurement instrument having transient overvoltage input protection
07/01/1999WO1999033109A1 Bga connector with heat activated connection and disconnection means
07/01/1999WO1999032895A1 Apparatus and method for testing a device
06/1999
06/30/1999EP0925513A1 Wafer scale high density probe assembly, apparatus for use thereof and methods of fabrication thereof
06/30/1999EP0925510A1 Integrated compliant probe for wafer level test and burn-in
06/30/1999EP0925509A1 Probe structure having a plurality of discrete insulated probe tips
06/30/1999CN1221112A Test and burn-in apparatus in-line system using apparatus, and test method using the system
06/29/1999US5917707 Flexible contact structure with an electrically conductive shell
06/29/1999US5917401 Conductive bus member and method of fabricating same
06/29/1999US5917330 Probe ring having electrical components affixed thereto and related apparatus and processes
06/29/1999US5917318 High-speed responsive power supply for measuring equipment
06/29/1999US5917229 Programmable/reprogrammable printed circuit board using fuse and/or antifuse as interconnect
06/29/1999US5915977 System and interconnect for making temporary electrical connections with bumped semiconductor components
06/29/1999US5915755 Method for forming an interconnect for testing unpackaged semiconductor dice
06/29/1999US5915749 Method for mounting an integrated circuit device onto a printed circuit board
06/24/1999WO1999031586A1 Parallel test method
06/24/1999WO1999031518A1 Method and apparatus for guiding electric current
06/23/1999CN2325778Y Sampling probe mechanism of mechanical type single phase kilowatt-hour meter
06/22/1999US5914614 High density cantilevered probe for electronic devices
06/22/1999US5914613 Membrane probing system with local contact scrub
06/22/1999US5914612 Tweezer probe and arm therefor
06/22/1999US5914218 Spring contact anchored on one end, the free portion compliantly contacts a second contact pad, electrically interconnecting the two contact pads; spring compensates for thermal and mechanical variations
06/22/1999CA2148106C Printed circuit board testing device with foil adapter
06/17/1999WO1999030203A1 Electro-optic voltage sensor head
06/17/1999WO1999030175A1 An electrical contact assembly
06/17/1999WO1999030174A1 Test system with mechanical alignment for semiconductor chip scale packages and dice