Patents
Patents for G01R 1 - Details of instruments or arrangements of the types covered by groups  or (27,269)
01/2001
01/09/2001US6172505 Electronic battery tester
01/09/2001US6172497 High-frequency wave measurement substrate
01/09/2001US6170329 Test fixture customization adapter enclosure
01/09/2001US6170116 Abrasive member and cleaning device for probe needle for probe card
01/08/2001CA2314284A1 Mobile electric measuring device with detachable operating unit
01/04/2001WO2001000659A1 Benzimidazolone peptidomimetics as thrombin receptor antagonists
01/04/2001DE10030209A1 Test socket has IC holder with housing contg. contacts, each of which makes contact with IC connection points, apertures in housing and open to side that contacts test socket
01/02/2001US6169412 Adjustable tooling pin for a card test fixture
01/02/2001US6169411 Integrated circuit testing assembly and method
01/02/2001US6169410 Wafer probe with built in RF frequency conversion module
01/02/2001US6169409 Low-temperature wafer testing method and prober
01/02/2001US6169021 Method of making a metallized recess in a substrate
01/02/2001US6168449 Test sockets for integrated circuits
12/2000
12/28/2000WO2000079293A1 Probe device using superelastic probe elements
12/28/2000WO2000079290A1 Spatial and temporal scanning of ultrafast electric signals of a cantilever probe used for raster probe microscopy
12/28/2000WO2000079289A1 Wiring substrate for conductive contact unit
12/27/2000CN1278308A Method of making a structure with improved material properties by moderate heat treatment of a metal deposit
12/26/2000US6166845 Electro-optic probe
12/26/2000US6166556 Method for testing a semiconductor device and semiconductor device tested thereby
12/26/2000US6166554 Flexible electrical test fixture for integrated circuits on prototype and production printed circuit boards
12/26/2000US6165806 Fault isolation within an inner lead bond region of a μBGA (micro ball grid array) package for an integrated circuit die
12/26/2000US6164982 IC socket for holding IC having multiple parallel pins
12/21/2000DE10026280A1 Sonde für ein elektro-optisch abtastendes Oszilloskop A probe for electro-optically scanning oscilloscope
12/20/2000EP1061786A2 Socket for IC package
12/20/2000EP1061381A2 Method for optimizing probe card analysis and scrub mark analysis data
12/20/2000EP1061374A2 Active ground fault disconnect
12/20/2000EP1061373A2 Test fixture customization adapter enclosure
12/20/2000EP1060398A1 Coaxial probe interface for automatic test equipment
12/19/2000US6163162 Temperature compensated vertical pin probing device
12/19/2000US6163156 Electrical connection for electronic battery tester
12/19/2000US6163145 Transporting apparatus for semiconductor device
12/19/2000US6163090 Probe position actuator with an elongated stroke
12/19/2000US6162652 Process for sort testing C4 bumped wafers
12/19/2000US6162066 Socket for positioning and installing an integrated circuit chip on a flexible connector sheet
12/14/2000WO2000075677A1 Segmented contactor
12/14/2000DE19925802A1 Leakage current testing device in which the electrode mounting arrangement is improved to give a constant application force of the electrodes on the sample surface
12/13/2000EP1059538A2 Printed circuit board testing apparatus
12/13/2000CN1276530A Probe unit for inspection of base board for assemblying semiconductor chip
12/12/2000US6160415 Apparatus and method for setting zero point of Z-axis in a wafer probe station
12/12/2000US6160412 Impedance-matched interconnection device for connecting a vertical-pin integrated circuit probing device to integrated circuit test equipment
12/12/2000US6160409 Inspection method of conductive patterns
12/12/2000US6160408 Thin profile vertically oriented probe adapter with code disassembly capability
12/12/2000US6160404 Circuit for measuring the electrode current of a ceramic gas sensor
12/12/2000US6160252 Photoconductive element and method for measuring high frequency signals
12/12/2000US6159056 Electrical contact assembly for interconnecting test apparatus and the like
12/07/2000WO2000074110A2 Integrated circuit wafer probe card assembly
12/07/2000WO2000074108A2 An interface device
12/07/2000WO2000073905A2 Test interface for electronic circuits
12/07/2000DE19922082A1 Device for testing electronic functional capability of elements with various geometries uses a sliding contact device without depending on an element's geometry.
12/06/2000EP1058493A2 Socket for electrical parts
12/06/2000EP1057038A1 Method and device for testing printed circuit boards
12/06/2000EP1023743A4 Composite electrical contact structure and method for manufacturing the same
12/06/2000CN1275719A Probe adapter for spherical grid array component
12/05/2000US6156484 One photolithographic masking step in the fabrication of sculpted, uniformly shaped contacts using mask comprising different sized features, through which differing etch rates can be achieved; make array of electrical test probe contacts
12/05/2000US6156188 Using the main shaft of an electrodischarge machining machine to mount thereon a probe for effecting the drilling operation of a pcb board; upon completion of the drilling operation, the probe is severed and then fastened with the pcb board
11/2000
11/30/2000WO2000072339A1 Current sensor with two assembly positions
11/30/2000WO2000072026A1 Current, voltage or power detector
11/29/2000EP1055930A2 Printed circuit board testing apparatus and probe device for use in the same
11/29/2000CN1275204A Grinding chip
11/28/2000US6154863 Apparatus and method for testing non-componented printed circuit boards
11/28/2000US6154710 Method and apparatus for searching electromagnetic disturbing source and non-contact voltage probe apparatus therefor
11/28/2000US6154043 Method and apparatus for identifying the position of a selected semiconductor die relative to other dice formed from the same semiconductor wafer
11/28/2000US6154040 Apparatus for testing an electronic device
11/28/2000US6154023 Remote current sensor
11/28/2000US6152744 Integrated circuit test socket
11/23/2000WO2000070355A1 Component geometry-independent device for testing electronic components with movable contact means
11/23/2000WO2000039848A3 Test method and assembly including a test die for testing a semiconductor product die
11/22/2000CN1274518A Burn-in board with adaptable heat sink device
11/21/2000US6151063 Printed circuit board inspection apparatus and method
11/21/2000US6150992 Traceable self-contained programmable frequency source for performing alternate test site and open area test site comparisons
11/21/2000US6150833 LCD panel power-up test fixture and method of using
11/21/2000US6150830 Test head for microstructures with interface
11/21/2000US6150829 Three-dimensional programmable connector
11/21/2000US6150827 Automatic adjustment method for elimination of the centering error during the electrical test on printed circuit boards
11/21/2000US6150825 Electric circuit board tester
11/21/2000US6150616 Electroconductive contact unit system
11/21/2000US6150186 Method of making a product with improved material properties by moderate heat-treatment of a metal incorporating a dilute additive
11/16/2000WO2000068972A2 Method of creating an electrical interconnect device bearing an array of electrical contact pads
11/15/2000EP1051464A1 Ef
11/14/2000US6147505 Adapter arrangement for electrically testing printed circuit boards
11/14/2000US6147485 Universal test fixture for circuit packs
11/14/2000US6145191 Method for mounting and testing integrated circuits on printed circuit boards
11/09/2000WO2000067540A1 Chip carrier socket
11/09/2000DE10007434A1 Support module for a micro-ball grid array (BGA) device for testing semiconductor devices and solder connections, includes projections and elastic device to hold the module body and test container
11/08/2000CN2405224Y Measuring probe for coaxial radio-frequency signal
11/07/2000US6144559 Process for assembling an interposer to probe dense pad arrays
11/07/2000US6144212 Vertical needle type probe card, method of manufacturing thereof, method of replacing defective probe needle and test method of wafer using the probe card
11/02/2000EP1049199A2 Strain relief, pull-strength termination with controlled impedance for an electrical cable
11/02/2000DE10017074A1 Elektro-Optische Abtastsonde und ein Verfahren zur Einstellung derselben Electro-optic sampling probe and method for setting the same
10/2000
10/31/2000US6140905 Electrically conductive contact pin having a temperature fuse function
10/31/2000US6140830 Adapter system for component assembly circuit boards, for use in a test device
10/31/2000US6140827 Method and apparatus for testing bumped die
10/31/2000US6140812 Electronic instrument with multiple position spring detented handle
10/31/2000US6139403 Method and device for positioning and accessing a die under analysis
10/26/2000WO2000063708A1 Device for electrically contacting a floating semiconductor wafer having an insulating film
10/26/2000WO2000063706A1 Adapter base for receiving electronic test objects
10/26/2000DE10013986A1 Electro optic probe for electro-optic sampling oscilloscope, has voltage applied at metal pin to change polarization of pulsed light
10/26/2000DE10002099A1 Probe tip arrangement in dense pad array, has aggressor conductor located in close proximity to the access transmission line, where redefined capacitance is created between conductor and transmission line
10/26/2000DE10002098A1 System for testing dense connection area arrays has probe tip arrangement with connection area in array and probe tip resistance coupled to connection area and access transfer line
10/25/2000EP1046093A2 An improved power contact for testing a power delivery system